Utac Headquarters Pte. Ltd.

Kok Chuen Lock

Saravuth Sirinorakul

Roel Adeva Robles

Il Kwon Shim

Wing Keung Lam

Eakkasit Dumsong

The present disclosure is directed to improving EMI shielding to provide more reliable semiconductor packages. The semiconductor package may be, for example, a lead frame including one or multiple dies attached thereto. The semiconductor package may include only wire bonds or a combination of clip bonds and wire bonds. An integrated shielding structure may be disposed in between the package substrate and the encapsulant to shield internal and/or external EMI. For example, a top surface of the integrated shield structure is exposed.

Semiconductor packages with integrated shielding

An embodiment related to a stacked package is disclosed. The stacked package includes a conductive gang with gang legs electrically coupling a second component stacked over a first die to a package substrate. The first die is mounted over a die attach region of the package substrate and electrically coupled to the package substrate.

Growing community of inventors

Dongguan, China

Kok Chuen Lock