Hitachi, Ltd.

Mitsubishi Heavy Industries Limited

Kawasaki Jukogyo Kabushiki Kaisha

Senju Metal Industry Co., Ltd.

Bando Chemical Industries, Inc.

Nec Corporation

Microsoft Technology Licensing, LLC

Renesas Electronics Corporation

Renesas Technology Corp.

Nec Electronics Corporation

Disco Corporation

Fujitsu Component Limited

Mitsubishi Hitachi Power Systems, Ltd.

Eagle Industry Co., Ltd.

Prime Planet Energy & Solutions, Inc.

Koji Watanabe

Yosuke Takahashi

Kiyoshi Suenaga

Tatsuhiko Goi

Kenichiro Tanaka

Yasuoki Tomita

Kenichi Nakashima

Mikio Kuwahara

Kenzaburo Fujishima

Toru Tatsumi

Katsuhiko Tsunehara

Kiyoshi Takeuchi

Kazuhiro Maeda

Koichi Takeda

Shinya Hashimoto

Sadahiro Sugimoto

Hiroaki Kobayashi

Masahiro Nomura

Masamitsu Kuwabara

Kazuharu Hirokawa

Peng Yang

Hiroto Nakagawa

Hitoshi Wakabayashi

Isao Fujii

Naruhito Nakahara

Atsushi Ogura

Yi Zhang

Hideo Miyazawa

Hideki Nakamura

Isamu Sato

Osamu Daikuhara

Kenta Shiga

Shigenori Harada

Yoshiaki Yodo

Tomoaki Ishifuji

Tadashi Takeuchi

Tatsuo Ishiguro

Atsushi Kaneko

Ichiro Yamamoto

Masashi Yano

Shunsaku Yoshikawa

Minoru Okada

Hideya Yoshiuchi

Atsushi Ogino

Yasuyuki Nagasoe

Shinichi Nomoto

Tsukasa Ohnishi

Daisuke Yokota

Junichiro Masada

Hideya Suzuki

Morihito Miyagi

Takashi Sakaguchi

Yasuo Ikeda

Kazuyoshi Tani

Yoshitaka Kurose

Takumi Sugiura

Yasuhiro Kashirajima

Yoshichika Sato

Hiroshige Kikuchi

Norihisa Matsumoto

Hideaki Takahashi

Masayasu Tanaka

Koichi Terashima

Hitomi Nakamura

Hui Deng

Masaaki Matsuura

Yoshio Fukui

Yuanchen Ma

Masahito Kataoka

Shigeharu Yamagami

Norihiko Nagai

Kenta Nakamura

Eiji Akita

Jinyan Zhao

Nobuyuki Ikarashi

Kouichi Akagi

Kazushige Sugimoto

Toshiya Seki

Rintaro Chikami

Ichiro Fukue

Makoto Kanda

Tohru Mogami

Koji Akiyama

Mitsuru Inada

Minoru Toyoda

Mitsuhiro Togo

Yoshie Yamanaka

Hiroki Oshima

Jun Kubota

Haruhiko Ono

Kazutoshi Shiba

Noboru Shimizu

Naoto Kameda

Yuichiro Katsu

Kenichiro Takeishi

Shin Koyama

Yasutaka Morinaga

Osamu Ueda

Kota Kikuchi

Seiko Ishibashi

A blade ring assembly including: a turbine blade ring extending in a circumferential direction about an axis; a component to be cooled, disposed on an inner circumferential side of the turbine blade ring; and an outer circumferential side component disposed on an outer circumferential side of the turbine blade ring. The turbine blade ring has a cooling medium intake port leading from an outer circumferential surface to an inner circumferential surface of the turbine blade ring. The outer circumferential side component includes: a first wall portion which covers at least a portion of the cooling medium intake port from the outer circumferential side of the turbine blade ring; and a second wall portion which extends from an end portion of the first wall portion on the axially downstream thereof toward the outer circumferential side of the turbine blade ring.

Blade ring assembly, gas turbine, and method for refurbishing gas turbine

A photocurable resin composition includes: a first reactive compound that forms a glass phase through curing; a second reactive compound that is compatible with the first reactive compound and forms a rubber phase through curing; and a photopolymerization initiator. The first reactive compound includes at least a reactive monomer, and the second reactive compound includes at least a reactive oligomer. A polar term dPof Hansen Solubility Parameter of the first reactive compound and a polar term dPof Hansen Solubility Parameter of the second reactive compound differ by 1.8 or more.

Photocurable resin composition and resin cured product

A photocurable resin composition includes a reactive monomer, a reactive oligomer, and a photopolymerization initiator. A cured product of the reactive monomer has a glass transition point of less than 20° C., and a cured product of the reactive oligomer has a glass transition point of less than 20° C. A cured product of the photocurable resin composition has a loss tangent tan δ at 25° C. of 0.2 or less. The cured product of the photocurable resin composition has an elongation at break in accordance with ASTM D638 of 150% or more.

Photocurable resin composition and 3D stereolithography product using same

A stacked wafer processing method for processing one wafer of a stacked wafer having at least two layers laminated, includes a sheet laying step of laying a thermocompression bonding sheet on an upper face of the one wafer, a thermocompression bonding step of thermocompression-bonding the thermocompression bonding sheet to an outer peripheral portion of the one wafer where a chamfered portion is formed, a modified layer forming step of irradiating the stacked wafer with a laser beam having a transmission wavelength to the thermocompression bonding sheet and the one wafer from the thermocompression bonding sheet side with a focal point of the laser beam positioned inside the outer peripheral portion of the one wafer, thereby continuously forming a modified layer inside the one wafer, and a chamfered portion removing step of expanding the thermocompression bonding sheet to break the chamfered portion, thereby removing the chamfered portion from the one wafer.

Stacked wafer processing method

A nanometal ink capable of forming a metal film that exhibits good adhesion to a substrate and has low resistance. The nanometal ink is a baking-type nanometal ink, and contains metal nanoparticles, a polymerizable compound, a polymerization reaction initiator, a volatile liquid medium, and a dispersant. The polymerization reaction initiator is to be activated by the action of heat and/or light, to allow polymerization of the polymerizable compound to proceed. The dispersant includes a Calkylamine.

Nano-metal ink and process for producing metal film using same

A controller of a toroidal continuously variable transmission comprises a position control unit which outputs a driving signal to a hydraulic actuator to control a roller position. The hydraulic actuator includes a biasing mechanism which forcibly keeps the roller position at a predetermined position in a case where the driving signal meets a predetermined condition. The position control unit is configured to perform a start-up control during start-up of the toroidal continuously variable transmission. During the start-up control, the position control unit is configured to output the driving signal to reciprocate a spool of the hydraulic actuator in a case where a temperature of hydraulic oil supplied to the hydraulic actuator is lower than a reference temperature, and output the driving signal which meets the predetermined condition in a case where the temperature of the hydraulic oil has become equal to or higher than the reference temperature thereafter.

Controller of toroidal continuously variable transmission

A hot-dip plating apparatus for plating a thin molten solder film can control a film thickness of a molten solder on a base material evenly and in increments of a few &#x3bc;m and achieve a thin-film solder plating having a film thickness less than a conventional system. As shown in FIG., this apparatus comprises a solder bathof accommodating the molten solder; a second conveying sectionfor drawing up a strip memberfrom the solder bath; and a blower sectionfor blowing hot gas on the strip memberimmediately after being drawn up from the solder bath by a second conveying section; the hot gas having a predetermined flow volume and a predetermined temperature equal to or higher than a melting temperature of the molten solder. According to this configuration, the excess molten soldercan be trimmed from the strip membercorresponding to composition of the molten solder. Thus, the film thickness of the molten soldercoated on the strip membercan be controlled evenly and in increments of a few &#x3bc;m.

Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor

An electric power generating device () capable of suppressing an increase of a frontal surface area of an aircraft engine includes a transmission () connected with a rotary shaft () of the engine (E), an electric power generator () driven by an output of the transmission (), an input shaft () having a shaft axis extending in a direction crossing the rotary shaft () and connected with the rotary shaft (), and a transmitting mechanism () connected with the input shaft () to drive the transmission () about an axis extending in a direction perpendicular to the input shaft (). The transmission () and the electric power generator () are disposed spaced a distance from each other in a direction circumferentially of the rotary shaft ().

Generating device for aircraft

A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy contains Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. A heat sink and a package are soldered to each other through this connecting member by reflow heating in the presence of flux.

Lead-free solder alloy, connecting member and a method for its manufacture, and electronic part

To provide an aircraft engine in which an accessory can be directly supported with no accessory gearbox intervening to thereby suppress an increase in size thereof, the aircraft engine (E) includes a take-out shaft () having a first end portion, connected with an engine rotary shaft () and extending in a radially outward direction, and also having a second end portion connected with an accessory (), and a mounting pad () provided in an engine main body (EB) and to which the accessory () is fitted. The mounting pad () forms an outer perimeter of an opening () through which the take-out shaft () extends. The opening () is sealed by a covering (), through which the take-out shaft () extends, and a sealing member () to seal between the covering () and the take-out shaft ().

Sealing arrangement of accessory to aircraft engine

When soldering a package having an electrode on which Ni/Au or Ag&#x2014;Pd alloy is plated, to a printed circuit board having a Cu electrode or an electrode on which Cu is plated, a solid-phase diffusion layer is formed within a layered solder material for bonding different species of electrodes. The layered solder material is composed of a solder material of Sn&#x2014;Ag&#x2014;Cu series or Sn&#x2014;Sb series and a solder material of Sn&#x2014;Ag&#x2014;Cu&#x2014;Ni series or Sn&#x2014;Pb series. The electrode on which Ni/Au or Ag&#x2014;Pd alloy is plated and the Cu electrode or the electrode on which Cu is plated are soldered with the solder material of Sn&#x2014;Ag&#x2014;Cu series or Sn&#x2014;Sb series being attached to the Cu electrode and the solder material of Sn&#x2014;Ag&#x2014;Cu&#x2014;Ni series or Sn&#x2014;Cu series being attached to the electrode on which Ni/Au or Ag&#x2014;Pd alloy is plated. This restrains formation of intermetallic compounds and provides high bonding reliability.

Layered solder material for bonding different species of electrodes and method of bonding the different species of electrodes in an electronic component

A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is a vacuum pickup surface. Each vacuum pickup surface is a sheared surface and extends along a longitudinal direction of the rectangular parallelepiped solder piece. The solder piece may be located in an open cavity in a supply tape with one of only the four vacuum pickup surfaces exposed to be available for vacuum pickup.

Solder piece, chip solder and method of fabricating solder piece

The present invention provides a storage subsystem accessing a storage resource efficiently to thereby enhance throughput. The storage subsystem adopts a configuration where respective processor packages have ownership of the respective LDEVs, wherein an I/O command from a host specifying an address extending over a division position within a single LDEV is divided, and the I/O processing is executed in a shared manner by multiple processor packages. The I/O processing is executed by allocating a processor package that processes a specific storage area with priority.

Storage subsystem and method for controlling the storage subsystem

A mobile radio communication system having one or more relay stations and base stations, a gateway, an external device having a route selection function, and a policy control device which selects a main route and a sub route on the basis of residual resources in a radio communication device. The mobile station connected to one radio communication device can select another radio communication device having a large amount of residual resources as a new access point when the one radio communication device cannot be used, to prevent shortage of the radio resources. Also, it is possible to enable a process of selecting the radio communication device as a new access point to be omitted when switching one route to another by determining a sub route as the new access point when a main route is disconnected in advance, to shorten a service disconnection time.

Route selecting device and mobile radio communication system

Growing community of inventors

Kokubunji, Japan

Koji Watanabe