Canon Kabushiki Kaisha

J-data Co., Ltd.

Canon Denshi Kabushiki Kaisha

Koji Sasaki

Seiichiro Yaginuma

Kazuhiro Asai

Jun Yamamuro

Keiji Matsumoto

Kenji Fujii

Kunihito Uohashi

Ryotaro Murakami

Masahisa Watanabe

Shingo Nagata

Tomohiko Nakano

Keiji Edamatsu

Haruka Nakada

Kouji Hasegawa

Masataka Nagai

Tetsuya Ban

Yoshinori Tagawa

Satoshi Ibe

Toshiaki Kurosu

Masafumi Morisue

Shinji Kishikawa

Masahiro Suzuki

Shuji Koyama

Kazuo Kishino

Hideyuki Yano

Masaki Ohsumi

Junri Ishikura

Junichi Takahashi

Hiroto Komiyama

Norihiko Ochi

Yaomin Zhou

Makoto Miyagi

Nobuhiro Arai

Zhou Yaomin

Atsushi Ito

A water-repellent member includes a base layer formed on the substrate, projections dispersedly arranged on the base layer, a first water-repellent material provided on the base layer in contact with the base layer, and a second water-repellent material provided on the projections in contact with the projections. The first water-repellent material and the second water-repellent material are perfluoropolyether compounds. An oxygen concentration of the base layer is lower than an oxygen concentration of the projections.

Water-repellent member, inkjet head, method of manufacturing water-repellent member, and method of manufacturing inkjet head

A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.

Liquid ejection head and process for producing liquid ejection head

A method for manufacturing a laminated structure, or a method for manufacturing a liquid ejection head substrate having an electrode pad, including: preparing a substrate on which a first layer is formed, foreign matter being present on a surface of the first layer; forming a mask layer on an entire area of a surface of the substrate, the surface of the substrate being provided with the first layer; removing at least a part of the foreign matter in a height direction by performing an etching treatment on the entire surface of the mask layer; and forming a second layer on a surface on which the etching treatment is performed, wherein the etching treatment is performed so that the foreign matter is not exposed from the second layer after forming the second layer.

Method for manufacturing laminated structure and method for manufacturing liquid ejection head substrate

When a first member transmits information on a network, a converted first hash code which includes a member ID of the first member is given. When a second member further transmits and diffuses the information transmitted from the first member, the converted previous first hash code which includes the member ID of the first member is associated with a converted second hash code which includes a member ID of the second member. When the still other member accesses the information transmitted by the second member, the second member is specified from the second hash code and the first member is specified from the first hash code associated with the second hash code.

History management method

A liquid ejecting head which has a supply path that is used to supply a liquid and a circulation flow path that branches from the supply path and is joined to the supply path again, and communicates with an ejection orifice for ejecting the liquid. The circulation flow path has an energy generating element that is provided facing the ejection orifice and generates energy for ejecting the liquid, and a liquid feed element that is used to circulate the liquid. The energy generating element and the liquid feed element are located at different distances from the supply path, and the circulation flow path has a pressure chamber provided with the energy generating element at a position farthest from the supply path.

Liquid ejecting head

A liquid discharge head includes a discharge port member including a discharge port, a flow path member including a pressure chamber and a liquid flow path, a substrate, and a structure that is arranged on the substrate on an upstream side of a center of the discharge port and that is configured to generate a flow of the liquid toward the discharge port. The liquid in the pressure chamber circulates. A position corresponding to a portion of the structure having a greatest height from a surface of the substrate is located on the upstream side of the center of the discharge port in a flow direction of the liquid. A thickness of the structure in a discharge direction of the liquid is 0.1 times or greater than a thickness of the liquid flow path in the discharge direction of the liquid.

Liquid discharge head and manufacturing method of the same

In a liquid discharge head, a first pump and a second pump are arranged inside a channel, the channel includes a pressure chamber including an energy generating element, and liquid inside the pressure chamber is circulatable between inside and outside of the pressure chamber by the first pump or the second pump. The first pump is arranged on one side relative to a midpoint of the channel in an extending direction of the channel, and the second pump is arranged on another side relative to the midpoint of the channel in the extending direction of the channel.

Liquid discharge head

A method of manufacturing a semiconductor substrate includes: forming a barrier metal layer on a semiconductor substrate; forming a resist mask on the barrier metal layer; performing dry etching on a portion of the barrier metal layer, which is exposed from an opening portion of the resist mask, so that the dry etching is prevented from reaching a top surface of a layer immediately under the barrier metal layer; performing wet etching on a portion of the barrier metal layer exposed by the dry etching so that the wet etching reaches the top surface of the layer immediately under the barrier metal layer and a portion of the barrier metal layer remains; and stripping the resist mask.

Method of manufacturing semiconductor substrate and method of manufacturing substrate for liquid ejection head

To manufacture a liquid ejection head, a film having a lower surface free energy than a surface free energy of a substrate is first formed on an inner face of a liquid supply port. Next, a dry film to be a flow path forming member is attached to cover the surface of the substrate, and then a member to be an ejection orifice forming member is provided on the surface of the dry film.

Method of manufacturing liquid ejection head and method of manufacturing structure

A method for manufacturing a liquid discharge head includes a transferring step of transferring a dry film supported by a supporting member to a substrate having a hole, and a peeling step of peeling the supporting member off the dry film on the substrate. In the peeling step, the dry film is in contact with a wall surface defining the hole in the substrate.

Method for manufacturing liquid discharge head

There is provided a transfer method for transferring a member formed on a film held on a frame jig to an object including: attaching the member formed on the film to the object in a first direction; and delaminating the film from the object in a second direction intersecting with the first direction, wherein a rigidity of the frame jig in the first direction is higher than that of the frame jig in the second direction.

Transfer method, manufacturing method of liquid ejection head, and frame jig

Growing community of inventors

Nagareyama, Japan

Koji Sasaki