Sensfab Pte Ltd

Kok Meng Ong

Bryan Keith Patmon

Kitt-Wai Kok

Kathirgamasundaram Sooriakumar

Kathirgamasunda Sooriakumar

A sensor for acoustic applications such as a silicone microphone is provided containing a backplate provided with apertures and a flexible diaphragm formed from a silicon on insulator (SOI) wafer which includes a layer of heavily doped silicon, a layer of silicon and an intermediate oxide layer that is connected to, and insulated from the backplate. The arrangement of the diaphragm in relation to the rest of the sensor and the sensor location, being mounted over the aperture in a PCB, reduces the acoustic signal pathway which allows the sensor to be both thinner and more importantly, enables there to be a greater back volume.

Ultra low pressure sensor

A silicon microphone comprising a backplate of electrically conductive or semi-conductive material comprising a rigid aperture area and a surrounding area, a diaphragm of electrically conductive or semi-conductive material comprising a flexible member that extends over the aperture area and a surrounding area that is at least partially connected to, and insulated from, the surrounding area of the backplate, the aperture area of the backplate and flexible member of the diaphragm forming two parallel plates of a capacitor spaced apart by a cavity, a bond pad formed on the surrounding area of the diaphragm, a bond pad formed on the surrounding area of the backplate, a channel formed in the diaphragm surrounding the bond pad formed on the surrounding area of the backplate, at least one air channel formed in the surrounding area of the diaphragm and open into the cavity between the flexible member and the aperture area of the backplate, and at least one vent through the surrounding area of the diaphragm connected to each air channel.

Growing community of inventors

Singapore, Singapore

Kok Meng Ong