Matsushita Electric Industrial Co., Ltd.

Koji Matsunaga

Yukio Nishikawa

Kenzo Hatada

Akira Takara

Mamoru Takeda

Takao Inoue

Tomizo Matsuoka

Junji Ikeda

Masaru Yoshida

Ikunori Kobayashi

Naohiro Shikata

Keinosuke Kanashima

Norihide Higaki

Kazuyoshi Nakamura

Keizou Matsumura

Takayuki Nagahara

Mitsuharu Kamikawaji

There is provided a magnesium alloy molded product being excellent in corrosion resistance. The magnesium alloy molded product being excellent in corrosion resistance and capable of being easily recycled is manufactured by forming an aluminum layer on a surface of a magnesium alloy molded body and then forming an anticorrosive film layer on the surface of the aluminum layer. In addition, a magnesium alloy molded product being excellent in corrosion resistance and having a brilliant anticorrosive structure is manufactured by forming a transparent anticorrosive film consisting of an organic acid amine salt on a cut surface of a magnesium alloy molded body and then forming a transparent painted film on the transparent anticorrosive film.

Magnesium alloy molded product and method for manufacturing the same

There are provided a painted structure of a magnesium alloy molded product having an aesthetic appearance, a painting method of forming the patented structure of the magnesium alloy molded product having an aesthetic appearance, and a casing fabricated using the magnesium alloy molded product. The painted structure of the magnesium alloy molded product has flow marks of which maximum depth is 100 &mgr;m and maximum opening width is 0.5 mm. An anticorrosive film is formed on a surface of the magnesium alloy molded product, and a painted film having an average surface roughness of 10 &mgr;m or more and a thickness of 80 &mgr;m or more is formed on a surface of the anticorrosive film.

Method of manufacturing magnesium alloy molded product, painted structure thereof, method of painting the same, and casings using the same

A method and an apparatus for bonding optical disk substrates, includes placing a pair of optical disk substrates on a stage while securing a height difference at an upper face of the stage loading the substrates between an upper face at a side of a center of the substrates and an upper face at a side of an outer circumference of the substrates. The method and the apparatus also includes photosetting the adhesive layer on the stage by irradiating a setting light to the substrate pair, thereby photosetting the adhesive layer and bonding the substrates.

Method and apparatus for bonding optical disk substrate

A plasma display panel includes a light-transmittable first substrate, a plurality of first electrodes provided in correspondence with pixels on the first substrate and partition walls provided on the first substrate so that each of the partition walls surrounds at least a part of one of the first electrodes. A Fluorescent layer is formed at a portion surrounded by the partition wall where the first electrode is located in such a manner that the first electrode surrounded by the partition wall is exposed by curing and baking a fluorescent ink having a photo-setting resin and an illuminant as its main ingredients. A light-transmittable second substrate is arranged in contact with the partition wall oppositely to the first substrate, and light-transmittable or opaque second electrodes are arranged on the second substrate oppositely to the first electrodes.

Plasma display panel and method for manufacturing the same

A thin-film transistor array is suited for the manufacture of an image display utilizing liquid crystal. In the thin-film transistor array, a first electrically conductive layer made principally of aluminum is selectively formed on one surface of a substrate. The first electrically conductive layer contains, as an impurity, a high-melting point metal which can be anodized. An oxide layer is formed by an anodization process on the first electrically conductive layer, and the first insulating layer is formed on the oxide layer so as to overlay the substrate. Furthermore, a first semiconductor layer made principally of silicon is selectively formed on the insulating layer, and a pair of second semiconductor layers made principally of silicon containing phosphorus are formed on the first semiconductor layer. A pair of second electrically conductive layers are formed on the paired second semiconductor layers, respectively.

Thin-film transistor array with anodic oxide for use in a liquid crystal

A display panel assembly has a display panel, a printed circuit board, a plurality of semiconductor devices, and a plurality of film carrier tapes. The display panel has a plurality of electrodes. The printed circuit board is mounted on the display panel. The semiconductor devices are disposed between the electrodes of the display panel and the printed circuit board. Each film carrier tape has an opening and first and second lead group which extend from the tape in two opposite directions. Each lead group has a plurality of leads. One end of each lead group projects from the tape, and other end of each lead group projects into the opening. Each semiconductor device is mounted on a tape and is pressed to contact the electrodes. The one end of the second lead group is connected to the printed circuit board.

Display panel assembly having a plurality of film carrier tapes on each

A film carrier on which semiconductor devices are disposed and which is excised so as to have a predetermined size and has leads in at least two directions is placed on a connecting frame member which has a cushion material at one end and in which a circuit substrate is fixed to the other end. The lead at one end of the film carrier is disposed on the cushion material and the opposite surface of this lead contacts with a group of external lead-out electrodes of the flat device mounted on the cushion material. The lead at the other end of the film carrier is connected to the circuit substrate. A supporting frame member is fixed to the connecting frame member such that it comes into pressure contact with the opposite surfaces of the group of external lead-out electrodes of the flat device.

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Katano, Japan

Koji Matsunaga