Fujitsu Semiconductor Limited

Fujitsu Microelectronics Limited

Koji Sawahata

Masataka Mizukoshi

Eiji Yoshida

Akira Takashima

Takao Nishimura

Hiroshi Aoki

Toshiyuki Honda

Susumu Moriya

Shigeo Iriguchi

Izumi Kobayashi

Mitsuhisa Watanabe

Yoshito Akutagawa

Takao Ohno

Masanori Onodera

Masashi Takenaka

Katsuro Hiraiwa

A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.

Semiconductor device suitable for a stacked structure

A camera module includes a module structure constituted by a lens unit to which an image pickup lens is attached and a package to which an imaging element is attached so as to be opposite to the image pickup lens. An optical filter is arranged between the imaging element and the image pickup lens. A portion of a flat surface of the optical filter is fixed to a filter fixing portion via an adhesive. The optical filter is adhered to the filter fixing portion in a state in which an end portion formed by a side surface of the optical filter and the flat surface is in noncontact with the filter fixing portion or the adhesive. Minute particles generated from a cut surface of the optical filter fall outside the filter fixing portion.

Camera module equipped with an optical filter having an edge not in contact with a fixing portion

In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible substrate is bent along each face of case bodyso as to surround case body. By bending the flexible substrate, a load applied to the flexible substrate is received at the bent portion of the flexible substrate, there is formed a structure hard to transmit the load to the bonding portion to the external connection terminal. Further, by fixing the case body to a portion of the flexible substrate with an adhesive agent, etc., there is formed a structure not to transmit a stress to the direction of peeling the flexible substrate from the external connection terminal. Also, the case body is covered with the flexible substrate equipped with an electromagnetic wave shield material.

Imaging apparatus

Growing community of inventors

Kawasaki, Japan

Koji Sawahata