Tokyo Ohka Kogyo Co., Ltd.

Koji Yonemura

Hideo Hada

Kazufumi Sato

Yasushi Fujii

Makiko Irie

Daisuke Kawana

Tomotaka Yamada

Toshikazu Takayama

Takako Suzuki

Hisanobu Harada

Isamu Takagi

Ken Tanaka

Shoichi Fujita

A photosensitive resin composition which has a quenching function and satisfactory long-term stability and which, in particular, can be prevented from suffering sensitivity abnormality caused by change with time during storage (change from given sensitivity); and a method of forming a pattern from the composition. The resist composition contains a base resin comprising, as the main component, a silicon-containing polymer which is a siloxane or silsesquioxane polymer or the like, the composition containing, as a quencher, a specific sulfonium compound in place of a nitrogenous compound.

Photosensitive resin composition and method of forming pattern

A positive resist composition, including a resin component (A) which exhibits increased solubility in an alkali developing solution under action of an acid, and an acid generator component (B) which generates an acid upon exposure, wherein the component (A) includes a structural unit (a1) derived from a hydroxystyrene, and a structural unit (a2) containing an acid dissociable, dissolution inhibiting group; and the component (B) includes an acid generator (B1) composed of a compound represented by the general formula (b1) shown below:[Chemical Formula 1]X-Q-Y&#x2014;SOA&#x2003;&#x2003;(b1)(in the formula, Qrepresents a bivalent linking group containing an oxygen atom; Yrepresents an alkylene group of 1 to 4 carbon atoms which may contain a substituent or a fluorinated alkylene group of 1 to 4 carbon atoms which may contain a substituent; X represents a hydrocarbon group of 3 to 30 carbon atoms which may contain a substituent; and Arepresents an organic cation).

Positive resist composition and method of forming resist pattern

A positive resist composition for a thin-film implantation process of the present invention includes: a resin component (A) with an acid-dissociable dissolution inhibiting group, whose alkali solubility increases by the action of an acid; an acid generator component (B) which generates an acid by irradiation with radiation; and a compound (C) having a radiation absorbing ability, wherein said resin component (A) comprises a structural unit (a1) derived from a hydroxystyrene and a structural unit (a2) obtained by substituting the hydrogen atom in a hydroxyl group of said structural unit (a1) with an acid-dissociable dissolution inhibiting group, and said acid-dissociable dissolution inhibiting group contains an acid-dissociable dissolution inhibiting group (II) represented by the following general formula (II) as a main component. 

Positive resist composition for thin-film implantation process and method for forming resist pattern

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Kawasaki, Japan

Koji Yonemura