Sae Magnetics (h.k.) Limited

Tdk Corporation

Tmp Co., Ltd.

Sae Technologies (h.k.) Ltd.

Koji Hosaka

Ryuji Fujii

Takashi Honda

Koji Shimazawa

Yasuhiro Ito

Makoto Saito

Ryo Hosoi

Masaaki Kaneko

Kazuya Orii

Guowei Li

Hiroyasu Tsuchiya

Xiangbin Xiao

Hideaki Natsui

XiaoMing Hong

A method of the invention for performing burn-in test includes assembling, on a fixture stand, a plurality of light source elements and a plurality of light detectors for monitoring a light output from a corresponding one of the plurality of light source elements; and electrifying the plurality of light source elements in a state where at least the plurality of light source elements and the plurality of light detectors are immersed in an insulation liquid. Thereby, it is realized to hold a stable temperature in a short period of time, to maintain a temperature that does not deviate from normal load conditions, and to perform a sorting test between defect parts and good part for light source unit chips without causing damage to the elements.

Method for performing burn-in test

A probe assembly used to lap a bar, the bar being provided with elements that are to be formed into sliders, is provided. The probe assembly comprises an elastically deflectable probe, and a stopper for applying bending deformation to the probe so as to cause first bending deflection at a leading end of the probe and for maintaining the first bending deflection of the leading end while preventing a bending deformation at the leading end from becoming smaller than the first bending deflection. The leading end of the probe is adapted to be subjected to second bending deflection that is larger than the first bending deflection in a same direction as a direction of the first bending deflection and thereby to abut against an electrode pad to establish electrical connection between the probe and the electrode pad, the electrode pad being provided on a surface of the bar other than a surface to be lapped.

Probe assembly for lapping a bar using a patterned probe

The present invention provides a grinding sheet wherein the width of the ridge in the pattern of abrasive layer is larger than the width of the recess formed between the adjacent portions of the ridge. Its shape is suitable to carry out uniform treatment without causing the workpiece to drop into the recess between ridge portions of the pattern of abrasive layer even when the workpiece is swung while the grinding sheet is rotated during grinding operation.

Grinding sheet and grinding method

A fixture for slider lapping includes a holding portion for holding the object with its surface to be lapped toward the lapping surface of the lapping device; a main body for mounting the lapping fixture to the lapping device; a plurality of load-applied portions which are arranged along said longitudinal direction and independent from said main body, said load-applied portions receiving a load which presses the surface to be lapped to the lapping surface tightly from at least the lapping device; a plurality of connection members connecting said holding portion and said main body along said longitudinal direction at intervals; and a plurality of wrist portions connecting said connection members and said holding portion; wherein at least one wrist portion is disposed between said adjacent connection members; at least one wrist portion is disposed at each outer side of the connection members which are located at both ends of the longitudinal direction. Also disclosed is a lapping device and method using the fixture.

Fixture for slider lapping, lapping device and lapping method

Growing community of inventors

Hong Kong, China

Koji Hosaka