Sony Corporation

Canon Kabushiki Kaisha

Hitachi, Ltd.

Sony Interactive Entertainment Inc.

Seikosha Co., Ltd.

Yamaichi Electronics Co., Ltd.

Sony Group Corporation

Koji Kikuchi

Koichiro Wanda

Hidekazu Morooka

Kenichi Shirai

Kei Kitagata

Hiroyuki Kayama

Takashi Yagita

Noriyoshi Kurotsu

Masamichi Ohshima

Kentaro Akiyama

Ikue Mitsuhashi

Toshifumi Wakano

Mamoru Suzuki

Hiroshi Horikoshi

Tomohiro Yamazaki

Shigeyuki Baba

Toshiyasu Ito

Shunsuke Maruyama

Yoshinori Honda

Takamasa Araki

Yosuke Takai

Masashi Kuroshima

Junichiro Fujimagari

Shotaro Tada

Motonobu Torii

Masatoshi Nakamura

Yoshinobu Tanigawa

Atsushi Kakimoto

Rei Miyazaki

Hironori Hoshi

Yoshiya Yamada

Masamichi Oshima

Syotaro Tada

A display unit of the present disclosure includes: a plurality of pixels configured to emit emission light different from one another; and an insulating film provided between the plurality of pixels and having a reflective surface with respect to the emission light, in which an angle of the reflective surface of the insulating film is set for each of the pixels.

Display unit, method of manufacturing the same, and electronic apparatus

display unit of the present disclosure includes: a plurality of pixels configured to emit emission light different from one another; and an insulating film provided between the plurality of pixels and having a reflective surface with respect to the emission light, in which an angle of the reflective surface of the insulating film is set for each of the pixels.

According to an embodiment, an LGA socket includes a center substrate, first and second insulator and a plurality of pairs of contacts. The center substrate is configured by a multi-layer structure including a ground layer and a plurality of through holes formed through the center substrate. The first insulator is arranged around the plurality of through holes on an upper surface of the center substrate. The second insulator is arranged around the plurality of through holes on a lower surface of the center substrate. The plurality of pairs of contacts are inserted into the through holes from an upper side and from a lower side of the through holes and are soldered via the through holes to be electrically connected to each other.

LGA socket

A organic electroluminescence device includes: a plurality of pixels each including an organic layer and a second electrode in this order on a first electrode having light reflectivity, and each configured to emit light of one wavelength out of two or more different wavelengths, the organic layer including an organic electroluminescence layer; and a black matrix layer provided on light emission side of the second electrode, and having first apertures for the respective pixels. The black matrix layer has inclined surfaces inside the respective first apertures, and inclination angles of the inclined surfaces are set, based on emission wavelengths of the pixels.

Organic electroluminescence device and electronic apparatus

With an image display apparatus, such as a head-mounted display, the eyes of a user observe an image displayed on a display panel through an eyepiece in an enlarged manner. A microlens array sheet that is one example of an optical element functioning as an optical lowpass filter is inserted in an optical path running from the display panel to the eyepiece.

Wearable display device and image display method

Display unit, method of manufacturing of display unit, and electronic apparatus with improved color productivity

A solid-state imaging device has a sensor substrate having a pixel region on which photoelectric converters are arrayed; a driving circuit provided on a front face side that is opposite from a light receiving face as to the photoelectric converters on the sensor substrate; an insulation layer, provided on the light receiving face, and having a stepped construction wherein the film thickness of the pixel region is thinner than the film thickness in a periphery region provided on the outside of the pixel region; a wiring provided to the periphery region on the light receiving face side; and on-chip lenses provided to positions corresponding to the photoelectric converters on the insulation layer.

Semiconductor device and electronic apparatus including a semiconductor device having bonded sensor and logic substrates

A solid-state imaging device including a plurality of pixel units configured and disposed in an imaging area in such a way that a plurality of pixels corresponding to different colors are treated as one unit, the amount of shift of a position of each of the pixels in the pixel unit being set as to differ depending on distance from a center of the imaging area to the pixel unit and a color.

Solid-state imaging device and electronic apparatus having a light blocking part

A solid-state imaging apparatus including a plurality of phase difference detection pixels configured adjacent to one another; and an isolation structure arranged so as to isolate light entering each of light-receiving units of the plurality of phase difference detection pixels, in which the isolation structure is formed so as to have a inclined side wall surface whose cross section is tapered.

Solid-state imaging apparatus, method of manufacturing the same, and electronic apparatus

An embodiment of the invention provides a solid-state image pickup device, including a pixel portion in which a plurality of light receiving areas corresponding to different wavelengths, respectively, are disposed, and transistors used commonly to the plurality of adjacent light receiving areas in the pixel portion, and disposed so as to be brought near to a side of the light receiving area, corresponding to the shorter wavelength, of the plurality of adjacent light receiving areas.

Solid-state image pickup device and electronic apparatus using the same

Growing community of inventors

Kanagawa, Japan

Koji Kikuchi