Tokyo Electron Limited

Hisamitsu Pharmaceutical Company, Inc.

Tokyo Electron Limi Ted

Koji Tanaka

Yasunori Takada

Yasuhiro Ikeura

Takami Satoh

Koji Yamashita

Keita Hirase

Yuji Kamikawa

Yasuhiro Takaki

Kotaro Tsurusaki

Kouzou Kanagawa

Toshiyuki Shiokawa

Yukiyoshi Saito

Hiroyuki Masutomi

Teruaki Konishi

Tomiyasu Maezono

Kouji Egashira

Osamu Kuroda

Hiroaki Inadomi

Masami Yamashita

Teruomi Minami

Mitsunori Nakamori

Hitoshi Kosugi

Jun Nonaka

Yuji Kimura

Koji Egashira

Yosuke Kawabuchi

Akihiro Teramoto

Takao Inada

Shigeo Suzuki

Kazuyoshi Eshima

Kazuki Kosai

Kouzou Tachibana

Hiroshi Komiya

Keisuke Egashira

Takashi Yabuta

Takuro Masuzumi

Yoshiteru Fukuda

Ikuo Sunaka

Hirotaka Maruyama

Kiyomi Tsuruda

Tsukasa Hirayama

Shogo Mizota

Takashi Uno

Masataka Gosho

Hidemasa Aratake

Daisuke Saiki

Kouji Ogura

Kotaro Ooishi

Yasuo Kiyohara

Kazuyoshi Mizumoto

Shinichi Umeno

Atsushi Anamoto

Tatsuya Nagamatsu

Yusuke Yamamoto

Keisuke Sasaki

Takashi Ikeda

Kazusige Sano

Michitaka Amiya

Hidetomo Uemukai

Kazuaki Kitamura

Shunsuke Kurizaki

Akihiro Nakamura

Shun Tominaga

Yoshiaki Hashimoto

Yu Tsurifune

Shinichi Ikeda

Shota Takei

Miyuki Kozuma

A substrate processing system includes: a carry-in/out section in which a cassette accommodating a plurality of substrates is carried in/out; a batch processing section in which a wafer lot including the plurality of substrates is collectively processed in a state where each of the plurality of substrates stand upright; a single-wafer processing section in which the plurality of substrates included in the wafer lot are processed one by one in a horizontal state; and an interface section that delivers the plurality of substrates from the batch processing section to the single-wafer processing section. The interface section includes: a standby table that horizontally holds a substrate in a state of being in contact with pure water; and a transfer mechanism that delivers the substrate from the batch processing section to the standby table.

Substrate processing system and substrate processing method

A substrate processing system includes: a carry-in/out section in which a cassette accommodating a plurality of substrates is carried in/out; a batch processing section in which a wafer lot including the plurality of substrates is collectively processed; a single-wafer processing section in which the substrates of the wafer lot is processed one by one; and an interface section that delivers the substrates between the batch processing section and the single-wafer processing section. The batch processing section includes: a processing bath in which the wafer lot is immersed and processed; and a first transfer device that transfers the wafer lot to the processing bath. The interface section includes: an immersion bath disposed outside a movement range of the first transfer device and that immerses the wafer lot; and a second transfer device that holds and transfers the wafer lot between the first transfer device and the immersion bath.

A substrate processing apparatus includes a processing tank, a holder, an organic solvent supply, a drainage port, a gas supply, and an exhaust port. The processing tank stores an aqueous layer. The holder holds a substrate. The organic solvent supply supplies an organic solvent onto the aqueous layer to form a liquid layer of the organic solvent. The drainage port discharges the aqueous layer from a bottom wall of the processing tank and causes the liquid layer of the organic solvent to descend from above the substrate to below the substrate. The gas supply supplies a gas of a water repellent agent to the liquid layer from above the processing tank while the liquid layer descends. The exhaust port is exposed on a side wall of the processing tank by the descending of the liquid layer and discharges the gas of the water repellent gas.

Substrate processing apparatus for supplying gas of water repellent agent and substrate processing method

There is provided a substrate processing apparatus including: a processing part configured to process a substrate with a processing liquid; and a processing liquid generation part configured to generate the processing liquid supplied to the processing part. The processing liquid generation part includes: a reservoir configured to store the processing liquid; a circulation line through which the processing liquid stored in the reservoir is circulated; a heater configured to heat the processing liquid; and a nozzle provided at a downstream side of the circulation line and has at least one ejection port formed to eject the processing liquid heated by the heater from above a liquid level of the processing liquid stored in the reservoir.

Substrate processing apparatus and processing liquid concentration method

A substrate liquid treatment apparatus includes an inner tank configured to store a treatment liquid and having an upper opening, an outer tank disposed outside the inner tank, and a lid movable between a close position for closing the upper opening of the inner tank and an open position for opening the upper opening of the inner tank. The lid includes a main portion that covers the upper opening of the inner tank when the lid is positioned at the close position, and a splash shielding portion connected to the main portion. When the lid is positioned at the close position, the splash shielding portion extends from a position higher than an upper end of a side wall of the inner tank adjacent to the splash shielding portion to a position which is lower than the upper end of the side wall and which is on the outer tank side of the side wall.

Substrate liquid treatment apparatus

A processing liquid used in a substrate liquid processing apparatus can be supplied in a constant amount with high accuracy. A substrate liquid processing apparatus Aincludes a storage lineconfigured to store a processing liquid therein; an introduction lineconfigured to introduce the processing liquid into the storage line; a discharge lineconfigured to discharge the processing liquid from the storage line; and a gas supply unitconfigured to perform a strickling of the processing liquid by jetting a gas to a surface of the processing liquid stored in the storage line

Weighing apparatus, substrate liquid processing apparatus, weighing method, substrate liquid processing method and recording medium

Disclosed is a liquid processing method of drying a substrate held horizontally after supplying deionized water to the substrate. The liquid processing method includes: supplying the deionized water to a front surface of the substrate; supplying a first solvent to the front surface of the substrate after supplying the deionized water; supplying a water-repellent agent to the front surface of the substrate to impart water-repellency to the front surface of the substrate; supplying a second solvent to the front surface of the substrate to which water-repellency is imparted; and removing the second solvent from the front surface of the substrate. A specific gravity of the first solvent is smaller than a specific gravity of the water-repellent agent, and a specific gravity of the second solvent is larger than the specific gravity of the water-repellent agent.

Liquid processing method, substrate processing apparatus, and storage medium

A substrate liquid processing apparatus includes a transfer section, a processing section, a reservoir and a liquid sending mechanism. The transfer section includes a transfer device configured to transfer a substrate. The processing section is provided adjacent to the transfer section in a horizontal direction, and includes a liquid processing unit configured to process the substrate by using a processing liquid. The reservoir is configured to store the processing liquid therein. The liquid sending mechanism is configured to send out the processing liquid stored in the reservoir into the liquid processing unit. The reservoir is disposed directly under the transfer section. Further, the liquid sending mechanism is disposed directly under the processing section. Space saving of the substrate liquid processing apparatus can be achieved.

Substrate liquid processing apparatus

The substrate liquid processing apparatus includes a processing bath that accommodates substrates, and a plurality of gas supply pipes provided in a processing bath. Ejection holes of one gas supply pipe and ejection holes of another adjacent gas supply pipe do not overlap each other in a direction parallel to the circuit-formed surfaces of the substrates.

Substrate liquid processing apparatus, substrate liquid processing method, and storage medium

A flow-rate regulator device for controlling a flow rate of a liquid includes a first flow-rate regulator component positioned on an upstream side of a liquid line, and a second flow-rate regulator component positioned on a downstream side of the liquid line and connected in series to the first flow-rate regulator component. The first flow-rate regulator component adjusts a degree of opening such that a flow rate of liquid flowing through the liquid line is set a specified number of times greater than a target flow rate when the second flow-rate regulator component has a full opening, and the second flow-rate regulator component adjusts a degree of opening such that the flow rate of the liquid flowing through the liquid line is to be at the target flow rate when the first flow-rate regulator component is adjusted to have the degree of opening.

Flow-rate regulator device, diluted chemical-liquid supply device, liquid processing apparatus and its operating system

A substrate processing apparatus includes a mixing tank, a first opening/closing valve, a second opening/closing valve, a first flow rate measuring unit, a second flow rate measuring unit, a control unit, and a substrate processing unit. A first liquid and a second liquid are mixed such that the second liquid is mixed in an amount more than that of the first liquid. The first and second opening/closing valves open/close a first flow path and a second flow path, respectively. The first and second flow rate measuring units measure flow rates of the first and second liquids flowing through the first and second flow paths, respectively. The control unit controls opening/closing of the first opening/closing valve and the second opening/closing valve. The substrate processing unit processes a substrate by supplying a mixed liquid of the first and second liquids to the substrate.

Substrate processing apparatus and liquid mixing method

Disclosed are a substrate liquid processing apparatus and method for performing a liquid processing on a substrate using a processing liquid, and a computer-readable recording medium with a substrate liquid processing program recorded therein. In the method, a first chemical liquid supply step is performed to supply a first chemical liquid from a first chemical liquid supply unit to a processing liquid storage unit, a first chemical liquid purifying step is performed to purify the first chemical liquid in a chemical liquid purifying unit, a second chemical liquid supply step is performed to supply a second chemical liquid from a second chemical liquid supply unit to the processing liquid storage unit, and a processing liquid supply step is performed to supply the processing liquid obtained by mixing the first and second chemical liquids from the processing liquid supply unit to substrate liquid processing units.

Substrate liquid processing apparatus and method, and computer-readable recording medium with substrate liquid processing program recorded therein

Disclosed is a substrate liquid processing apparatus including: a first processing liquid supply mechanism provided with a first tank in which a processing liquid is stored and a first nozzle through which the processing liquid stored in the first tank is ejected, and configured to supply the processing liquid to a first surface of a substrate by the first nozzle; a second processing liquid supply mechanism provided with a second tank in which a processing liquid having the same composition as the processed liquid stored in the first tank is stored and a second nozzle through which the processed liquid stored in the second tank is ejected, and configured to supply the processed liquid to a second surface of the substrate by the second nozzle; a processing unit configured to perform processing on the substrate using the processed liquids supplied by the first nozzle and the second nozzle; and a recovery line configured to recover the processed liquids which are supplied to the substrate from the first nozzle and the second nozzle and mixed with each other from the processing unit and return the recovered processed liquids to the second tank.

Substrate liquid processing apparatus and substrate liquid processing method

A transdermal patch comprising a backingand an adhesive layerlaminated on the backing, wherein the adhesive layercomprises a rosin-based resin and petroleum resin as a tackifier, the total compounding amount of the rosin-based resin and the petroleum resin is in a range of 15% by mass to 50% by mass, and compounding amount of the petroleum resin is &#x2153; times by mass to 4 times by mass as that of the rosin-based resin.

Percutaneous absorption type plaster

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Koshi, Japan

Koji Tanaka