Tokyo Electron Limited

Koji Mahara

Toshiyuki Matsumoto

Tomohide Minami

Yuichi Douki

Issei Ueda

Hiroichi Inada

Tokutarou Hayashi

Hiroyuki Kudou

Yuichi Doki

A position alignment of a transfer point of a transfer arm is performed by using a position detecting method. The method includes: detecting electrostatic capacitances in relation with a reference object for position alignment by a plurality of electrostatic capacitance detecting electrodes provided on a surface of the substrate body; communicating with each electrostatic capacitance detecting electrode and controlling a detection of each electrostatic capacitance detecting electrode; and calculating coordinates (x, y) of the reference object with respect to the substrate body based on a preset relationship between electrostatic capacitance values of multiple electrostatic capacitance detecting electrodes and a position of the reference object with respect to the substrate body.

Position detecting method for performing position alignment of transfer point of transfer arm

A position alignment of a transfer point of a transfer arm is performed by using a position detecting wafer capable of being loaded into an apparatus having a thin transfer port. The position detecting wafer S includes an electrostatic capacitance detecting sensorfor detecting an electrostatic capacitance in relation with a reference object for the position alignment. The electrostatic capacitance detecting sensorincludes a plurality of electrostatic capacitance detecting electrodes, each forming the electrostatic capacitance in relation with the reference object; and a control circuitfor controlling a detection of the electrostatic capacitance by each electrostatic capacitance detecting electrode, while communicating with each electrostatic capacitance detecting electrode. The electrostatic capacitance detecting electrodesare provided on a rear surface of the position detecting wafer S, and the control circuitis provided on a front surface of the position detecting wafer S.

Jig for detecting position

A transfer point of a transfer arm is detected accurately and stably by using a position detecting wafer having an electrostatic capacitance sensor. A position detecting wafer S is formed in a wafer shape transferable by a transfer armand includes an electrostatic capacitance sensorfor detecting a relative position with respect to a reference object by detecting an electrostatic capacitance in relation with the reference object for a position detection. The electrostatic capacitance sensorincludes a detection electrodefor forming the electrostatic capacitance in relation with the reference object, and the detection electrodeis installed on a rear surface of a main body of the wafer shape. Installed on the main body is a guard electrodecovering the detecting electrodewhen viewed from a front surface thereof, for blocking an electric field oriented toward the detection electrodefrom the front surface.

In the present invention, a position detecting substrate having a capacitive sensor is supported on a transfer arm and transferred by the transfer arm and mounted on a mounting part. The capacitive sensor on the position detecting substrate then detects a position of a target object on the mounting part to detect a mounting position of the position detecting substrate on the mounting part. Based on the mounting position of the position detecting substrate, the moving position of the transfer arm when transferring a substrate is then adjusted.

Method of adjusting moving position of transfer arm and position detecting jig

A substrate processing system for processing a substrate in accordance with a photolithographic process, comprising a cassette section, a process section having a plurality of process units each processing a substrate, main transfer arm mechanism arranged in a transfer space surrounded by the process section and the cassette section, for transporting substrates one by one not only between a cassette of the cassette section and each of the plurality of process units but also between the plurality of process units, and a loop transfer path movably supporting the main transfer arm means in a lower portion of the transfer space and guiding the main transfer arm means so as to face each of the process units and the cassette section.

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Kumamoto, Japan

Koji Mahara