Nhk Spring Co., Ltd.

Koji Ishikawa

Jun Tominaga

Taiichi Rikimaru

Takahiro Fujii

Keiichi Ito

Osamu Nakayama

Takayuki Katsuumi

A connection terminal for a power module, includes a conductive wire that is wound to form the connection terminal. The conductive wire includes an insertion part, at least a part of which is closely wound and to be inserted into a hollow part of a holding member of the power module, and includes a press-fitting part having a diameter larger than a diameter of the hollow part, a rough winding part in which the wire is wound at a predetermined interval, and a contact part for coming into contact with an external circuit, the contact pert being provided at an end part of the rough winding part on a side different from the end part on a side of the insertion part.

Connection terminal having a press-fitting part inserted into a hollow part of a holding member

A conductive contact unit includes a conductive contact holder, a conductive contact, and an aligning unit. The conductive contact holder includes a first guiding grooves and a second guiding groove opposite to the first guiding groove, each slidably engaging one edge of the conductive contact. The conductive contact has a plate-like shape, and includes a first contacting element and a second contacting element that are brought into contact with different circuitries, a resilient element that is expandable and contractible in a longitudinal direction between the first contacting element and the second contacting element, a first connecting element that connects the resilient element and the first contacting element, and a second connecting element that connects the resilient element and the second contacting element. The aligning unit aligns the conductive contacts.

Conductive contact unit

A conductive contact includes a first contacting element that is brought into contact with one of different circuitries; a second contacting element that is brought into contact with another one of the different circuitries; a resilient element that is interposed between the first contacting element and the second contacting element to be expandable and contractible in a longitudinal direction; a first connecting element that connects the resilient element and the first contacting element; and a second connecting element that connects the resilient element and the second contacting element, and has an opening penetrating therethrough in a through-thickness direction. At least a portion of the resilient element is shorter than the first connecting element and the second connecting element in a width direction perpendicular to the longitudinal direction and the through-thickness direction.

Conductive contact and conductive contact unit

A conductive contact unit includes plate-like conductive contacts for electrically connecting different circuitries. Each conductive contact includes a first contacting element to be brought in physical contact with one circuitry, a second contacting element to be brought in physical contact with another circuitry, an elastic element, between the first contacting element and the second contacting element, a first connecting element that connects the elastic element and the first contacting element, and a second connecting element that connects the elastic element and the second contacting element and that has an opening. The conductive contact unit also includes a conductive contact holder including first guiding grooves and second guiding grooves facing the first guiding grooves. The conductive contact holder holds the conductive contacts with both longitudinal outside ends of each conductive contact being slidably engaged with the first and the second guiding grooves.

Conductive contact unit and conductive contact

A conductive contact unit establishes an electrical connection between different circuitries, and includes a plurality of conductive contacts that receive and output an electrical signal from and to the circuitries, respectively. The conductive contact unit includes a conductive contact holder that accommodates and holds the conductive contacts, and a vibration applying unit that applies vibration to the conductive contact holder.

In a packaging arrangement suitable for semiconductor devices, a semiconductor chip is mounted on a surface of an aluminum base with a bonding layer interposed therebetween. The aluminum base has a capability to favorably dissipate heat from the semiconductor chip. The bonding layer consists of a resilient and heat conductive material such as silicone resin mixed with silver powder so that thermal strain of the metal base is accommodated by the resiliency of the bonding layer, and is prevented from adversely affecting the electronic component chip even though the aluminum base demonstrates a substantially more significant thermal expansion than the semiconductor chip. It is therefore possible to achieve a high reliability in the packaging of semiconductor devices at a minimum cost.

Growing community of inventors

Kanagawa, Japan

Koji Ishikawa