Asahi Kasei Kogyo Kabushiki Kaisha

Koji Kasai

Kazuo Yoshida

Sumio Ueda

Hiroshi Harada

Masami Tsunetani

A novel thermoplastic resin composition is disclosed, which comprises a polyphenylene ether, a polyamide and a specific block copolymer as main components and has a specific dispersion morphology such that the polyamide forms a continuous phase in which the polyphenylene ether is dispersed and the block copolymer is micro-dispersed in the dispersed phase of the polyphenylene ether. The composition of the present invention has an excellent balance of thermal stability, heat distortion resistance, impact resistance, oil resistance, stiffness, etc., and, hence, is useful as an engineering material in the fields of automobiles, electric and electronic industries.

Thermoplastic resin composition

A thermoplastic resin composition substantially constituted of (A) 25 to 70% by weight of a polyamide, (B) 25 to 70% by weight of a polyphenylene ether and (C) 2 to 25% by weight of a block copolymer having at least one polymer block mainly comprised of a vinyl aromatic compound and at least one polymer block mainly comprised of a conjugated diene compound having the content of the vinyl aromatic compound in the range of 25 to 85% by weight; wherein the polyamide forms a continuous phase, and, in the continuous phase, the polyphenylene ether is dispersed to form a dispersed phase having an average particle diameter ranging from 0.5 to 10 .mu.m, and further, substantially all of the block copolymer is micro-dispersed in the dispersed phase of the polyphenylene ether. The composition is widely used as outerplate materials or wheel caps of automobiles, as electrical or electronical parts, especially the various connectors which are used in automobiles, etc.

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Yokohama, Japan

Koji Kasai