Yuyama Mfg. Co., Ltd.

Other

Toray Engineering Company, Limited

Koji Ito

Hirokazu Amano

Toshihiro Mori

Masanori Akita

Yasuyuki Yoshikawa

Hiromichi Tsuda

Richard H Estes

Dai Shimizube

Keigo Nakamura

Minoru Wada

Minoru Nakamura

James Elliott Clayton

Tomohiro Sugimoto

Takayuki Fujikawa

Mei Zhang

Yoshio Nogami

Hiroaki Tsuruta

Maki Matsunaga

Yuta Higuchi

Yoshio Kuramoto

A medicine sorting device includes: a discrimination part for discriminating a type of a medicine based on an image captured by a first camera; and a conveyance/sorting unit for sorting, by each type, a plurality of types of medicines accommodated in a mixed state in a first accommodating part based on a discrimination result of the discrimination part, and storing the medicines in a second accommodating part.

Drug sorting device, sorting container, and drug return method

Provided is a medicine identifying system which enables automatization of medicine identification. A medicine identifying system is constituted of a medicine photographing device and a computer. Medicine identifying software is installed in the computer. At the time of performing medicine identification, a user first sets a medicine to be identified in the medicine photographing device. Next, the medicine photographing device starts to photograph the medicine by using an operation of the user with respect to the computer as a trigger. A photographed image of the medicine is transmitted to the computer as data. Then, the medicine identifying software refers to a database based on this image data to search the medicine.

Medicine photographing device

The present invention has an object to provide a drug packaging device including a printing unit configured to perform printing by jetting ink and being capable of performing the printing on a packaging paper with high printing quality without including a support base or the like for the packaging paper. A drug packaging device () includes a drug supply unit (), a packaging unit (), a packaging paper conveying unit (), and a printing unit (). The printing unit () includes an ink ejection unit () capable of ejecting ink downward. A conveyance path (T) of the packaging paper conveying unit () includes: an intersecting-direction conveyance section (T) for conveying a packaging paper (S) in a direction intersecting an ejection direction of the ink; and a first conveyance direction switching section () and a second conveyance direction switching section () for changing the conveyance direction of the packaging paper (S) on upstream and downstream, respectively, of the intersecting-direction conveyance section (T) in a conveyance direction of the packaging paper (S). The ink ejection unit () is arranged at a position spaced apart upward from the intersecting-direction conveyance section (T) by a predetermined distance.

Drug portion packaging device

Embodiments of the present invention provide a high accuracy medicament inspection device and system to inspect medicaments enclosed in a package with a printing area. The medicament inspection device implements a medicament information detection process that includes: a medicament candidate area extraction step extracting a dark colored area in a back side illuminated image as a medicament candidate area A (assumed presence of medicament); a print candidate area extraction step extracting an area containing the print on the package based on a front side illuminated image as a print candidate area B; a print area identification step specifying an area corresponding to the print contained in the print candidate area B based on the brightness distribution of the back side illuminated image as a print area C; and a medicament area identification step identifying a medicament area X by subtracting the print area C from the medicament candidate area A.

Drug inspection device

A medicine inspection device includes: an inspection unit on which a medicine for inspection is disposed, the medicine being contained in a sachet; an imaging unit capable of photographing the sachet disposed on the inspection unit; and a medicine information detector capable of detecting at least either of a quantity or type of the medicine based on an image obtained by the imaging unit. The inspection unit includes a backlight with illumination areas located dottedly per predetermined pitch which is capable of illuminating the sachet from backside when photographing. The medicine information detector is further configured to implement: a basic image acquisition process for acquiring a basic image; an inspection area defining process for defining the area of inspection; an inspection image acquisition process for acquiring the inspection image; and an image inspection process for performing image inspection.

Medicine inspection device, and medicine packaging device

A medicine inspection device includes an inspection unit for inspecting a medicine disposed on the inspection unit; a vibrator to impart vibration to the medicine disposed on the inspection unit; and a shooting unit capable of photographing the medicine disposed on the inspection unit. The medicine inspection device further includes a medicine information detector capable of detecting at least the quantity or type of the medicine based on an image obtained by the shooting unit and a distribution detector which is configured to detect a distribution of the medicine on the inspection unit based on the image obtained by the shooting unit. The inspection unit includes a plurality of inspection areas where the vibrator independently provides vibration to each inspection area. The medicine inspection device is characterized by operating the vibrator so as to provide vibration in the inspection areas chosen based on the detection result of the distribution detector.

There are disclosed; an active energy beam curing type conductive paste, containing a conductive substance, and an active energy beam polymerizable compound, wherein a cured matter, obtained when a composition of the paste excluding the conductive substance is cured with an electron beam having an acceleration voltage of 150 kV and an irradiated dose of 40 kGy, has an internal stress of 5 to 50 Mpa; a production method and a device for a conductor circuit substrate using the active energy beam curing type conductive paste; and a non-contact ID using the active energy beam curing type conductive paste and a production method for the ID.

Active energy beam curing type conductive paste, production method and device for conductor circuit substrate and non-contact ID and production method thereof

A method of manufacturing a COF package comprises the steps of providing a resin film substrate with a hole for receiving a chip, providing an IC chip having electrodes, inserting the IC chip into the hole so as to fix it with its electrodes exposed above the substrate surface, and forming a circuit pattern on the substrate surface for connection with the electrodes. The hole and the IC chip are tapered, and the IC chip is secured in the hole with sealant or adhesive.

Method of fabricating a COF utilizing a tapered IC chip and chip mounting hole

This noncontact ID card or the like comprises an antenna circuit board having an antenna formed on a substrate and an interposer board having expanded electrodes formed on a substrate where an IC chip is embedded, the expanded electrodes being connected to electrodes of the IC chip, wherein both boards are stacked in such a way that the electrodes of the antenna are joined to the expanded electrodes.

Noncontact id card or the like and method of manufacturing the same

The invention provides processes for bonding a flip chip to a substrate in a manner that maximizes reliability of the bonding operation. Electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened. Electrically conductive polymer bumps are formed on bond pads of a substrate, and a layer of electrically insulating adhesive paste is then applied on the substrate, covering the substrate polymer bumps with the adhesive. The bond pads of the flip chip are then aligned with the bond pads of the substrate and the at least partially hardened flip chip polymer bumps are then pushed through the substrate adhesive and at least partially into the substrate polymer bumps. In a further method, electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened. A layer of electrically insulating adhesive paste is formed on a substrate having bond pads, covering the bond pads with the adhesive. The bond pads of the flip chip are aligned with the bond pads of the substrate, and then the at least partially hardened flip chip polymer bumps are pushed through the substrate adhesive with pressure sufficient for the flip chip polymer bumps to directly contact and deform the substrate bond pads.

Flip chip mounting technique

In a flip chip bonding method, polymer bumps are formed, using a bonding tool, on an IC chip, held via suction to the bonding tool. An insulating adhesive film is pressed onto the upper surface of a circuit board held via suction with a suction stage. Heat is then applied to bring the film into close contact with bond pads of the circuit board. At this point, the bonding tool is moved downward, bonding the polymer bumps to the circuit board electrodes. During the time of this downward movement, bonding of the polymer bumps to the circuit board bond pads can be achieved by piercing the insulating adhesive film with the polymer bumps, and it is found that strong bonding can be achieved with adequate reliability. This method eliminates the need for a process in which through-holes must be pierced in the insulating adhesive film to accommodate the polymer bumps.

The invention provides a flip chip mounting process in which a layer of electrically insulating adhesive paste is applied on a substrate having bond pads, covering the bond pads with the adhesive. Electrically conductive polymer bumps are formed on bond pads of a flip chip to be bonded to the substrate, and the polymer bumps are at least partially hardened. The bond pads of the flip chip are then aligned with the bond pads of the substrate, and the at least partially hardened polymer bumps are pushed through the adhesive on the substrate to contact directly and bond the polymer bumps to the bond pads of the substrate. This process results in direct electrical and mechanical bonding of the polymer bumps between the chip and substrate bond pads, even though the adhesive film was applied on the substrate in a manner that covered the substrate bond pads. The polymer bumps displace the adhesive as they are pushed through it and expand laterally on the substrate bond pads. As a result, the area around the polymer bumps between the chip and the substrate is filled with the adhesive, in the manner of an underfill, whereby a separate, post-bond underfill process is not required.

Growing community of inventors

Toyonaka, Japan

Koji Ito