Brother Kogyo Kabushiki-kaisha

Toyota Jidosha Kabushiki Kaisha

Toyota School Foundation

Koji Imai

Shuhei Hiwada

Atsushi Ito

Hirotake Nakamura

Tomoyuki Kubo

Yasuhiro Kato

Shigeru Suzuki

Toru Yamashita

Yuji Shinkai

Kazutsugu Suita

Yoji Yamada

Nuio Tsuchida

Hirofumi Kondo

Naohisa Kinoshita

Motoshi Kishi

Shin Hasegawa

Masayoshi Hayashi

Manabu Yoshimura

Hirosumi Ito

A device for driving a recording head comprises select data input elements, a waveform signal selector, and a drive signal supplier. To the select data input elements, select data sets corresponding to recording elements included in the recording head are inputted in a serial manner. Each one of the select data sets indicates which one among waveform signals is to be employed for a corresponding recording element in a single printing cycle. The waveform signal selector selects, for each of the recording elements, one among the waveform signals on the basis of a corresponding one among the select data sets inputted to the select data input. The drive signal supplier supplies, based on the selected waveform signal, a drive signal to each of the recording elements. The number of the select data input elements is greater than the number of bits included in each of the select data sets. The number of signal lines through which the select data sets are inputted to the select data input elements in a serial manner is the same as the number of the select data input elements.

Device for driving recording head and recording apparatus

A piezoelectric actuator includes a first active portion interposed by an individual electrodes and a first constant electric potential electrode and a second active portion interposed by the individual electrode and a second constant electric potential electrode, and a wiring structure is provided with a wiring board and driver IC. The wiring board is provided with individual lines, a power line, a ground line, a first and second constant electric potential lines, a first short circuit line for short-circuiting the power line and the first constant electric potential line, and a second short circuit line for short-circuiting the ground line and the second constant electric potential line. Accordingly, a liquid droplet discharge head, which is capable of suppressing the crosstalk, is provided. The liquid droplet discharge head has the wiring structure suitable for the head.

Liquid droplet discharge head, liquid droplet discharge apparatus, and method for producing liquid droplet discharge head

In a switch provided in a driver device and connected to a driver, a terminal and a lever is separated from each other (in the separated state) when a predetermined electric potential is not applied to a gate electrode. When a predetermined electric potential is applied to the gate electrode, the lever of the corresponding switch is deformed by electrostatic force between the gate electrode and the lever and comes into contact with the terminal, and thus the terminals are connected with the lever (in the contact state). A plurality of drivers are connected to the terminals of two or more of switches, respectively, and, when a driving potential is outputted from a driver, the driving potential is applied to a surface individual electrode connected to the switch in the contact state.

Driver device and liquid droplet ejection device

Second individual electrodes are formed and arranged in zigzag in two rows on one surface of a flexible sheet, and wirings connected to the second individual electrodes are arranged to pass between adjacent second individual electrodes of the other row. Formed on the other surface of the flexible sheet are electrode connection sections to be connected to the second individual electrodes through through-holes going through the flexible sheet. The electrode connection section has an area larger than the second individual electrode and is connected to an external electrode through solder.

Circuit board for inkjet head

A liquid droplet jetting apparatus includes: a liquid droplet jetting head which jets liquid droplets when an actuator is driven; and a wiring member via which a drive signal is outputted to a surface electrode formed in the actuator. The wiring member includes a substrate, a wire provided on the substrate, and a covering member having an insulating property and covering the wire. The wire has an electrode land which is stacked on the surface electrode to be connected to the surface electrode, and the covering member has a first covering layer in which a first opening to expose the electrode land therein is formed and a second covering layer having a second opening communicating with the first opening and covering the first covering layer. The surface electrode and the electrode land are connected in a state that an electroconductive material is interposed therebetween through the first and second openings.

Liquid droplet jetting apparatus and method for manufacturing liquid droplet jetting apparatus

An electronic device includes an FPC, a circuit chip arranged on the flexible flat cable, a heat sink arranged on the circuit chip to release a heat of the circuit chip, and an elastic member arranged on a lower surface of the FPC. The upper surface of the FPC is large enough to cover a contact surface of the circuit chip. The elastic member does not overlap with an apex portion of the circuit chip, but overlaps with the circuit chip at an inner side of the apex portion. Therefore the elastic member does not press the FPC against the apex portion of the circuit chip. Accordingly, the FPC at a position corresponding to an apex of the circuit chip is suppressed from being distorted, and there is no fear of breaking of wire and exfoliation of the circuit chip.

Electronic device

A wiring pattern having a plurality of terminal lands and leads independently respectively connected therewith is formed on one face of an insulator of a flexible wiring substrate. The insulator is provided with through-holes whereby the terminal lands are exposed on the other side. The terminal lands are electrically connected and fixed on the other face of the insulator by joining with the head terminals of the inkjet head with conductive adhesive, through the through-holes. Isolation between the leads and terminal lands arranged on the one side thereof from the conductive adhesive is provided by the insulator.

Connection structure of flexible wiring substrate and connection method using same

An ink-jet recording apparatus includes an ink supplying member which has an ink storage section, an exhaust section, and a space portion formed between the ink storage section and the exhaust section, an ink-jet head, and two flexible flat cables (FPC) which are drawn in mutually opposite directions from the ink-jet head. One FPC is wired by passing along a side of the ink supplying member, opposite to the exhaust section, and the other FPC is wired by passing through the space portion. Since the FPC is wired avoiding the ink supplying member and the exhaust section, it is possible to eliminate adhering of ink to the FPC, and to eliminate a waste of FPC wiring. Moreover, it is possible to reduce a cost, and to uniformize electrical characteristics of the two flexible flat cables.

Ink-jet recording apparatus

An ink jet printer head including a cavity unit; an piezoelectric actuator; and a wiring substrate. The piezoelectric actuator includes pairs of first common electrode connection pads and pairs of first individual electrode connection pads which are provided on an outer surface thereof such that the two first common electrode connection pads of each of the pairs are located at respective positions symmetric with each other with respect to a first reference point on the outer surface and the two first individual electrode connection pads of each of the pairs are located at respective positions symmetric with each other with respect to the first reference point. The wiring substrate further includes a second common electrode connection pad and a plurality of second individual electrode connection pads which are provided at respective positions assuring that when the wiring substrate takes a first angular phase about a second reference point corresponding to the first reference point, and when the wiring substrate takes a second angular phase differing from the first angular phase by 180 degrees about the second reference point, the second common electrode connection pad is electrically connected to at least one of the first common electrode connection pads and the second individual electrode connection pads are electrically connected to the first individual electrode connection pads, respectively.

Ink jet printer head

A recording apparatus that has a recording head and a flexible printed circuit board. The recording head, which performs recording on a recording medium, has a plurality of recording elements. One end of the flexible printed circuit board has plurality of feeder wires that connect to one of the terminal lands of each of the recording elements. A first common voltage wire connects the other terminal lands of each of the recording elements to a common potential. A drive circuit is attached to the flexible printed circuit board to drive the recording head via the feeder wires. The other end of the flexible printed circuit board is connected to another circuit board used by the recording apparatus.

Structure of flexible printed circuit board

A method for manufacturing a board assembly comprises the steps of: tin-plating a first terminal and a copper-made second terminal that are formed on a circuit board; mounting an electronic component on the circuit board by means of gold-tin eutectic bonding between a gold electrode of the electronic component and the tin-plated first terminal; forming a copper-tin alloy on a surface of the second terminal by heating the circuit board after the mounting step; and bonding the second terminal having the copper-tin alloy formed on its surface to a terminal of another board by means of a thermosetting conductive adhesive.

Method of manufacturing an ink-jet assembly

A method for manufacturing an ink-jet head includes the step of forming, in a substrate, through holes respectively corresponding to conductors on one face of the substrate and each having its diameter increasing from the one face toward the other face of the substrate. Here, the through holes are formed in such a manner as to satisfy R&#x3e;d/2+t/tan &#x3b8;, where: d represents a width of an opening of the through hole on the one face; &#x3b8; represents an angle of inclination of a sidewall defining the through hole with respect to the one face; R represents a shortest distance from the center of the through hole to a periphery of an electrode that neighbors an electrode corresponding to the through hole; and t represents a thickness of the substrate.

Method for manufacturing an ink-jet head

There is disclosed a drive circuit of a driver device for a recording head of a recording apparatus, which receives a print data signal so as to drive each of a plurality of recording elements of the recording head in accordance with the print data signal. The print data signal including a selecting signal for selecting one of a plurality of waveform signals representing respective recording modes, and a non-selecting signal. The drive circuit comprises an outputting portion which outputs the selecting signal included in the print data signal, with the selecting signal associated with the corresponding recording element, and a non-selecting signal utilizing portion which uses the non-selecting signal for a purpose other than the selection of one of the waveform signals.

Driver device for recording head

A plurality of lands and a plurality of conducting wires connected independently to each land are formed on one side surface of an insulating substrate of a flexible printed circuit board. Through-holes are formed through the insulating substrate for exposing the lands to the other side surface. Solder is provided in the through-holes. The solder connects the lands to the head terminals on an inkjet head, which is located facing the other side surface of the insulating substrate. The insulating substrate separates the solder from areas between the conducting wires and from areas between the lands, thereby preventing short circuits from occurring when manufacturing the connecting structure with a low tolerance grade.

Structure and method for connecting flexible printed circuit board to inkjet print head

A common joining electrode and arrays of island-shaped individual joining electrodes are formed on a substrate of a flexible flat cable, which is connected to a recording head. The common joining electrode extends in the X direction along the periphery of the cable board. The individual joining electrodes are arranged in a staggered manner in a region surrounded by the common joining electrode. The wiring of the individual joining electrodes is patterned so that the gap between the common joining electrode and a wiring connected a nearest individual joining electrode to the common joining electrode is larger than the gap between the common joining electrode and the nearest individual joining electrode. In locations where wirings are closed to one another, it is possible to realize a fine wiring density without excessively narrowing the gaps between adjoining wirings and between the wirings and the side edges of the common joining electrode.

Growing community of inventors

Inuyama, Japan

Koji Imai