Nec Tokin Corporation

Tokin Corporation

Nec Corporation

Koji Kamei

Shigeyoshi Yoshida

Mitsuharu Sato

Shinya Watanabe

Hiroshi Ono

Norihiko Ono

Yoshio Awakura

Kenji Takamoro

Satoshi Shiratori

Michio Nemoto

Atsushi Furuta

The present invention is a high-frequency current essentially of M&#x2014;X&#x2014;Y, where M is Fe, Co, and/or Ni, X is an element other than M or Y, and Y is F, N, and/or O. The maximum value &#x3bc;&#x2033;of the loss factor &#x3bc;&#x2033; of this material exists at 100 MHz to 10 GHz. A relative bandwidth bwr is not greater than 200% where the relative bandwidth bwr is obtained between two frequencies at which the value of &#x3bc;&#x2033; is 50% of &#x3bc;&#x2033;and normalizing the frequency bandwidth at the center frequency.

High-frequency current suppression body using magnetic loss material exhibiting outstanding complex permeability characteristics

In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) () operates at a high speed in using at a high frequency band, and a predetermined number of terminals () are provided with a high frequency current suppressor () for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor () is a thin film magnetic substance having a range from 0.3 to 20 (&#x3bc;m) in thickness, and is disposed on the entire surface of each terminal (), covering a mounting portion to be mounted on a printed wiring circuit board () for mounting IC () and an edge including a connecting portion to a conductive pattern () disposed on the printed wiring circuit board (). When the top end is connected with the conductive pattern () by means of a solder () in mounting the printed wiring circuit board () of IC (), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.

Electronic component of a high frequency current suppression type and bonding wire for the same

In a heat-shrinkable tube ( ) having a tubular member which is shrinkable in response to heat and has a cylindrical surface, a thin film is formed on at least a part of the cylindrical surface. The thin film is made of a magnetic loss material which has a high magnetic loss characteristic. The thin film has a first phase comprising a first one of Fe, Co, and Ni and has a second phase comprising an insulator containing at least one element other than Fe, Co, and Ni.

Heat-shrinkable tube, heat-shrinkable sheet, and method of shrinking the same

There is provided a composite magnetic tape which can be easily applied irrespective of the inside or outside of an electronic equipment, prevent radiation of undesired electromagnetic waves from the inside of the equipment and reflection into the inside of the equipment, and shield electromagnetic noise from the outside of the equipment. The tape may be in the form of an adhesive tape or a self-welding tape. The tape is constituted of a composite magnetic layer formed by dispersing soft magnetic powder into an organic binding agent. Alternatively, it may have a stacked structure of a composite magnetic layer and a conductor layer.

Composite magnetic tape

In a display device ( A, G, F) having a display window ( ), a magnetic loss layer or layer ( A, C, C) is formed on at least a part of a principal surface of the display window. The magnetic loss layer may be a granular magnetic thin layer which is, for example, made of a magnetic substance of a magnetic composition comprising M, X and Y, where M is a metallic magnetic material consisting of Fe, Co, and/or Ni, X being element or elements other than M and Y, and Y being F, N, and/or O. The magnetic loss layer may be formed in any one selected from mat, lattice, stripe, and speck fashions. The magnetic loss layer may be formed in a mesh fashion.

Light emitting element, plasma display panel, and CRT display device capable of considerably suppressing a high-frequency noise

In an electronic component ( ) comprising an electronic circuit or a circuit element in a metallic case including a case ( ) and a cover ( ), a magnetic thin film ( ) made of a magnetic loss material is provided on at least one part of an inner wall surface of the metallic case. In the magnetic loss material, its composition is represented by M-X&mdash;Y, wherein M denotes at least one of Fe, Co and Ni, X denotes at least one of elements other than M and Y, and Y denotes at least one of F, N and O. The maximum value &mgr;&Prime;max of an imaginary part &mgr;&Prime;, which is an imaginary number component of a complex permeability of the magnetic loss material, exists within a frequency range from 100 MHz to 10 GHz. A relative bandwidth bwr is not greater than 200% where the relative bandwidth bwr is obtained by extracting a frequency bandwidth between two frequencies at which the value of &mgr;&Prime; is 50% of the maximum &mgr;&Prime; and normalizing the frequency bandwidth at the center frequency thereof. It is possible to provide an electronic component including a metallic case, which contains a high-speed operation type of semiconductor device and/or an electronic circuit and in which undesired radiation is reduced.

Electronic component comprising a metallic case provided with a magnetic loss material

In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) ( ) operates at a high speed in using at a high frequency band, and a predetermined number of terminals ( ) are provided with a high frequency current suppressor ( ) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor ( ) is a thin film magnetic substance having a range from 0.3 to 20 (&mgr;m) in thickness, and is disposed on the entire surface of each terminal ( ), covering a mounting portion to be mounted on a printed wiring circuit board ( ) for mounting IC ( ) and an edge including a connecting portion to a conductive pattern ( ) disposed on the printed wiring circuit board ( ). When the top end is connected with the conductive pattern ( ) by means of a solder ( ) in mounting the printed wiring circuit board ( ) of IC ( ), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.

In a connector having at least one contact ( ) held by an insulator ( ), a high-frequency current suppressor ( ) is provided on the contact or the insulator. The high-frequency current suppressor serves to attenuate a high-frequency current flowing through the contact and having a frequency within a frequency band between several tens MHz and several GHz.

Connector capable of considerably suppressing a high-frequency current

For improving a noise characteristic of a printed circuit board excellent in noise characteristic, a magnetic prepreg formed by impregnating a magnetic paint composed of soft magnetic powder and thermosetting resin into a glass cloth is used as a prepreg constituting the printed circuit board. It is preferable that the soft magnetic powder is metal powder being essentially flat. Further, it is preferable that a main component of the thermosetting resin is epoxy resin.

Magnetic prepreg, its manufacturing method and printed wiring board employing the prepreg

An EMI countermeasure component is provided relative to an active element, which does not deteriorate a circuit function of the active element, but has a sufficient shielding effect against permeation of electromagnetic waves radiated to the exterior, and further suppresses a malfunction or the like due to mutual interferences between peripheral components or an electromagnetic induction to a signal line. The EMI countermeasure component is made of a composite magnetic body including soft magnetic powder having oxide films on the surfaces thereof and an organic binding agent, and extinguishes undesired high frequency electromagnetic radiation as heat due to its complex permeability.

EMI preventive part and active device with the same

Compound magnetic material and electromagnetic interference suppressor

Optical fiber cable

A dual-band nonreversible circuit device comprises a first circulator element (91) and a second circulator element (92) accommodated in a single housing (50, 50', 60) and operable around a first center frequency (f.sub.A) and a second center frequency (f.sub.B), respectively. The first circulator element (91) is formed by a combination of a first permanent magnet (31), a first ferrite plate (21) with a first center conductor (11), and a ground conductor plate (40) successively stacked on a lower magnetic yoke (50). Likewise, the second circulator element (92) is formed by a combination of the ground conductor plate (40), a second ferrite plate (22) with a second center conductor (12), and a second permanent magnet (32) successively stacked and covered by an upper magnetic yoke (60). Alternatively, a first circulator element (91') is formed by a combination of a first ground conductor plate (41), the first ferrite plate (21) with the first center conductor (11), and a permanent magnet (30) while the second circulator element (92') is formed by a combination of a second ground conductor plate (42), the second ferrite plate (22) with the second center conductor (12), and the permanent magnet (30).

Growing community of inventors

Kawasaki, Japan

Koji Kamei