Seiko Instruments Inc

Ablic Inc.

Sii Semiconductor Corporation

Tohoku Techno Arch Co., Ltd.

Koji Tsukagoshi

Hiroyuki Fujita

Sadao Oku

Keiichiro Hayashi

Hitoshi Kamamori

Noriyoshi Higashi

Shigetoshi Sugawa

Rihito Kuroda

Masaru Akino

The present invention provides a small and thin semiconductor device. The semiconductor device flip-chip bonds a semiconductor chipand a leadvia a metal bonding portionand includes a sealing resin covering them. The metal bonding portionis provided with a gold-rich bonding layeron the side of a first electrodeof the semiconductor chipand a gold-rich bonding layeron the side of a second electrodeof the lead, and connection between the semiconductor chipand the leadis strengthened, so that the semiconductor device does not require an anchor portion.

Semiconductor device and manufacturing method thereof

An optical sensor device has an optical semiconductor element fixed into a recessed portion of a base portion, and a pad portion of the optical semiconductor element is electrically connected to a lead portion of the base portion. On an upper surface of a protruding portion provided in an outer region of the base portion, a metallization layer having notch portions, a metal bonding layer, a metallization layer having notch portions, and a lid portion are provided. Through use of the metallization layers and the metal bonding layer, the lid portion can be hermetically bonded to the base portion.

Optical sensor device and method of manufacturing the same

A semiconductor device includes: a die pad; a semiconductor chip mounted on the die pad; a lead having an outer lead part and an inner lead par which is set up by a lead leg part extending from the outer lead part; an encapsulating resin sealing the die pad, the semiconductor chip, and the lead so that the lead is partially exposed; a support resin part provided on a bottom surface of the inner lead part, the support resin part being a portion of the encapsulating resin; and a notch part where the encapsulating resin is absent, and locating in a region surrounded by a bottom surface of the support resin part, an outer side surface of the outer lead part and an outer side surface of the lead leg part.

This optical sensor device includes a first light receiving portion having sensitivity to ultraviolet light, a first sealing portion covering the first light receiving portion, a second light receiving portion having sensitivity to ultraviolet light, and a second sealing portion which covers the second light receiving portion. At least one of the first sealing portion and the second sealing portion is configured to transmit at least part of a ultraviolet light wavelength band, the first sealing portion is formed from one or more resin layers and has transmission spectral characteristics that a first wavelength is set as a lower limit value of a transmission wavelength band, and the second sealing portion is formed from one or more resin layers and has transmission spectral characteristics that a second wavelength different from the first wavelength is set as a lower limit value of the transmission wavelength band.

Optical sensor device

A package for an optical sensor device has a double-molded structure in which a first resin molded portion and a second resin molded portion are integrated. The first resin molded portion has a structure in which peripheries of a die pad portion on which an optical sensor element is mounted and a part of leads are molded with a resin so as to be integrated. The second resin molded portion has a structure in which the periphery of the first resin molded portion is molded with a resin so as to form an outer shape of the package. A glass substrate having a filter function is bonded to an upper surface of the resin molded portions to form a cavity in which is mounted the optical sensor element.

A package for an optical sensor device has a double-molded structure in which a first resin molded portion and a second resin molded portion are integrated. The first resin molded portion has a structure in which peripheries of a die pad portion on which an optical sensor element is mounted and a part of each of a plurality of leads are molded with a resin so as to be integrated, the part of each of the plurality of leads being embedded in and completely surrounded by the first resin molded portion. The second resin molded portion is molded over at least a portion of the first resin molded portion to form an outer shape of the package and has embedded therein and completely surrounds a part of each of the plurality of leads. A glass substrate having a filter function is bonded to an upper surface of the resin molded portions to form a cavity in which is mounted the optical sensor element.

An optical sensor device includes a resin sealing portion for sealing an optical sensor element fixed to an element-mounting portion. The resin sealing portion is constituted of a resin having mixed and dispersed therein a glass filler obtained by pulverizing a phosphate-based glass which has spectral luminous efficacy properties by composition adjustment and high heat resistance and weatherability. The optical sensor device is highly reliable and capable of accommodating size and thickness reductions in packages and has stable and hardly changeable spectral luminous efficacy properties.

An optical sensor device comprises an element-mounting portion, an optical sensor element provided on the element-mounting portion, a lead having a first contact region connected to the optical sensor element and a second contact region for an external connection, and a resin-encapsulating portion which covers at least a light-receiving plane of the optical sensor element. The resin-encapsulating portion comprises a resin and a glass filler including borosilicate glass dispersed in the resin. The transmissivity of the resin-encapsulating portion in one example is equal to or more than 40% in a wavelength range between 300 nm to 400 nm, and in another example is equal to or more than 60% in a wavelength range between 300 nm and 350 nm.

Optical sensor device and method of manufacturing optical sensor device

The following configuration is adopted in order to provide a highly reliable optival sensor device which enhances the reliability of devices without making the devices unsuitable for size and thickness reductions. The light sensor comprises an element-mounting portion () having a cavity and a lid member closely attached thereinto, the lid member being composed of: a window () constituted of a phosphate-based glass to which properties approximate to a spectral luminous efficacy properties have been imparted by compositional control; and a frame () constituted of a phosphate-based glass having light-shielding properties. The lid member is a Laminated glass member obtained by cutting the phosphate-based glass having the spectral luminous efficacy properties into individual pieces, fitting the glass piece into the opening of the phosphate-based glass () having light-shielding properties, the opening having been formed so as to have a size approximately equal to the cavity size, and melting and integrating the glasses member.

Provided is a semiconductor device including a package having a hollow portion, which can meet the need of reduction in size and thickness. The semiconductor device includes: a resin molded member () including a hollow portion () having an inner bottom surface on which a semiconductor chip () is mounted, a surrounding portion () that surrounds the hollow portion (), and a bottom surface portion (); an inner lead (); and an outer lead () exposed from the resin molded member (). The inner lead buried in the molded member () includes an L-shaped lead extending portion having a through hole formed therethrough.

Semiconductor device

Phosphate-based glass doped with copper ions having infrared blocking filter characteristics is formed into particles and is mixed with a transparent encapsulating resin to encapsulate a semiconductor element. The glass particles have a particle diameter four times or more as large as a wavelength of infrared radiation to be blocked. An optical semiconductor device can be obtained having a stable filter characteristics thereof even if an incident light angle changes and is resistant to moisture.

Optical semiconductor device

A semiconductor device has an island portion on which a semiconductor chip is adhered through intermediation of an insulating paste. Recessed portions having an inverted pyramid shape are formed in a semiconductor chip placing region of the island portion. A first opening angle formed by a normal extending upward from a vertex of each of the plurality of recessed portions each having an inverted pyramid shape and an opening line extending to an outer side of the semiconductor chip placing region is smaller than a second opening angle formed by the normal and an opening line extending to an inner side of the semiconductor chip placing region.

An optical sensor element is mounted in a package which includes a glass substrate having a cavity, and a glass lid substrate bonded to the other substrate to close the cavity. The glass substrate with the cavity has metalized wiring patterns on front and rear surfaces thereof, and a through hole filled with metal to form a through-electrode interconnecting the wiring patterns on the front and rear surfaces. A metalized wiring pattern on the rear surface of the glass lid substrate is electrically connected to the wiring pattern on the front surface of the other substrate with an adhesive containing conductive particles. The glass lid substrate is made either of glass having a filter function or glass having a light shielding property with an opening therethrough filled with glass having a filter function.

A low-cost, compact, high-reliability optical sensor device has an optical sensor element mounted in a package comprised of a light shielding glass lid substrate, a part of which has a light filter function, adhered to a light shielding glass substrate having a cavity. In a through hole in the light shielding glass lid substrate, glass having a function of absorbing infrared light and transmitting visible light by its own property is embedded. The light shielding glass substrate is made of glass having light shielding property as its own property.

Optical sensor device having wiring pattern within cavity housing optical sensor element

Provided is a high-reliability, compact, and low-cost optical sensor device. The optical sensor device includes a glass lid substrate (), a glass substrate () with a cavity having divided and exposed through-hole electrodes () on the periphery thereof, and an optical sensor element () mounted on the glass lid substrate, and has a structure in which the glass lid substrate and the glass substrate with a cavity are bonded together. By hermetically sealing with the glass substrates, high reliability is secured. By using the divided through-hole electrodes, the package size is reduced and the number of devices which can be produced in a batch in the manufacture increases, which enables cost reduction.

Growing community of inventors

Chiba, Japan

Koji Tsukagoshi