Hitachi, Ltd.

Kabushiki Kaisha Toshiba

Nichias Co., Ltd.

Tokyo Electron Limited

Nichias Corporation

Canon Kabushiki Kaisha

Fujikura Limited

Taisei Corporation

Tokyo Electron Yamanashi Limited

Chiyoda Chemical Engineering Construction Co., Ltd.

Canon Seiki Kabushiki Kaisha

Koji Suzuki

Takashi Inoue

Yoshitada Oshida

Masahide Okamoto

Haruhiko Matsuyama

Shosaku Ishihara

Mutsumi Horikoshi

Haruko Sasaki

Akihiro Yasuda

Norihiro Ami

Tetsuzo Tanimoto

Hitoshi Yokono

Hiroshi Tanimoto

Hidetaka Shigi

Akira Murata

Kazuo Hirota

Takashi Kobayashi

Jun Tanaka

Akio Takahashi

Hitoshi Kubota

Haruo Akahoshi

Yasuhiro Yoshitake

Yoshimasa Ohshima

Naoki Mori

Masataka Shiba

Ryohei Satoh

Hitoshi Oka

Sadao Kobayashi

Fusaji Shoji

Katsuhiro Yamashita

Yutaka Akiba

Takao Nakamura

Yasunori Narizuka

Susumu Kasukabe

Susumu Aiuchi

Mitsuyoshi Koizumi

Fumikazu Itoh

Tsuyoshi Fujita

Yoshihide Wakayama

Ryuichi Funatsu

Masahiro Suzuki

Akira Inagaki

Akira Yabushita

Masaji Kurosawa

Tetsuya Yamazaki

Suguru Sakaguchi

Hideo Sotokawa

Kazuo Sanada

Takayoshi Watanabe

Osamu Suenaga

Takaji Takenaka

Isao Terada

Motoya Taniguchi

Hiroshi Yanagioka

Takashi Tozawa

Yoshio Fukasawa

Sadao Chigira

Hiroshi Saitoh

Shozo Hosoda

Muneo Oshima

Tsuneo Kawai

Mamoru Ogihara

Tatsuya Nakagome

Jun Shimada

Yasumasa Ishihara

Fumiuki Kobayashi

Masahiro Koizumi

Yuji Matumura

Hiromu Itoh

Mitsuo Yoshimoto

Mahito Kajihara

Minoru Aoyagi

Masatake Shinsenji

Atsushi Futami

Norio Akutsu

Akiyoshi Sasaki

Eiji Fukushima

Hidenori Oikawa

Yuji Matsumura

Masasi Ookubo

A method of cleaning air, including a humidifying operation for humidifying the air containing chemical contaminants by a humidifier and taking a part of the gaseous contaminants in the air into excessive moisture to remove the contaminants from the air, and a dehumidifying operation for dehumidifying the humidified air by a condenser and taking the gaseous chemical contaminants remaining, without being removed, in the humidifying operation into condensed water for removal. By using an oblique honeycomb having both front and rear faces and both upper and lower faces disposed in open state, air is led from the front opening part of the oblique honeycomb and water is fed from the upper opening part thereof to one or both of the humidifier and condenser.

Method and device for cleaning air

An air filter includes a honeycomb rotor which carries a porous adsorbent and can be rotated in a circumferential direction, a drive means for rotating the honeycomb rotor, a first partition member provided with a first gas introduction section and a second gas exhaust section and a second partition member provided with a first gas exhaust section and a second gas introduction section, the first and second partition members being disposed on both sides of the honeycomb rotor respectively to allow two gases to flow in counter current to each other and to pass through different conduits respectively, a heater disposed at the inlet port of the first gas introduction section, a drive controller for controlling the drive means such that the honeycomb rotor can rotate intermittently by every part of a regenerative/purge-zone facing the first gas introduction section among the surface of the filter of the honeycomb rotor.

Air filter

The honeycomb structure of the present invention is formed from a nonwoven fabric in which a biologically soluble fiber is used, and exhibits superior biological solubility and high heat resistance.

Biologically soluble honeycomb structure

A via interconnection of a glass-ceramic wiring board is made by blending a copper powder to a vehicle including a cellulose derivative, adding a metal oxide powder having a mean particle diameter of from at least 1 &mgr;m to at most 4 &mgr;m to the vehicle and blending them, adjusting the viscosity of the vehicle by adding the cellulose derivative and filling them to a via; and sintering the via at a temperature of at least 900&deg; C. to at most 1060&deg; C., and forming the via interconnection.

Method of manufacturing via interconnection of glass-ceramic wiring board

A honeycomb structure suitable for a carrier of a catalyst apparatus is provided. The honeycomb structure includes a formed piece obtained by forming paper into a honeycomb shape. The formed piece is impregnated with inorganic oxide particles and an inorganic binder. The paper is made by mixing glass fiber and inorganic fiber which is other than the glass fiber and whose proportion of the diameter with respect to the glass fiber is 0.2 to 0.7.

Honeycomb structure

A glass-ceramic wiring board includes an insulating substrate, a via disposed in the insulating substrate and a via interconnection filling the interior of the via. The via interconnection is sintered material having metal particles. The metal particles have a cross-sectional area per one metal particle surrounded by a metal particle boundary of less than 2000 &mgr; , which can be determined by cutting, etching and examining a cross-section of the via.

Glass-ceramic wiring board

A dehumidifying material comprising: 90.0 parts by weight to 99.9 parts by weight of silicon dioxide which is silica gel; and 0.1 part by weight to 10.0 parts by weight of an iron oxide or a mixture of the iron oxide and another metal oxide and a dehumidifying element incorporating an inorganic fiber sheet supporting the dehumidifying material, the dehumidifying material being obtained by allowing alkali silicate or alkokysilane to adhere to an inorganic fiber sheet to gel the inorganic fiber sheet, by immersing the inorganic fiber sheet in solution containing iron salt or iron and other metal salt and by drying the inorganic fiber sheet.

Dehumidifying material, dehumidifying element and manufacturing method therefor

In a ceramic wiring board which comprises a copper via, breaks and defects of via interconnections resulting from enlargement of copper particles in the interior of the via during sintering, are prevented. For this purpose, alumina of mean particle diameter from 1 &mgr;m to 4 &mgr;m is disposed in the interior of the via interconnection after sintering at an average interval of 7.4 &mgr;m or less.

Ceramics substrate with electronic circuit and its manufacturing method

A multilayer wiring substrate using a resin composition comprising polyquinoline compound and bismaleimide compound as essential ingredients between wiring-carrying resin layers as insulating layers forms no void at the time of lamination, has an excellent adhesive property at various interfaces, has a heat stability after lamination and is high in reliability, so that, it is applicable to many fields not only including the multilayer wiring substrates capable of mounting LSI or tip carrier directly but also including multilayer wiring substrate for work station, mounting substrates for small-sized electronic devices such as camera and video for people's use, and high frequency multitip module multilayer substrate.

Multilayer wiring substrate and method for production thereof

A projection exposure apparatus (1) comprises an incident light optical system for causing the light emitted from a light source 1 to enter an object of exposure (4) in diagonal direction, a detection apparatus (3) for causing an interference between the light reflected from the object of exposure (4) and a reference light and detecting the resultant interference fringe, a processing circuit for determining the inclination and height of the surface of the object of exposure (4) from the optical information on the interference fringe, and a stage (7) for supporting the object of exposure (4). The object of exposure (4) is subjected to projection exposure by driving the stage (7) according to the calculated inclination and height of the object of exposure (4).

Projection exposure apparatus and projection exposure method

Circuit board and method of manufacturing the same

A vacuum process apparatus includes a convey chamber having a plurality of loading/unloading ports and an airtight structure kept in a vacuum when a target object is conveyed, at least one preliminary vacuum chamber connected to the convey chamber through a loading/unloading port, a plurality of vacuum process chambers connected to the convey chamber through the loading/unloading ports and each having a vacuum process mechanism, a plurality of gate valves for opening/closing the plurality of loading/unloading ports, and a multi-joint arm member, arranged in the convey chamber, for conveying the target object between the convey chamber and the vacuum process chambers, and between the convey chamber and the preliminary chamber. The convey chamber is evacuated through a bearing for a pivot shaft of the multi-joint arm member.

Vacuum process apparatus and vacuum processing method

A chip carrier has an electrically insulating substrate with through holes and a multilayer structure formed on the substrate. The multilayer structure includes an electrical conductor pattern for electrical connection with through hole conductors provided in the through holes and for electrical connection with an IC chip. The through hole conductors have their ends protruding from one surface of the substrate on which registration layers are formed for electrically interconnecting the through hole conductors and the electrical conductor pattern in the multilayer structure. The surface of the protruding end of each of the through hole conductors is generally continuously convexly curved and has a maximum height at or in the vicinity of its central portion with the height being measured from the surface of the substrate.

Chip carrier having through hole conductors

A bidirectional switch circuit includes a parallel circuit of two unidirectional switch devices which are connected between a first and a second external current terminals. These switch devices are arranged to be reverse to each other in their current-forwarding direction. The switch devices are electrically biased by a single power supply unit, and turn on alternately in accordance with the potential difference between the external terminals. Each switch device may be an insulated gate bipolar transistor (IGBT), which is driven by a bias voltage generator including a resistor. A current flow controller is connected between the power supply unit and the IGBTs, for selectively supplying a control current to one of the IGBTs. A return-current path selector is connected between the external terminals, and has an output connected to the power supply unit through a return path line. The selector automatically performs a return-path changeover operation for a return-current of one of the switch devices being presently turned on.

Bidirectional switch circuit with automatic return-current path selector

A resistor material having at least chromium, silicon and oxygen, Cr.SiO.sub.2, contained in electronic integrated circuits, particularly in the case of an aluminum layer being on the material, is etched with a liquid etchant composition containing 1.92 to 2.64 mol/l of hydrochloric acid, 0.26 to 0.77 mol/l of phosphoric acid, 5 to 10 mol/l hydrofluoric acid and 3.2 to 5.4 mol/l of ammonium fluoride.

Liquid etchant composition for thin film resistor element

Growing community of inventors

Yokohama, Japan

Koji Suzuki