Jsr Corporation

Koji Seno

Terukazu Kokubo

Kazuo Inoue

Masaya Naoi

Ryoji Setaka

Takeo Hara

An anisotropically conductive connector, by which positioning, and holding and fixing to a wafer to be inspected can be conducted with ease even when the wafer has a large area, contains a frame plate having a plurality of anisotropically conductive film-arranging holes formed corresponding to regions of electrodes to be inspected of a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes and supported by the inner peripheral edge thereabout.

Anisotropically conductive connector and production process thereof, and probe member

Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a wafer can be conducted with ease even when the wafer has a large area of 8 inches or greater in diameter, and the pitch of electrodes to be inspected is small, and good conductivity is retained even upon repeated use, and applications thereof. The anisotropically conductive connector has a frame plate, in which a plurality of anisotropically conductive film-arranging holes have been formed correspondingly to electrode regions in all or part of integrated circuits on a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes. The elastic anisotropically conductive films each have a plurality of conductive parts for connection extending in a thickness-wise direction thereof and containing conductive particles, and an insulating part mutually insulating them. The conductive particles are obtained by coating core particles exhibiting magnetism with a high-conductive metal, a proportion of the high-conductive metal to the core particles is at least 15% by mass, and the following t is at least 50 nm: t=[1/(Sw&#xb7;&#x3c1;)]&#xd7;[N/(1&#x2212;N)], wherein Sw is a BET specific surface area (m/kg) of the core particles, &#x3c1; is a specific gravity (kg/m) of the high-conductive metal, and N is (mass of the high-conductive metal/total mass of the conductive particles).

Anisotropic conductivity connector, conductive paste composition, probe member, and wafer inspection device, and wafer inspecting method

Anisotropically conductive connector, its manufacture method and probe member

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Tokyo, Japan

Koji Seno