Panasonic Intellectual Property Management Co., Ltd.

Koji Sakurai

Toshihiko Nagaya

Shinji Yamamoto

Hiroyuki Fujiwara

Tetsuya Tanaka

Masanori Ikeda

Naoki Azuma

Yoichi Makino

Shuuichi Kubota

Hideaki Katou

Shigeo Ogata

Masahiko Akasaka

Yoshinori Konda

Hideki Sumi

Syoichi Nishi

Kimio Iizuka

Hiroshi Murata

Kenichi Ichikawa

Kimio Ilzuka

A method for manufacturing a mounting board includes a first outer shape position acquisition step, a feature portion position acquisition step, a calculation step, a holding step, a second outer shape position acquisition step, and a mounting step. In the first outer shape position acquisition step, a first outer shape position of a component is acquired. In the feature portion position acquisition step, a position of a feature portion is acquired. In the calculation step, a deviation amount of the position of the feature portion with respect to the first outer shape position is calculated. In the second outer shape position acquisition step, a second outer shape position of the component is acquired. In the mounting step, the feature portion of the component is mounted to be positioned on a target position of a board based on the second outer shape position and the deviation amount.

Method for manufacturing mounting substrate, and component mounting device

A component mounting device is configured to mount, on a substrate, an electronic component having a functional unit. The component mounting device includes a component supply mechanism, a recognition unit, a component mounting mechanism, and a holding position determination unit. The component supply mechanism supplies the electronic component. The recognition unit recognizes a position of the functional unit. The component mounting mechanism holds the electronic component supplied from the component supply mechanism and mounts the electronic component on the substrate. The holding position determination unit determines a holding position of the electronic component by the component mounting mechanism based on the position of the functional unit recognized by the recognition unit.

Component mounting device and manufacturing method for mounting substrate

A light emitting component mounting method for holding a light emitting component with a light emitter by a mounting head and mounting the light emitting component on a board is provided. The method includes energizing the light emitter to emit a light, measuring a luminance distribution of the light emitter and detecting a position of a luminance distribution center in the light emitter based on the measured luminance distribution.

Light emitting component mounting method

In component mounting for mounting a pin connecting component having a pin on a board having a through-hole electrode, a solder paste is printed on the through-hole electrode through a screen mask having an opening corresponding to the through-hole electrode, a flux is transferred onto the pin by holding the pin connecting component and immersing the pin into a flux tank filled with the flux, and the pin onto which the flux is transferred is inserted into the through-hole electrode on which the solder paste is printed to mount the pin connecting component on the board.

Component mounting method, component mounting system, and manufacturing method of component mounting board

There is provided a component mounting method for mounting an electronic component provided with a connecting pin on a board having a through-hole, including inserting the pin of the electronic component into an inner hole filled with solder paste at a first electrode provided in the through-hole to execute a component mounting operation of lowering the pin to a predetermined mounting height position and pulling up the pin once inserted and lowered into the inner hole in the component mounting operation to a preset intermediate height position.

Component mounting method and method for manufacturing component-mounted board

A lower surface of a board arranged at a working position is supported by a board supporter, and heights of a plurality of portions of the lower surface of the board are measured by a plurality of height measuring instruments attached to the board supporter. A component is installed on the board by control of a height of the installation of the component by an installation head and with respect to the board, which has the lower surface supported by the board supporter, being performed based on the height of the plurality of portions of the lower surface of the board measured by the plurality of height measuring instruments.

Component placement machine and component placement method

A substrate conveyance mechanism that includes conveyance units and a working area length change part to easily change the types of substrates to allow substrates of different lengths to be selected to mount electronic components onto the substrate. The conveyance units include a working area for substrates having different length that are conveyed from a stand-by area, an area length of the working area that is variable in accordance with the length of the substrate, and a stand-by unit corresponding to a stand-by area for the substrate to be carried in to the working area. The working area length change part changes an interval between a commonly used first pulley and one of a plurality of second pulleys selectively used in accordance with the area length of the working area by changing a belt winding path of a conveyance belt wound on the pulleys in the working unit.

Substrate conveyance mechanism and component mounting method

A substrate conveyance mechanism includes conveyance units and a clamp mechanism. The conveyance units include a working unit corresponding to a working area for types of substrates having different sizes of length taken as objects, an area length of the working area being variable in accordance with the sizes of length, and a stand-by unit corresponding to a stand-by area for the substrate to be carried-in to the working area. The clamp members include commonly used first clamp members and second clamp members which are attachable and detachable and are selectively used in accordance with the sizes of length of the plurality of types of substrates in addition to the first clamp members.

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Fukuoka, Japan

Koji Sakurai