Kabushiki Kaisha Toshiba

Fuji Electric Co., Ltd.

Ebara Corporation

Central Japan Railway Company

Fujitsu Corporation

Olympus Corporation

Toshiba Memory Corporation

Ihi Corporation

Hino Motors, Ltd.

Koji Maruyama

Hideo Ando

Shinichi Kikuchi

Kazuhiko Taira

Yoshiyuki Ishizawa

Toshiaki Sato

Kazuo Konishi

Shimpei Yoshioka

Mitsuru Miyazaki

Yoichi Kobayashi

Atsushi Shigeta

Takaaki Tanaka

Noburu Shimizu

Shunsuke Nakai

Takeshi Sakurai

Michio Tamate

Tomoyuki Maekawa

Shinro Ohta

Eiji Hirai

Mitsutaka Kuwabara

Kaoru Hamaura

Tomotaka Nishijima

Ryuichiro Mitani

Satoshi Kataoka

Hiroaki Unno

Hideki Endo

Yuichi Sato

Hisashi Yamada

Ryuji Yamada

Seigo Ito

Minoru Kowada

Hiromichi Kobori

Hiroharu Satoh

Naobumi Seo

Toshiaki Murai

Tadashi Sawada

Yoshiyasu Hagiwara

Setsuo Terasaki

Takaaki Suyama

Masayuki Tobikawa

Ayako Saga

Takao Matsuda

Ayako Ichinose

Tetsuichi Kominami

Syoji Tominaga

Yu Eto

Yukihiro Ando

Hiroaki Matsubara

Yasutaka Kishimoto

Takashi Suzuki

When a tip of a blade cascade is ground with a grindstone, a jig is inserted between blade cascades of a blisk and a jig is inserted between blade cascades. A blade locking section of the jig locks with a side section in the width direction of a corresponding rotor blade via a damping member made from rubber or the like. A disk locking section of the jig locks with a disk of the blade cascade which the blade locking section locks with.

Method for grinding tip of rotor blade, and jig for grinding up of blisk

A substrate cleaning deviceincludes a substrate holding unitconfigured to hold a substrate W, a first cleaning unithaving a first cleaning membercaused to come into contact with a first surface WA of the substrate W held by the substrate holding unitto clean the first surface WA, a second cleaning unithaving a second cleaning membercaused to come into contact with the first surface WA of the substrate W held by the substrate holding unitto clean the first surface WA, and a controllerconfigured to control the first and second cleaning unitsso that, when any one of the first cleaning memberand the second cleaning membercleans the first surface WA of the substrate W held by the substrate holding unit, the other cleaning member is at a position apart from the substrate W held by the substrate holding unit

Substrate cleaning device, substrate cleaning apparatus, method for manufacturing cleaned substrate and substrate processing apparatus

A power converter in which a plurality of semiconductor switches are connected to a drive circuit configured to control states of the semiconductor switches, the power converter including: a plurality of semiconductor switches having the same reference potential; a drive circuit configured to control states of the plurality of semiconductor switches; and a multilayer substrate in which a wiring that connects the drive circuit and the plurality of semiconductor switches and includes a reference potential wiring and a control signal wiring is disposed, wherein, in the multilayer substrate, the reference potential wiring and the control signal wiring are disposed in different layers at positions overlapping in a substrate lamination direction, and within the wiring, in a common wiring portion from the drive circuit to a branch point of the wiring and a branch wiring portion from the branch point to each of the semiconductor switches, an impedance of the common wiring portion is set to be lower than an impedance of the branch wiring portion and wiring impedances of the branch wiring portions are matched to each other.

Power converter

A processing end point detection method detects a timing of a processing end point (e.g., polishing stop, changing of polishing conditions) by calculating a characteristic value of a surface of a workpiece (an object of polishing) such as a substrate. This method includes producing a spectral waveform indicating a relationship between reflection intensities and wavelengths at a processing end point, with use of a reference workpiece or simulation calculation, based on the spectral waveform, selecting wavelengths of a local maximum value and a local minimum value of the reflection intensities, calculating the characteristic value with respect to a surface, to be processed, from reflection intensities at the selected wavelengths, setting a distinctive point of time variation of the characteristic value at a processing end point of the workpiece as the processing end point, and detecting the processing end point of the workpiece by detecting the distinctive point during processing of the workpiece.

Processing end point detection method, polishing method, and polishing apparatus

A three-level power converter includes a first module housing a vertical arm forming a three-level power conversion circuit; a second module disposed adjacent to the first module and housing an intermediate arm forming the three-level power conversion circuit; high-potential and low-potential connecting terminal boards each extending vertically, and having a lower end connected to connecting terminals on an upper surface of the first module, and an upper end provided with an external connecting end; and a flat intermediate-potential connecting terminal board extending vertically, and having a lower end connected to connecting terminals on an upper surface of the second module, and an upper end provided with an external connecting end. The high-potential, low-potential, and intermediate-potential connecting terminal boards are stacked close to and parallel to one another. Each of the external connecting ends is connected to a corresponding terminal of a DC capacitor.

Three-level power converter

A power converter in which a plurality of semiconductor switches are connected to a plurality of drive circuits configured to control states of the semiconductor switches includes a first semiconductor switch, a second semiconductor switch, a first drive circuit, a second drive circuit, and a multilayer substrate in which a first wiring, and a second wiring are disposed. In the multilayer substrate, a reference potential wiring and a control signal wiring of the first wiring are disposed in different layers at positions overlapping in a substrate lamination direction, a reference potential wiring and a control signal wiring of the second wiring are disposed in different layers at positions overlapping in the lamination direction, and a wiring length of a portion in which the first wiring and the second wiring overlap in the lamination direction is set to be shorter than either a wiring length of a portion in which the reference potential wiring and the control signal wiring of the first wiring overlap in the lamination direction or a wiring length of a portion in which the reference potential wiring and the control signal wiring of the second wiring overlap in the lamination direction.

A series circuit of capacitors and a series circuit of semiconductor switches such as SiC-MOSFETs are connected in parallel to a direct current power source, and one end of a bidirectional switch formed of semiconductor switches, such as IGBTs, and diodes, such as SiC-SBDs (Silicon Carbide Schottky Barrier Diodes), is connected to a series connection point (an M point) of the capacitors, while the other end of the bidirectional switch is connected to a series connection point of the semiconductor switches, in a three-level inverter that outputs three voltage levels by operating the semiconductor switches so as to satisfy at least one of the condition that the peak value of an alternating current output voltage Vis a value of 80% or more of the voltage of the capacitors and the condition that an output power factor is 0.8 or more.

Three-level inverter employing a bidirectional switch, and modular structure therefor

In a mixing structure with an injectorarrangedimmediately after a bendof an exhaust pipe, urea waterbeing injected by the injectorinto the exhaust pipefor mixing, a pipe diameter Ddownstream of the bendof the exhaust pipeis large relative to a pipe diameter Dupstream of the bend.

Mixing structure

In a power supply device, the bridge circuit is configured by connecting, in parallel, a plurality of series circuits of an inverse-parallel connection circuit of a semiconductor switch and a diode. A control unit controls switching of a semiconductor switch so that a voltage v between AC terminals becomes zero voltage in equal periods &#x3b1; before and after a center point shifted from one zero crossing point in one cycle of the input current by a compensation period (angle) &#x3b2; calculated from a voltage applied to a resonance circuit constituted by the power receiving coil and a resonance capacitor Cand an induced voltage of the power receiving coil, and becomes a positive-negative voltage whose peak value is the voltage Vbetween DC terminals in other periods.

Power supply device

In a power supply device the bridge circuit is configured such that a plurality of series circuits of two inverse parallel connection circuits of a semiconductor switch and a diode are connected in parallel. The power supply device includes a control unit configured to control the semiconductor switch such that a voltage between AC terminals of the bridge circuit becomes a zero voltage only during a prescribed time period before and after two zero crossing points in one cycle of the input current and such that the voltage becomes a positive-negative voltage in which the output voltage is a peak current value during other time periods. Consequently, a power factor of the power receiving circuit is improved and a loss of an entire device is inhibited, and a size and a cost of the entire device may be reduced.

An endoscope apparatus according to the present invention is featured by including: an endoscope which has a connector main body; an apparatus main body to which the connector main body can be detachably mounted; a closed space which, after the connector main body is mounted to the apparatus main body, is formed in exterior housings of the apparatus main body and the connector main body by being closed by the exterior housings; a heat generating portion which is provided in the closed space; and a fan which is provided in the closed space, and performs at least one of dissipation of heat of the heat generating portion to the closed space and transfer of heat in the atmosphere in the closed space to the exterior housing.

Endoscope apparatus

According to one embodiment, a data reproduction apparatus comprises a reproduction module configured to reproduce image data, a resolution selection module configured to select one of resolutions, an image quality mode selection module configured to select on or off state of an image quality mode, a selection disable module configured to disable the resolution selection module to select a prescribed resolution when the image quality mode selection module selects the on state of the image quality mode, and an image processor configured to improve a quality of the image data reproduced by the reproduction module in accordance with the resolution selected by the resolution selection module when the image quality mode selection module selects the on state of the image quality mode.

Data reproduction apparatus and data reproduction control method

Growing community of inventors

Yokohama, Japan

Koji Maruyama