Oki Electric Industry Co., Ltd.

Koji Ueki

Takashi Osako

A brush scrubbing apparatus is made up of a wafer holder which retains a wafer, a brush which removes a particle on the wafer, a driver which rotates at least one of the wafer holder and the wafer, an alignment mechanism which defines a relative position between the brush and the wafer holder, and controller which controls the alignment mechanism responding to a driving power supply voltage in the driver. The brush scrubbing apparatus can precisely get the reference position for deciding the pushing distance without using the eye measurement.

Brush scrubbing apparatus

Disclosed herein is a semiconductor wafer cleaning method using a semiconductor wafer cleaning device. The method includes providing a semiconductor wafer cleaning device with a back brush, bringing the back brush into contact with the entire lower surface of the semiconductor wafer, and cleaning an upper surface of the semiconductor wafer with a surface brush so as to clean the entire surface of the semiconductor wafer in an ever-horizontal state.

Growing community of inventors

Tokyo, Japan

Koji Ueki