Nippon Kayaku Kabushiki Kaisha

Koji Nakayama

Minoru Yokoshima

Yoshihiro Kawada

Yasumasa Akatsuka

Katsuhiko Oshimi

Hiroo Koyanagi

Chie Umeyama

Syouichi Tomida

The present invention relates to an epoxy group-containing silicon compound which is obtained by condensing at least one epoxy group-containing alkoxy silicon compound per se represented by the general formula (1a): RSi(OR), wherein Rdenotes a substituent having an epoxy group and Rdenotes an alkyl group having at most 4 carbons, or said compound and at least one substituted alkoxy silicon compound represented by the general formula (1b): RSi(OR), wherein Rdenotes an alkyl group having at most 10 carbons, an aryl group or an unsaturated aliphatic residue and Rdenotes an alkyl group having at most 4 carbons, in the presence of a basic catalyst.

Epoxy group-containing silicon compound and thermosetting resin composition

A photosensitive resin (A) consisting substantially of a product obtained by reacting a polyester (c) which is a reaction product of a polyol (a) with a tetrabasic acid dianhydride (b) with a compound (d) having an ethylenically unsaturated group and an epoxy group in the molecule; an alkali-soluble photosensitive resin (AA) obtained by reacting the photosensitive resin (A) with a di- or tri-basic acid mono-anhydride (e); photosensitive resin compositions prepared by incorporating the above photosensitive resin with a diluent (XX), a crosslinking agent (B) and/or a photopolymerization initiator (C); products of curing of the compositions; and articles equipped with these products. The resins and resin compositions give cured articles which are suitable for the formation of optical waveguides and excellent in processability, transparency, developability, close adhesion, resistance to soldering heat, and so on.

Photosensitive resins, resin compositions and products of curing thereof

The object of the present invention is to provide an epoxy resin and epoxy resin composition having a low viscosity which can afford a cured product having an excellent heat resistance. The present invention is characterized by using an epoxy resin which is obtained by reacting 5-methylresorcin with epihalohydrin in the presence of alkali metal hydroxide.

Epoxy resins, epoxy resin mixtures, epoxy resin compositions and products of curing of the same

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Saitama, Japan

Koji Nakayama