Elpida Memory, Inc.

Hitachi, Ltd.

Toshiba Tec Kabushiki Kaisha

Ps4 Luxco S.a.r.l.

Renesas Eastern Japan Semiconductor, Inc.

Koji Hosokawa

Hisashi Tanie

Yuji Watanabe

Mitsuaki Katagiri

Ichiro Anjo

Yoji Nishio

Hiroshi Ikeda

Seiji Funaba

Tomohiko Sato

Nae Hisano

Takao Ono

Hisashi Abo

An image reading apparatus includes a scanner, an operation panel, a communication interface, and a processor. The scanner is configured to read an image of a document. The operation panel is configured to designate a transmission destination of scan data, the scan data including image data of the document read by the scanner. The communication interface is configured to transmit the scan data to the transmission destination designated on the operation panel. The processor is configured to transmit the scan data to the transmission destination without a password in response to the transmission destination designated on the operation panel being a transmission destination of an operator who operates the operation panel, and transmit the scan data protected with a password to the transmission destination in response to the transmission destination designated on the operation panel including a transmission destination of any person other than the operator.

Image reading apparatus and method of transmitting scan data including password-protectable scan data

A device includes a wiring board, an element mounted on the wiring board, a spacer member intervening between the wiring board and the element to form a space therebetween, and an encapsulation body filling the space and encapsulating the element on the wiring board.

Device and manufacturing method of the same

A BGA semiconductor device includes a semiconductor package and a mounting board mounting thereon the semiconductor package, wherein an array of signal electrodes of the semiconductor package and an array of signal electrodes of the mounting board are coupled together via signal bumps. The BGA semiconductor device also includes a dummy bump, which reinforces the bending strength of the BGA semiconductor device and is broken by a shearing force caused by thermal expansion to alleviate the stress for the signal bumps.

BGA semiconductor device having a dummy bump

An electronic component such as a semiconductor device is provided which is capable of preventing wiring breakage in a stress concentration region of surface layer wiring lines. In a semiconductor device provided with a support ball (), no ordinary wiring line is formed in a region ((A)) in the vicinity of the support ball () and a region ((B)) at the end of the semiconductor chip facing the support ball (), which are the stress concentration regions of the package substrate (). Instead, a wiring line ((C)) is formed away from these regions or a wide wiring line is formed in these regions.

Semiconductor device having improved wiring

A semiconductor unit constituting a memory device has a memory chip, a package substrate having three wiring layers. Power-supply surfaces (VDD surface) and (GND surface) are wired on the package substrate while an intra-package DQ bus is wired on an intermediate layer between both of the power-supply surfaces. The memory device has two DQ pins every one intra-package DQ bus. The intra-package DQ bus is connected to a signal terminal pad of the memory chip through a via hole. In view of the two DW pins, a via hole for connecting the intra-package DQ bus with the signal terminal pad constitutes a branch wire.

Semiconductor unit having two device terminals for every one input/output signal

A semiconductor module comprises: semiconductor packages each comprising a semiconductor element, a wiring substrate having a wiring member connected to the semiconductor element and external terminals connected to the wiring member, and a first organic film formed on a side of the semiconductor element opposed to a side toward the wiring substrate; and a mount substrate, on which the semiconductor element is mounted. First of the semiconductor packages and second of the semiconductor packages are stacked. Second organic films are provided between the wiring substrate of the first semiconductor package and the first organic film of the second semiconductor package and between the mount substrate and the semiconductor package.

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Tokyo, Japan

Koji Hosokawa