Fujitsu Corporation

Fujitsu Limied

Koji Suto

Yoshiaki Yanagida

Tomokazu Sugiyama

Motoichi Watanuki

Kazuo Yokoi

Shunsuke Sone

Teruaki Nishioka

Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.

Method and apparatus for polishing, and lapping jig

Disclosed is a magnetic head manufacturing method for accurately measuring resistance value whereby magnetic heads are processed while measuring the resistance values of process monitoring element. After forming on a wafer magnetic head elements and monitoring element, in which resistance values change in analog fashion in line with processing, these elements are cut from the wafer. Next, the magnetic heads are processed to a prescribed height while measuring the resistance values of the monitoring element. In the forming process, the difference &Dgr;I between the positions of the magnetic head elements and monitoring element is measured in advance, and this difference &Dgr;I is used to convert the resistance values of the monitoring element to the height of the magnetic head elements. This makes it possible to correct errors in masks. Furthermore, patterns can be formed accurately by setting the position of the monitoring element to the same position as the magnetoresistive film of the magnetic heads.

Manufacturing method for magnetic heads

The present invention relates to an automatic lapping method for lapping a work piece and a lapping apparatus using the same. The lapping apparatus laps a work piece by moving the mounting base,relatively to a lapping plate,. On a coarse processing step, the lapping plate,is controlled with high speed as detecting a remaining amount for lapping the work piece. Then, on a fine processing step, said lapping plate,is controlled with low speed by detecting that the remaining amount h for lapping said work piece has reached to a predetermined amount H,. Thereby, it becomes possible to continuously execute the coarse processing and the fine processing in one lapping apparatus.

Automatic lapping method and a lapping apparatus using the same

The present invention relates to an automatic lapping method and a lapping apparatus for lapping a work piece, which is bonded to a row bar, including a thin-film element in order to control the lapping process by accurately measuring height of the work piece. The automatic lapping apparatus may include a lapping plate for lapping a thin-film, which is bonded to a row bar, including a monitoring element having at least an analog resistance value which is analogously varied according to lapping; and a controller for converting the analog resistance value to height of said thin-film element and controlling said lapping plate to stop the lapping process when the height of the thin-film element has reached to a targeted value, wherein said controller employs a previously measured resistance value as a currently measured resistance value when the currently measured resistance value is less than the previously measured resistance value.

Automatic lapping method of a thin film element and a lapping apparatus

A lapping apparatus for uniformly laps work pieces. The lapping apparatus includes a rotary lapping plate, a lapping base including a plurality of pads contacting the lapping plate, an adapter including first and second surfaces for supporting the mounting base contacting the lapping plate, and a supporting mechanism provided on the lapping base for supporting the second surface of the adapter by a supporting point. As the adapter supporting the work piece is supported on two points on the work piece and one supporting point of the lapping plate, the lapping surface of the work piece may follow as the lapping plate. Accordingly, it becomes possible to uniformly lap the work piece regardless of accuracy of the lapping base.

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Kawasaki, Japan

Koji Suto