Murata Manufacturing Co., Ltd.

Koji Kawano

Koki Kato

Naofumi Enkyo

Tomoshige Furuhi

Akimasa Matsushima

Nobuyuki Nozawa

Shinya Harada

Takehiko Iizuka

Jun Makino

Takashi Watanabe

Kenta Ago

Yutaka Shinza

A grip force estimation device includes a sensor that is attached to sports equipment including a columnar portion having a grip portion at one end and a hitting portion connected to the columnar portion and is attached not at the grip portion but at the columnar portion, and that is configured to detect at least one of bending and twisting of the sports equipment and output detected bending and/or twisting as a sensor signal, a feature data extraction unit configured to extract feature data including a feature when a waveform generated by the hitting portion being externally applied with pressure is attenuated by using the sensor signal, and a grip force estimation unit configured to estimate pressure applied to the grip portion by using the feature data.

Grip force estimation device and grip force estimation method

A composite module includes a plurality of substrates in a housing, prevents deformation of the stated substrates, and has a characteristic with an improved mounting precision of the substrates within the housing. A wireless LAN module as a composite module according to the present invention includes a first substrate (), a second substrate () that is so disposed as opposed to the other principal surface () of the first substrate (), and a housing () that has accommodation sections () and () for accommodating the first substrate () and the second substrate (). Further, substrate-support projections for supporting one principal surface and the other principal surface of each of the first substrate () and the second substrate (), are formed on inner wall surfaces () and () of the accommodation sections () and () in the housing ().

Composite module

A wireless LAN module as a composite module according to the present invention includes a first substrateand a second substratethat is so disposed as opposed to the other principal surfaceof the first substrate. An external connectorfor the connection with an electronic apparatus is mounted on one principal surfaceof the first substrate. An electronic component deviceis mounted on one principal surface of the second substratein a region opposing the external connectorsandwiching the first substratetherebetween. A heat dissipation memberis disposed on a surface which is an opposite side to the mounting-surface of the electronic component device

An electronic apparatus includes a heat-generating device mounted on a surface of a printed circuit board and is surrounded with wall members of a housing. The wall members are connected to a ground electrode on the other surface of the printed circuit board, the ground electrode being disposed over substantially the entire surface under the heat-generating device. Lugs provided in covers are in contact with the respective ends of the wall members. The direction in which each lug is raised (direction from the base to the tip) coincides with the direction from the heat-generating device to a temperature-increase restricted region.

Electronic apparatus

Growing community of inventors

Kyoto, Japan

Koji Kawano