Nitta Corporation

Senju Metal Industry Co., Ltd.

Koji Yamashita

Shinichiro Kawahara

Satoshi Yamaguchi

Takumi Kato

Takashi Megumi

Kosuke Marutani

Kaichi Tsuruta

Manabu Muraoka

Hiroki Oshima

Takeo Saitoh

Minoru Nanchi

Ayumi Nagao

Hikaru Ito

A light shielding member of the present invention includes a first polarizing plate, a second polarizing plate facing the first polarizing plate, and a thermosensitive sheet interposed between the first polarizing plate and the second polarizing plate, in which the first polarizing plate and the second polarizing plate are positioned so that their respective transmission axes are different from each other, and the thermosensitive sheet contains a side chain crystal polymer that crystallizes at a temperature lower than the melting point and exhibits fluidity at a temperature of the melting point or higher. The light shielding member may transmit light at a temperature lower than the melting point and may not transmit light at a temperature of the melting point or higher, when light travels from one of the first polarizing plate and the second polarizing plate toward the other.

Light shielding member

Thermosensitive fine particles of the present invention include a side chain crystal polymer which is crystallized at a temperature lower than a melting point and which exhibits fluidity at a temperature equal to or more than the melting point. The side chain crystal polymer may include, as a monomer component, a (meth)acrylate having a straight-chain alkyl group having 14 or more carbon atoms. A mean particle diameter of the fine particles may be 0.1 to 50 μm. The thermosensitive fine particles may include no organic solvents.

Thermosensitive fine particles

Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheetA includes a base material, an adhesive layerformed on the surface of the base material, a solder powder-containing adhesive layerformed on the surface of the adhesive layer, and a solder powder layerformed on the surface of the solder powder-containing adhesive layer. In the solder powder layer, particles of solder powderare arranged in a one-layer sheet form. In the solder powder-containing adhesive layer, solder powderand an adhesive componentare mixed so as to have such a thickness that two or more layers of the solder powderare stacked.

Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet

A thermosensitive adhesive contains a side chain crystal polymer having a melting point of 20-30&#xb0; C., and a tackifier. The side chain crystal polymer is obtainable by adding a metal chelate compound in the following amount of addition (A) into the following copolymer, followed by a crosslinking reaction. Adhesive strength is to be deteriorated at a temperature below the melting point. The copolymer is obtainable by polymerizing 25-30 parts by weight of (meth)acrylate having a straight-chain alkyl group having 16 to 22 carbon atoms, 60-65 parts by weight of (meth)acrylate having an alkyl group having 1 to 6 carbon atoms, 1-10 parts by weight of a polar monomer, and 1-10 parts by weight of a reactive fluorine compound. The amount of addition (A) is 3-10 parts by weight with respect to 100 parts by weight of a copolymer.

Thermosensitive adhesive

Growing community of inventors

Nara, Japan

Koji Yamashita