Micron Technology Incorporated

Kok Siak Tang

Md Zakir Ullah

David A Kewley

Adam L Olson

Xiaosong Zhang

Merri Lyn Carlson

Tien Minh Quan Tran

Chao Zhu

Mohammad Moydul Islam

Zhigang Yang

Hui Chin Chong

Indra V Chary

Matthew J King

Harsh Narendrakumar Jain

Kaiming Luo

Sarfraz Qureshi

Jessica Jing Wen Low

Microelectronic devices include a lower deck and an upper deck, each comprising a stack structure with a vertically alternating sequence of insulative structures and conductive structures arranged in tiers. First and second arrays of pillars extend through the stack structure of the lower and upper decks, respectively. In one or more of the first and second pillar arrays, at least some pillars exhibit a greater degree of bending away from a vertical orientation than at least some other pillars. The pillars of the first array align with the pillars of the second array along an interface between the lower and upper decks. Related methods are also disclosed.

Microelectronic devices with tiered decks of aligned pillars exhibiting bending and related methods

Microelectronic devices include a stack structure with a vertically alternating sequence of insulative structures and conductive structures arranged in tiers. A series of slit structures extends through the stack structure and divides the stack structure into a series of blocks. In a progressed portion of the series of blocks, each block comprises an array of pillars extending through the stack structure of the block. Also, each block&#x2014;in the progressed portion&#x2014;has a different block width than a block width of a neighboring block of the progressed portion of the series of blocks. At least one pillar, of the pillars of the array of pillars in the progressed portion, exhibits bending. Related methods and electronic systems are also disclosed.

Microelectronic devices with tiered blocks separated by progressively spaced slits, and related methods and systems

Microelectronic devices include a lower deck and an upper deck, each comprising a stack structure with a vertically alternating sequence of insulative structures and conductive structures arranged in tiers. A lower array of pillars extends through the stack structure of the lower deck, and an upper array of pillars extends through the stack structure of the upper deck. Along an interface between the lower deck and the upper deck, the pillars of the lower array align with the pillars of the upper array. At least at elevations comprising bases of the pillars, a pillar density of the pillars of the lower array differs from a pillar density of the pillars of the upper array, 'pillar density' being a number of pillars per unit of horizontal area of the respective array. Related methods and electronic systems are also disclosed.

Microelectronic devices with tiered decks of differing pillar density and related methods and systems

Growing community of inventors

Singapore, Singapore

Kok Siak Tang