Shibaura Mechatronics Corporation

Koji Yoshimura

Shohei Tanabe

Hisashi Nishigaki

Ryo Matsuhashi

According to one embodiment, a film formation apparatus that suppresses effects of pre-processing and enables stable film formation is provided. A film formation apparatus of the present disclosure includes a chamber that can be made vacuum, a transporter that is provided inside the chamber and that circulates and transports a workpiece in a trajectory of a circle, a film formation unit that forms film by sputtering on the workpiece circulated and transported by the transporter, a load-lock room that loads the workpiece into and out of the chamber relative to air space while keeping an interior of the chamber vacuum, and a pre-processing unit that is provided in the chamber at a position adjacent to the load-lock room and that performs pre-processing to the workpiece loaded in from the load-lock room in a state distant from the transporter.

Film formation apparatus

According to one embodiment, a film formation apparatus and a moisture removing method thereof that can facilitate the removement of moisture in the chamber without the complication of the apparatus are provided. The film formation apparatus according to the present embodiment includes the chamberwhich an interior thereof can be made vacuum, the exhausterthat exhausts the interior of the chamber, the carrierthat circularly carries the workpiece W by a rotation tableprovided inside the chamber, and the plurality of the plasma processorthat performs plasma processing on the workpiece W which is circularly carried, in which the plurality of the plasma processoreach has the processing spacesandto perform the plasma processing, at least one of the plurality of the plasma processoris the film formation processorthat performs film formation processing by sputtering on the workpiece W which is circularly carried, and at least one of the plurality of the plasma processoris the heaterthat removes moisture in the chamberby producing plasma and heating the interior of the chambervia the rotation tabletogether with exhaustion by the exhausterand rotation by the rotation tablein a condition the film formation process by the film formation processoris not performed.

Film formation apparatus and moisture removal method thereof

A film deposition apparatus reduces hillock formation while yielding uniform film thickness distribution. A film deposition apparatus of a present embodiment includes: a chamber; a rotary table that circulates and carries a workpiece W along a circumferential transfer path L; multiple targets that contain a film deposition material, and that are provided in positions at different radial distances from a center of rotation of the rotary table; a shield member that forms a film deposition chamber surrounding a region where the film deposition material scatters, and that has an opening on the side facing the circulated and carried workpiece; and a plasma generator that includes a sputter gas introduction unit for introducing a sputter gas into the film deposition chamber, and a power supply unit for applying power to the target, and that generates plasma in the sputter gas Gin the film deposition chamber.

Growing community of inventors

Yokohama, Japan

Koji Yoshimura