Bristol-Myers Company

Bristol-Myers Squibb Compnay

Dai Nippon Printing Co., Ltd.

Alps Electric Co., Ltd.

Other

Yamaha Corporation

Koji Tomita

Masataka Konishi

Toshikazu Oki

Hiroshi Kawaguchi

Hiroshi Tsukiura

Koko Sugawara

Takeo Miyaki

Masahisa Oka

Hideo Kamei

Masachika Masuda

Mitsuaki Tsunakawa

Kyoichiro Saitoh

Kin S Lam

Masaru Ohbayashi

Kazuyuki Miyano

Ken-ichi Numata

Osamu Tenmyo

Atsushi Kurahashi

Hiroaki Ohkuma

James A Matson

Yosuke Sawada

Maki Nishio

Daniel R Schroeder

Masaki Yazaki

Jacqueline M Mattei

Masami Hatori

Grace A Hesler

Keiko Shimizu

Satoshi Shibasaki

Kazuhito Uchiumi

Kozo Tomatsu

Murray A Kaplan

Tetsuro Yamasaki

John E Leet

Soichiro Toda

Sandra J Hofstead

Yasutaro Hamagishi

Minoru Hanada

Donald R Gustavson

Ronald L Berry

Nobuaki Naruse

Hiromichi Suzuki

Chikao Ikenaga

Satoshi Yamamoto

Kazunori Oda

Michael R Kozlowski

James A Bush

Hiroshi Ohsawa

Takahiro Sahara

Yoshihiko Ogino

Yuji Nishiyama

Salvatore Forenza

Jun Kato

Kazunori Kato

Tomokazu Ueki

Thomas T Dabrah

King S Lam

Kyoji Yamamoto

Yasuo Fukagawa

Tadashi Okamoto

Seikichi Kobaru

Yasunori Tanaka

Kei-Ichi Fujisawa

Kei-ichi Fujisawa

A leaf spring frame member () comprises: a plurality of leaf spring product parts (A) each of which includes an outer frame part (), an inner frame part () and spring parts (); and a support frame () which is arranged around the leaf spring product parts (A) and supports the leaf spring product parts (A). Each of the leaf spring product parts (A) and the support frame () are connected to each other by connection parts (). A breaking region (), which is breakable, is formed in the connection part (). An outer edge () of the breaking region () is situated on the inside of an outer edge () of the leaf spring product part (A).

Leaf spring frame member

A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.

Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device

A semiconductor device includes, a lead frame having a die pad and a plurality of leads each disposed around the die pad, a semiconductor element rested on the die pad of the lead frame, and bonding wires for electrically interconnecting the lead of the lead frame and the semiconductor element. The lead frame, the semiconductor element, and the bonding wires are sealed with a sealing resin section. The sealing resin section includes a central region provided over and around the semiconductor device, and a marginal region provided in the periphery of the central region. Thickness of the central region is greater than that of the marginal region.

Semiconductor device and manufacturing method therefor

Provided is a semiconductor device capable of preventing a semiconductor chip from being damaged by any sharp burrs of a metallic shielding plate. The semiconductor device includes a semiconductor chip and a metallic shielding plate provided on a circuit surface of the semiconductor chip. The metallic shielding plate is disposed in such a manner that a second surface of a shielding plate body is directed towards the circuit surface of the semiconductor chip, and burrs are positioned contiguous to the second surface of the shielding plate body. At distal ends of the burrs, cutting burrs are formed in a direction orthogonal to the second surface. The sharp burrs extend in a direction opposite to the semiconductor chip, so that the sharp burrs are prevented from damaging the circuit surface of the semiconductor chip.

Semiconductor device and method for manufacturing metallic shielding plate

The present invention provides a resin-sealed semiconductor device, which includes a semiconductor element; a plurality of terminal members, each surrounding the semiconductor element and including an external terminal portion, an internal terminal portion and a connecting portion; bonding wires, each connecting the semiconductor element with the internal terminal portion; and a resin-sealing portion sealing the semiconductor element, terminal members and bonding wires. Each terminal member is composed of an inner thinned portion forming the internal terminal portion and an outer thickened portion forming the external terminal portion. A rear face of each internal terminal portion, and a front face, a rear face and an outer side face of each external terminal portion are exposed to the outside from the resin-sealing portion, respectively.

Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device

A switch device reduces a switching sound (an impinging sound) at the time of manipulation with a constitution of a click mechanism which uses a spring member having a projection which is brought into slide contact with a cam surface formed of plateaus and valleys. The switch device includes a manipulating member having a cam surface which is formed of plateaus and valleys arranged contiguously and alternately and a spring member having the projection and generating a click feeling when the projection is brought into slide contact with the plateaus and the valleys of the cam surface. The spring member is provided with an auxiliary spring which is brought into slide contact with the manipulating member corresponding to the slide contact of the projection with the plateaus and the valleys of the cam surface. An auxiliary spring receiving portion with which the auxiliary spring is brought into slide contact is formed in the vicinity of the cam surface.

Rotary switch having click mechanism

The present invention relates to novel antifungal antibiotics herein designated as pradimicin L and pradimicin FL, and derivatives thereof. Pradimicins L and FL are produced by Actinomadura verrucosospora subsp. neohibisca strain R103-3, ATCC No. 53930.

Pradimicins l and fl, and derivatives thereof

A novel antibiotic complex designated BU-4224V produced by fermentation of Kibdelosporangium albatum sp. nov. Strain R761-7. The complex may be separated chromatographically into bioactive components designated BU-4224V A, B.sub.1, B.sub.2, and C. The components BU-4224V B.sub.1 and B.sub.2 display both antiviral and antimicrobial activity, while component BU-4224V A has antimicrobial activity and component BU-4224V C has antiviral activity.

Antiviral antibiotic BU-4224V

In a leadframe for supporting semiconductor devices and including a plurality of outer lead sections, a recess or recesses are provided on each of the outer lead sections at a central portion or both sides of each outer lead section in a region including a cutting line. The recess or recesses reduce the cross-sectional area of the lead section, thus enabling a new cut surface of the lead section to be well covered by solder and enabling ready cutting of the lead section.

Leadframe adapted to support semiconductor elements

Disclosed are active compounds BU-4726G-A and BU-4726G-B which contain a quinone chromophore and hydroquinone chromophore, respectively. The compounds are produced by fermentation of Streptomyces exfoliatus AA4510. The compounds possess antimicrobial, and K.sub.ATP channel blocking activities.

Compounds produced by a strain of Streptomyces exfoliatus

An antibiotic designated BMY-42448 is produced by fermentation of Micromonospora narashinoensis strain C39217-R109-7 (ATCC-53791). BMY-42448 exhibits both in vitro and in vivo antitumor activity.

Antitumor antibiotic BMY-42448

The present invention relates to an arylsulfatase of microbial origin. The enzyme may be linked to an antibody against a tumor-associated antigen and the resulting conjugate used in conjuction with a sulfated prodrug of a 4'-demethylepipodophyllotoxin glucoside derivative, particularly etoposide in cancer chemotherapy.

Arylsulfatase from streptomyces

Growing community of inventors

Tokyo, Japan

Koji Tomita