Fujifilm Corporation

Koji Kaseda

Masahiro Kato

Tsuneo Sato

Akihiro Uchida

Atsuhiko Ishihara

Shigeru Kondo

A zener diode is formed in a spacer, which adhered on the semiconductor substrate so as to surround an image sensor, by semiconductor process. A first contact terminal is connected to a CCD output terminal of the image sensor, and a second contact terminal is connected to a ZD ground terminal on the semiconductor substrate. When the ZD ground terminal is connected to ground, the zener diode is actuated. Capacitance components of the zener diode smoothes a waveform of the CCD output so as to prevent an unnecessary radiation noise from generating.

Solid state imaging device

A solid state imaging device is constituted of an image sensor chip, a circuit board, and an electromagnetic-wave absorber formed of copper. The image sensor chip is constituted of a bare chip, a spacer, and a cover glass. First contact terminals are formed on the bare chip, and second contact terminals and GND wires are formed on the circuit board. When manufacturing, the image sensor chip is mounted at a predetermined position on the circuit board, and the first contact terminals and the second contact terminals are connected with bonding wires. The electromagnetic-wave absorber is formed to cover the bonding wires, while its end contacts to the GND wires.

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Saitama, Japan

Koji Kaseda