Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Koji Nakashima

Toshiyuki Nakata

Tomio Marui

Toyokazu Yoshino

Keiichi Nakao

Katsuya Okamoto

Tsunetsugu Imanishi

Shinobu Kamizuru

Shinji Morimoto

Etsuo Tsujimoto

Michihiro Miyauchi

Fumiaki Hashimoto

Yoshiyuki Miyoshi

Satoru Taniguchi

Toshiyuki Taniguchi

Naoki Hashimoto

Tsukasa Suzuki

Satoru Inaba

Kiyoshi Takagi

Tohru Ohnishi

Katsunori Omura

Hitoshi Kouno

The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.

Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board

In a transformer including a coil part having a first bobbin to which a coil is mounted, a second bobbin to be fitted to the first bobbin combined to each other, the coil part being sandwiched between magnetic cores from above and below, the first bobbin includes at least one lead drawing through holes on a periphery on the inner peripheral side of a coil mounting surface, and at least one of coil-drawn-leads of the coil is drawn through the lead drawing through hole. With this transformer, coming out of the coil-drawn-lead, displacement, and erroneous wiring are prevented, and hence the inserting capability of the coil is improved. Therefore, the workability is remarkably improved, and hence a product which is low in price can be provided.

Transformer

A flexible printed wiring board has a configuration which is equipped with a solder resist portion formed by coating through the use of a screen printing method on a region including a component mounting portion of a conductor pattern, and a cover lay film pasted in such a manner that an outer circumference portion of an opening portion overlaps an upper portion of a circumference portion of the solder resist portion. A manufacturing method of a flexible printed wiring board of the invention has a configuration which is equipped with a conductor pattern forming process, a solder resist forming process, and a cover lay film pasting process.

Flexible printed wiring board and manufacturing method thereof

In a power conversion module device of the present invention, a transformer, a primary power element and a secondary power element are mounted on a printed wiring board in surface-to-surface contact therewith, and no control circuit is mounted thereon. In addition to reducing impedance and loss in the wiring, this constitution improves the voltage waveform of the primary power element. Thus, noise reduction can be achieved. Further, because heat can be transferred to the printed wiring board, heat generated from the transformer, the primary power element and the secondary power element can be reduced. The size of the transformer can also be reduced.

Power conversion module device and power unit using the same

A multilayered coil is formed by inserting insulating paperhaving either a pressure sensitive adhesive or an adhesive disposed on both faces thereof into at least one place between thin coil layers and then magnetic coresare mounted to the multilayered coil from above and below. Thus, a thin transformer for a switching power supply is provided, in which variation in distance between coiland coil, of which one is disposed over the other, variation in distance of coiland coilfrom magnetic coreand the like are suppressed.

Low-profile transformer and method of manufacturing the transformer

The present invention relates to a choke coil utilized in a variety of electronic products both for industrial use and consumer use, and aims to provide a choke coil that is thinner in size, accommodates a larger current, provides better efficiency in assembly and higher reliability. The choke coil of the present invention comprises a closing magnetic core having a center magnetic leg, an outer magnetic leg and a common magnetic yoke. A coreless coil winds a plate-type wire around the center magnetic leg of the closing magnetic core to form itself, and is mounted to the closing magnetic core. At least one terminal coupled to an inner turn of the coreless coil out of terminals coupled to both ends of the plate-type wire of the coreless coil is led out from a notch provided on one side of the common magnetic yoke of the closing magnetic core.

Choke coil

A method of manufacturing fine pattern of the invention comprises (a) a step of manufacturing a master substrate having a film of precious metal or an alloy thereof formed as an insoluble electrode on the electrode, (b) a step of forming a fine pattern film on the insoluble electrode with anion type electro-deposition, and (c) a step of exfoliating and transferring the fine pattern film onto another substrate. Another method of manufacturing fine pattern further includes a step of manufacturing a master substrate, of which a surface is provided with at least a repeatedly reproducible sacrificial electrode. Still another method of manufacturing fine pattern includes a step of forming a pattern electrode on a conductive substrate by electro-forming, and transferring the electrode onto another substrate. Yet another method of manufacturing fine pattern includes a structure wherein a transparent section is provided in a portion of a master substrate in order to facilitate a positional alignment. The invention provides reliable and accurate mass production of fine-line and high-density films of fine pattern having good transfer ability and durability at low cost. A fine-line and high-density printed circuit board can be made at low cost with the methods of manufacturing fine pattern as disclosed above.

Method of manufacturing fine pattern and printed circuit board manufactured with this method

Growing community of inventors

Mie, Japan

Koji Nakashima