Hosiden Corporation

Koji Shinoda

Takeshi Isoda

Hiroshi Nakagawa

A circuit element connection structure includes: a plate-shaped base made of an insulating material and having an opening through the entire base in a thickness direction thereof; a circuit element made of an electrically conductive material and disposed on a first side of the base in the thickness direction thereof; and a connector made of an electrically conductive material and disposed on a second side of the base in the thickness direction thereof, the circuit element and the connector being in contact with each other at the opening as viewed in the thickness direction of the base.

Circuit element connection structure and circuit element connection structure unit

A method for manufacturing a three-dimensional structure including: preparing a first structure including a fixing face; fixing a plastic layer to the fixing face of the first structure; preparing a conductive wire; and operating an ultrasonic head to apply ultrasonic waves to the conductive wire and to press the conductive wire against the plastic layer, and thereby partly embedding the conductive wire into the plastic layer.

Method for manufacturing three-dimensional structure, and three-dimensional structure

A method for manufacturing a touch sensing device including at least 1) to 5) as follows: 1) preparing a material film being biaxially stretched and including an available area that is a partial area in a widthwise direction of the material film, the available area extending in a lengthwise direction of the material film and including first and second segments, the first and second segments defining different areas in the lengthwise direction; 2) forming an electrode group on one of the first and second segments; 3) cutting a first piece out of the material film to make the first piece including the first segment; 4) cutting a second piece out of the material film to make the second piece including the second segment; and 5) bonding the first segment to the second segment, substantially maintaining orientations of the first segment and the second segment as before the cutting.

Method for manufacturing touch sensing device and touch sensing device

A touch sensing device including first electrodes at a first height, and second electrodes and first ground electrodes at a second height. The first electrodes are spaced apart along a first direction and each include first and second overlapping portions. The second electrodes are spaced apart along a second direction and include pairs of adjacent second electrodes. The second electrodes each include wide and narrow portions. The wide portions are spaced apart in the first direction and include pairs of adjacent wide portions. Each narrow portion is smaller in the second direction than each wide portion and interconnects the corresponding adjacent wide portions. The narrow portions overlap the corresponding first overlapping portions. Each first ground electrode, located between the corresponding adjacent second electrodes, includes first and second portions. Each first portion is located between the corresponding wide portions. Each second portion, located between the corresponding narrow portion, overlaps the corresponding second overlapping portions.

Touch sensing device

A touch sensing device including first electrodes and second electrodes. The first electrodes at a first height position are spaced apart along a first direction and each include an electrode body of strip shape extending in a second direction. The electrode body of each first electrode includes first overlapping portions. The second electrodes at a second height position are spaced apart along the second direction and intersect the first electrodes. Each second electrode includes wide portions and narrow portions. The wide portions of each second electrode are spaced apart along the first direction and include pairs of adjacent wide portions. The adjacent wide portions of each pair are located adjacent to each other in the first direction. Each narrow portion is smaller in the second direction than each wide portion, interconnects the adjacent wide portions of a corresponding pair, and overlaps a corresponding one of the first overlapping portions.

The invention provides a device module that can be manufactured with a die. The device module includes a plastic part, a device, a holder, and an external connection. The device is embedded in the plastic part. The holder is embedded in the plastic part and includes an exposed portion exposed from the plastic part in a thickness direction of the plastic part in such a manner as to close a housing recess of the die. The external connection is connected to the device and partially fixed to the holder. The external connection includes a lead-out portion insertable in the housing recess of the die. The lead-out portion is embedded in the plastic part and being led out of the plastic part in the thickness direction. Alternatively, the lead-out portion is led through and out of the holder in the thickness direction.

Method of manufacturing a device module

An input device including a base, a plastic part provided on the base, and a touch sensor embedded in the plastic part. Embedding the touch sensor in the plastic part contributes to the reduction of the distance from an outer face of the base to the touch sensor, thereby improving the sensitivity of the touch sensor. Embedding the touch sensor in the plastic part also makes it possible to omit a step of fixing the touch sensor to the plastic part, thereby improving the yield rate of the input device.

Touch-sensitive input device

The invention provides a device module including a base, a plastic part, and an external connection. The plastic part is provided on the base. The device is provided on the base and embedded in the plastic part. The device is a sensor, an electronic device, or a circuit board. The external connection includes an embedded portion and a lead-out portion. The embedded portion is connected to the device, extends along the base, and is embedded in the plastic part. The lead-out portion is contiguous with the embedded portion and led out of the plastic part.

Device module and method of manufacturing the same

The invention provides a device module including a device, a connecting part, and a plastic part. The device is a sensor, an electronic component, or a circuit board. The connecting part is connected to the device and includes an external connecting portion. The device and the connecting part are embedded in the plastic part. The plastic part is provided with a first opening that exposes at least the external connecting portion of the connecting part to the outside.

Device module

A plurality of protruding substrate portions () is extended from positions placed at an interval from each other along a peripheral edge of a wiring substrate (). Each of the protruding substrate portions () is provided with wiring terminals (), () electrically connected to each of a plurality of electrode terminals provided to an electrical instrument substrate. A cut-out part () is formed in a peripheral edge () between the protruding substrate portions () in the wiring substrate ().

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Yao, Japan

Koji Shinoda