Rohm Co., Ltd.

Panasonic Intellectual Property Corporation of America

Omron Tateisi Electronics Co.

Matsushita Electric Industrial Co., Ltd.

Omron Corporation

Kyoto University

Allied Telesis Holdings K.k.

Kabushiki Kaisha Yushin Seiki

Kabushiki Kaisha Toshiba

Panasonic Corporation

Allied Telesis Hildings K.k.

Yoshin Precision Equipment Co., Ltd.

Koji Yamamoto

Junichi Hikita

Nobuhisa Kumamoto

Masahiro Morikura

Takayuki Nishio

Ayako Horiuchi

Isamu Nishimura

Yoshikazu Nakagawa

Takahide Yamaguchi

Takuji Suzaki

Muneyuki Matsumoto

Fumio Onuma

Masahiro Hanafusa

Tomoyuki Sugihara

Tomohiko Mimura

Michio Nishimura

Akihiko Nishio

Seigo Nakao

Takashi Tamura

Toshihisa Nabetani

Takeshi Uemura

Tsuguhide Aoki

Toshihiko Ichinose

Junichi Yukawa

Masahiro Saito

Tomoyuki Nishida

Shinichi Hirako

Kyoji Kitamura

Motoki Ogata

Yoshihiro Nakatsuji

Noriyasu Katoh

Kunio Kaede

Satoko Nakajima

Ryo Toyota

Shotaro Kamiya

There is provided an information processing system including a relative-position estimation processing unit configured to estimate a relative position between an access point and a wireless client by using a cooperative position estimation method using distance information based on a signal strength between the access point and the wireless client; and an inside/outside determination processing unit configured to determine an inside/outside positional relationship between a polygonal target area formed by access points and the wireless client, in which the inside/outside determination processing unit determines whether the wireless client is present inside or outside the target area by determining a direction of vector product of the access points forming a side of the target area and a direction of vector product of the wireless client and the access point as a vertex of the polygonal area.

Information processing system

In this device: a gain calculator () uses a function in which the variable is a first resource amount from among the resource amounts possessed by an operator in question, and calculates a second resource amount at which the maximum gain is reached in the function of the operator to which the device in question belongs, the first resource amount being a resource amount allocated to a terminal belonging to another operator; a transmitter/receiver () transmits the second resource amount to the manager (), and receives, from the manager (), the minimum value among second resource amounts calculated in each of the operators; and the allocation unit () allocates resources to the signal of the terminal belonging to the operator in question and to the terminal belonging to the other operator on the basis of the minimum value among the second resource amounts calculated by each of the operators.

Resource allocation method for shared base station

According to one embodiment, a wireless communication device includes: a communicator and controlling circuitry. The communicator is configured to simultaneously communicate a first frame and a second frame, and after the first frame and the second frame are communicated, communicate a third frame indicating acknowledgement of the first frame and a fourth frame indicating acknowledgement of the second frame. The controlling circuitry is configured to control to prevent the third frame and the fourth frame from being simultaneously communicated.

Wireless communication device

To save power consumed due to reception of frames destined to other communication devices and enable power saving by prolonging a sleep state. A communication device is provided including a communication unit which communicates with a base station, a switching unit which switches an operation mode of the communication unit from a normal mode for communicating with the base station to a power saving mode for uncommunicating with the base station, when the communication unit receives data from the base station in a state in which the communication unit does not transmit a data transmission request to the base station, and a determination unit which determines a duration time of the power saving mode, based on a data length of the data received.

Communication control method and communication device for enabling power saving

There is provided a wireless communication control device and a wireless communication control method, which control the transmission power of radio waves of base stations appropriately to reduce interference between cells. The wireless communication control method according to the present invention is a method of controlling plural base stations in a wireless communication system in which the plural base stations cover a target area with radio waves of a first radio wave strength or more, the method causing a computer to execute: a step of acquiring a relative positional relationship of the plural base stations; a step of identifying a base station, located in the neighborhood of the boundary of the target area, from the relative positional relationship of the plural base stations; and a step of lowering the transmission power of radio waves of a base station other than the identified base station among the plural base stations.

Wireless communication control device and wireless communication control method

A metal insert-molded article having sealing ability, a method for producing the same, and an electronic component having the metal insert-molded article, the metal insert-molded article comprising: a molding material and a metal material integrally molded together by insert molding, wherein the molding material comprises a crystalline thermoplastic resin as a main component, and comprises an inorganic filler in an amount inclusive of 0% by weight to 15% by weight, and the metal material has an aspect ratio inclusive of 1 to 10 in a cross section perpendicular to a lengthwise dimension of the metal insert-molded article, and is not surface treated for adhesion with the molding material.

Metal insert-molded article, a method for producing the same, and an electronic component

A relay station to which network sharing is applied, wherein it is possible to appropriately allocate between multiple operators a shared band frequency shared by the multiple operators, and to improve the frequency use efficiency. In a relay station (), a band frequency allocation determination unit () determines the bandwidth for each operator within a shared band frequency, which is shared by multiple operators and used between the relay station () and a mobile station, on the basis of the quality of a first line between the relay station () and the base stations of the operators and on the basis of the status of a second line between the relay station () and the mobile stations of the operators. A signal generation unit () allocates the signal of the operators to a resource on the basis of the bandwidth for each operator in the shared band frequency.

Relay station, base station, and band frequency allocation method

A base station apparatus, when performing the transmission controls of pico base stations, can perform an appropriate transmission control for each pico base station, while suppressing the increase of the amount of feedback information from a macro terminal to a macro base station and also suppressing the increase of the amount of transmission control information from the macro base station to the pico base station. In this apparatus, a transmission control unit () updates, on the basis of the control information, the priority level of each of a plurality of different correspondences in which the respective ones of transmission control guidelines are associated with the respective ones of a plurality of control information history patterns, and controls the transmissions on the basis of the control guidelines determined from the control information histories and the correspondences each having a respective higher priority level.

Base station apparatus and transmission control method

A high frequency heating apparatus of the present invention includes an inverter power supply for driving the high frequency generating device, a holding member for holding the inverter power supply and cooling fan for cooling down the inverter power supply. The holding member is provided with a holding portion for holding the inverter power supply and an air guide portion for guiding cooling air from the cooling fan toward the inverter power supply, and the air guide portion covers the inverter power supply and guides the cooling air in a manner that a semiconductor switching device and a high voltage transformer of the inverter power supply are primarily cooled down.

High frequency heating apparatus

A semiconductor device including a first semiconductor chip, a second semiconductor chip bonded to the first semiconductor chip in a stacked relation, and a registration structure which causes the first and second semiconductor chips to be positioned with respect to each other by depression-projection engagement therebetween. The registration structure includes, for example, a registration recess provided on a surface of the first semiconductor chip, and a registration projection provided on a surface of the second semiconductor chip for engagement with the registration recess. The registration projection may be a spherical member provided on the surface of the second semiconductor chip.

Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface

A heating apparatus includes an inverter power supply for driving the high frequency generating device, a holding member for holding the inverter power supply and cooling fan for cooling down the inverter power supply. The holding member is provided with a holding portion for holding the inverter power supply and an air guide portion for guiding cooling air from the cooling fan toward the inverter power supply, and the air guide portion covers the inverter power supply and guides the cooling air in a manner that a semiconductor switching device and a high voltage transformer of the inverter power supply are primarily cooled down.

A semiconductor device includes an insulating film. On this insulating film are formed an interconnection trench communicating with a semiconductor element and a pad trench communicating with the interconnection trench. In the pad trench, a protrusion is formed by leaving one part of the insulating film. A conductive film is formed over the insulating film including the interconnection and pad trenches. Thereafter, the conductive film is removed by a CMP process. At this time, the protrusion serves to prevent the conductive film in the pad trench from being over-polished.

Damascene interconnection and semiconductor device

Semiconductor device of chip-on-chip structure

A semiconductor device includes an insulating film. On this insulating film, are formed an interconnection trench communicating with a semiconductor element and a pad trench communicating with the interconnection trench. In the pad trench, a protrusion is formed by leaving one part of the insulating film. A conductive film is formed over the insulating film including the interconnection and pad trenches. Thereafter, the conductive film is removed by a CMP process. At this time, the protrusion serves to prevent the conductive film in the pad trench from being over-polished.

A semiconductor chip () to be positioned with a front face thereof downward for formation of a chip-on-chip structure has electrode marks () provided on a back face () thereof. The electrode marks () are respectively provided in association with a plurality of electrodes () provided on the front face () of the semiconductor chip in the same arrangement as the arrangement of the electrodes (). The arrangement of the electrode marks () represents the arrangement of the electrodes () on the front face () when viewed from the side of the back face () of the semiconductor chip. Therefore, the semiconductor chip () can easily be positioned with the front face downward on the basis of the electrode marks ().

Semiconductor chip, chip-on-chip structure device, and assembling method thereof

Growing community of inventors

Kyoto, Japan

Koji Yamamoto