Dai Nippon Printing Co., Ltd.

Asahi Glass Company, Limited

Taiyo Yuden Co., Ltd.

Kabushiki Kaisha Audio Technica

Kraft Foods Global Brands LLC

Kraft Foods Group Brands LLC

Canon Kabushiki Kaisha

Fujinon Corporation

Audio-technica Corporation

Koji Otsuka

Takashi Kado

Paul Andrew Cogley

Kathryn Marie Birchmeier

Noriko Sakamoto

Tsuyoshi Ogino

Yumi Shimazaki

Kozo Ando

Kenji Okamura

Takayuki Sekiguchi

Masabumi Ito

Hiroshi Kojima

Daisuke Yoneyama

Takuya Moriya

Kazuhiro Yamauchi

Koji Shimizu

Satoru Nishioka

Yuichi Kikuchi

Tetsuo Hino

Tomoaki Nakamura

Masahisa Yamaguchi

Norifumi Muranaka

Nobuaki Ueki

Hiroshi Yamamoto

Taeko Kanamori

Masaki Imoto

Wakako Yoshimura

Yasunori Honzawa

Seiichiro Komoda

Izumi Kojima

Takashi Nakagome

Yukitaka Aoki

Nana Sugimoto

A method for manufacturing an electronic component comprises a step of forming an intermediate body including an insulator containing a resin and a conductive main body provided inside the insulator. The method further includes a step of forming an external electrode provided on the intermediate body and electrically coupled to the conductive main body. The method further includes a step of oxidizing the conductive main body, after forming the intermediate body including the insulator and the main body provided inside the insulator, to form an outer coating film on at least a part of a peripheral surface of the conductive main body.

Method for manufacturing an electronic component

An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator is made of a material containing resin. The insulator includes a first insulating layer that has a first bonding surface perpendicular to one axial direction and a second insulating layer bonded to the first bonding surface. The internal conductor includes a plurality of first via conductive members provided in the first insulating layer and a plurality of second via conductive members provided in the second insulating layer. Each of the first via conductive members has a first contact connected to the corresponding second via conductive member at a position offset in the one axial direction with respect to the first bonding surface.

Electronic component and method of manufacturing the same

An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator may be formed of a material that contains resin. The internal conductor is provided inside the insulator and includes a conductive main body and an outer coating film that is provided on at least a part of a peripheral surface of the conductive main body and has a resistivity higher than the conductive main body. The external electrode is disposed on the insulator and electrically coupled to the internal conductor.

Electronic component

A headphone includes a driver unit, the first housingthat forms a first air chamberon a back side of the driver unit, the second housingthat forms a second air chamberon an opposite side of an inner surface different from an inner surface where the driver unitis provided in the first housing, and a damperprovided in the second housing. In the first housing, an openingthat communicates between the first air chamberand the second air chamberis formed.

Headphone

A headphone includes a feedback microphone that receives a front air chamber sound including an external sound, the feedback microphone being provided on a front air chamber side, a driver unit that emits a noise-canceling sound into the front air chamber, the noise-canceling sound canceling at least a part of the sound included in the front air chamber sound received by the feedback microphone, a balanced microphone that receives the noise-canceling sound emitted from the driver unit, the balanced microphone being provided in a region on a side of the driver unit opposite the front air chamber, and a sound generating part that generates the noise-canceling sound by adding a signal based on the noise-canceling sound received by the balanced microphone to a signal based on the front air chamber sound received by the feedback microphone.

Noise-cancelling headphone

A noise-cancelling headphone is provided that avoids an influence of the wind and prevents degradation in the sound quality of the reproduced sound output from a driver unit. The noise-cancelling headphone includes an ear piece including a housing unit having an interior and an exterior, a driver unit attached to the housing unit, and a microphone collecting external sounds at the exterior of the housing unit. The housing unit includes an accommodating portion accommodating the microphone and a sound collecting hole establishing the communication between the accommodating portion and the exterior of the housing unit. The accommodating portion is disposed in an upper portion of the housing unit of the noise-cancelling headphone when worn by the user. The sound collecting hole is open toward the upper side of the housing unit of the noise-cancelling headphone when worn by the user.

A noise-cancelling headphone is provided that prevents degradation in the sound quality of the sound output from the driver unit caused by the sounds leaking through the vent hole for adjusting the sound quality. The noise-cancelling headphone includes a housing unit having an interior and an exterior, a driver unit attached to the housing unit, and a microphone collecting sound at the exterior of the housing unit. The housing unit includes an accommodating portion accommodating the microphone and a vent hole establishing communication between an air chamber behind the driver unit and the exterior of the housing unit. The housing unit is constructed such that emitted sounds from the vent hole are prevented from being collected by the microphone.

In an embodiment of a ceramic electronic component, an external electrodeof a capacitorhas one first planar part SEa of roughly rectangular profile positioned on a surface that specifies the length dimension of the ceramic chip, as well as four second planar parts SEb of roughly rectangular profile positioned on both surfaces that specify the height dimension, and both surfaces that specify the width dimension, of the ceramic chipand also continuing to the first planar part SEa. The second planar part SEb is constituted by a baked metal filmformed on the exterior surface of the ceramic chipand a plated metal filmformed on the exterior surface of the baked metal filmvia an adhesive force mitigation film

Ceramic electronic component

A multi-component package is provided which enables simultaneous heat cooking of a food product which does not require a long cooking time and a food product which requires a longer cooking time. The multi-component package includes a lower container including a bottomed, lower container main body for containing a first food product. The container further includes an upper container including an upper container main body for containing a second filled food product. A flange of the lower container main body and a flange of the upper container main body are engaged with each other so that the lower container and the upper container are combined integrally. A vapor vent is provided in a lower container lid material, whereby water vapor generated upon heating of the first food product heats the second food product in the upper container.

Multi-component food packaging for microwave oven

The electroconductive member has an electroconductive support and a surface layer formed on the electroconductive support, wherein the surface layer has a porous body having a continuous open pore, and the electroconductive member satisfies the following (1) and (2): (1) in a specific condition, a surface potential of the electroconductive member, after an elapse of 10 seconds since a completion of a discharge is 10 V or more; and (2) when applying a direct voltage between a polyethylene terephthalate film as a member to be charged and the electroconductive member, and charging the polyethylene terephthalate film, |Vd|&#x2267;|Vin|&#x2212;|Vth| is satisfied within a range of |Vin|&#x3e;|Vth|, wherein, Vd represents a charge potential of the polyethylene terephthalate film, Vin represents a voltage applied between the electroconductive member and the polyethylene terephthalate film, Vth represents a discharge starting voltage.

Electroconductive member with a surface layer including a porous body having a continuous open pore

A multi-component package is provided which enables simultaneous heat cooking of a food product which does not require a long cooking time and a food product which requires a longer cooking time. The multi-component package includes a lower container having a bottomed, lower container main body for containing a first food product. The container further includes an upper container having an upper container main body for containing a second filled food product. A flange of the lower container main body and a flange of the upper container main body are engaged with each other so that the lower container and the upper container are combined integrally. A vapor vent is provided in a lower container lid material, whereby water vapor generated upon heating of the first food product heats the second food product in the upper container.

A glass substrate obtained by a method including measuring flatness of a glass substrate surface and measuring concentration distribution of dopant in the substrate. Processing conditions of the surface are set up for each site of the substrate based on results from the measuring the flatness and the measuring the distribution, and the finishing is carried out while keeping an angle formed by normal line of the substrate and incident beam onto the surface at from 30 to 89&#xb0;. The surface is subjected to second finishing for improving an RMS in a high spatial frequency region. The surface after the second finishing satisfies the requirements: an RMS slope in the region that 5 &#x3bc;m&#x3c;&#x3bb; (spatial wavelength)&#x3c;1 mm is not more than 0.5 mRad and an RMS slope in the region that 250 nm&#x3c;&#x3bb; (spatial wavelength)&#x3c;5 &#x3bc;m is not more than 0.6 mRad.

Method for finishing surface of preliminary polished glass substrate

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Tokyo, Japan

Koji Otsuka