Nec Corporation

Ps4 Luxco S.a.r.l.

Elpida Memory, Inc.

Koji Torii

Akira Ide

Nobuyuki Nakamura

A semiconductor device includes a semiconductor substrate having a peripheral edge, a first surface, and a second surface opposite to the first surface, an inter-layer insulator including a guard ring formed on the first surface, adjacent to the peripheral edge of the semiconductor substrate, a first groove formed on the second surface, adjacent to the peripheral edge of the semiconductor substrate, and a through electrode penetrating the second surface to the inter-layer insulator near the groove and on an opposite side of the groove with respect to the peripheral edge.

Semiconductor device including guard ring and groove

In a semiconductor device, the thickness of an insulating film formed in a through hole is reduced, while an annular groove having an insulating material embedded therein is provided so as to ensure a sufficient total thickness of the insulator, whereby a through silicon via is provided with an insulating ring which is improved in both processability and functionality.

Semiconductor device and manufacturing method thereof

In a connecting portion between an interconnection and a first bump which is a part of a through electrode penetrating a semiconductor chip and which penetrates a semiconductor substrate, a protruding portion protruding from the interconnection to the side of the first bump is provided. The protruding portion may be made of an insulating material and may be made of a conductive material.

Through silicon via in semiconductor device

A semiconductor device includes a semiconductor substrate; and a through electrode that penetrates the semiconductor substrate. The semiconductor substrate has a groove structure that is positioned between a peripheral edge of the semiconductor substrate and the through electrode.

Semiconductor device

A semiconductor device manufacturing apparatus according to the present invention comprises a head for holding a semiconductor wafer, a retainer ring for surrounding the outer periphery of the semiconductor wafer held by the head, and a polishing pad for polishing a polished surface of the semiconductor wafer. This apparatus presses the polished surface of the semiconductor wafer against the polishing pad together with the retainer ring to polish the semiconductor wafer. The retainer ring used in the present invention has a surface that is in contact with the polishing pad, which increases a contact area of the retainer ring against the polishing pad in accordance with wear of the retainer ring.

Semiconductor device manufacturing apparatus and method

To provide a semiconductor device production method capable of solving the problem of the latent period of time in which polishing is hardly performed immediately after a polishing start. In order to reduce the latent period of time caused immediately after a metal film polishing start, the polishing process is preceded by an oxide removal step for removing oxide from an object to be polished.

Semiconductor device production method

A semiconductor wafer polishing device is capable of improving controllability of a residual layer thickness and improving a production ability. The semiconductor wafer polishing device performs polishing of an interlayer insulation layer on a semiconductor wafer by performing divided polishing for the interlayer insulation layer by means of a platen, measuring a layer thickness of the interlayer insulation layer during a polishing process by the platen, and performing final polishing depending upon a result of measurement.

Semiconductor wafer polishing device and polishing method thereof

Shallow grooves are formed on the surface of a hard layer of a polishing pad for polishing the wafer so as to join a plurality of. Since the grooves are formed for causing no negative pressure between the polishing pad and the wafer, the distance between the grooves is made more than several times as large as the pitch between the holes.

Growing community of inventors

Tokyo, Japan

Koji Torii