Mitsubishi Electric Corporation

Mitsubishi Denki Kabushiki Kaisha

Koji Ibata

Tomonori Kimura

Kenji Yoshida

Koichiro Misu

Satoru Inoue

Shusou Wadaka

Tsutomu Nagatsuka

Yasuhiro Nishioka

Rokuzo Hara

Kouji Murai

Akira Yamada

Kenji Itoh

Fusaoki Uchikawa

Tomoharu Awano

Kenya Hashimoto

Masatsune Yamaguchi

Masao Koshinaka

Chisako Maeda

Tai Tanaka

Kousaku Yamagata

Isao Murase

Tatsuya Ohmori

Jin Hirano

An ultrasound probe includes: a metal case including a bottom wall portion having a vibration surface, and a side wall portion connected to the bottom wall portion; a coil mounted on one surface of the side wall portion; and a magnet mounted in such a way as to sandwich the coil between the magnet and the one surface of the side wall portion, in which the coil causes an eddy current to occur in the one surface of the side wall portion, and causes the bottom wall portion to vibrate, by using a Lorentz force occurring in the side wall portion because of the interaction between the eddy current and a magnetic field generated by the magnet.

Ultrasound probe

A test object includes a sensor housing for vibrating together with a test object in synchronism with vibration of the test object; a piezoelectric substrate for vibrating together with the sensor housing in synchronism with vibration of the sensor housing, where a first interdigital electrode, a first terminal, a second interdigital electrode, and a second terminal are disposed on a first surface of the piezoelectric substrate, and the piezoelectric substrate is disposed inside the sensor housing to be fixed to the sensor housing; an amplifier for receiving a signal output from the second terminal as an input signal, amplifying the received input signal, and transmitting the input signal after the amplification to the first terminal as an output signal; a deformable layer being elastic and having a first surface adhered to a second surface of the piezoelectric substrate; and a heavy object having a first surface adhered to a second surface of the deformable layer.

Vibration sensor

An air-coupled ultrasonic sensor capable of changing setting of an output sound pressure or an ultrasonic wave propagation distance depending on a use application, an installation site, or the like, with a simple structure. An air-coupled ultrasonic sensor includes: a closed-end cylindrical case including an opening portion at one end in its axial direction and a bottom surface at another end; a piezoelectric oscillator firmly fixed onto an inner bottom surface of the closed-end cylindrical case; an open-end cylindrical case including opening portions at both ends in its axial direction; and a thin film firmly fixed on one of the opening portions at one end of the open-end cylindrical case. The open-end cylindrical case is fitted to the closed-end cylindrical case, and includes a structure capable of moving along a side wall of the closed-end cylindrical case.

Air-coupled ultrasonic sensor

An airborne ultrasonic sensor is obtained in which a sensor body and a housing have an integrated structure, and which can reduce spurious waves which propagate through the housing to arrive at the sensor body. The sensor is provided with the sensor body that radiates ultrasonic waves into air and at the same time receives reflected waves from a reflection source which exists in the air, a transmission and reception device that drives the sensor body and at the same time obtains a distance to the reflection source or a propagation speed of sound based on the reflected waves, and the housing that has the sensor body fixedly secured thereto with an integrated structure. The housing has groove portions which are different in acoustic impedance from their surroundings. The groove portions are arranged obliquely regarding either one of a horizontal direction or a vertical direction of the sensor body.

Airborne ultrasonic sensor

Filter circuitry is provided with a series element and a parallel element. The filter circuitry transmits signals that fall within a certain passband and attenuates signals that don't fall within the certain passband. The series element is comprised of a resonance element having antiresonance characteristics, and the parallel element is comprised of a series circuit including an inductor and a capacitor.

Filter circuit with series and parallel elements

There is disclosed an acoustic wave apparatus, constructed in such a manner that a surface rotated in the range of 34&deg; to 41&deg; from a crystal Y axis around the crystal X axis of lithium tantalate is set as the surface of a substrate, a standardized electrode thickness (h/&lgr;) obtained by standardizing a thickness h of an electrode finger constituting at least a part of an interdigital transducer by a wavelength &lgr; of a surface acoustic wave is set to the range of 0.01 to 0.05, and a duty ratio (w/p) of the electrode finger decided based on a width w and an arraying cycle p of the electrode finger is set to the value ranging from 0.6 to just below 1.0.

Elastic wave device

There is provided a film bulk acoustic wave device comprising: a silicon substrate , a dielectric film including a silicon nitride formed on the substrate and a silicon oxide on the silicon nitride , a bottom electrode formed on the dielectric film , a piezoelectric film formed on the bottom electrode , and a top electrode formed on the piezoelectric film , wherein a via hole is formed in such a manner that the thickness direction of a part of the silicon substrate which is opposite to a region including a part where the top electrode exists is removed from the bottom surface of the silicon substrate to a boundary surface with the silicon nitride

Film bulk acoustic wave device

Growing community of inventors

Tokyo, Japan

Koji Ibata