Mitsui Chemicals, Inc.

Koji Hirota

Hiroshi Mase

Minehiro Mori

Naoki Nakazawa

Masanao Kobayashi

Provided is an antimicrobial raw material having excellent antibacterial and corrosion-resistance properties, which can be directly formed as a film even on a plastic substrate with low heat-resistance or a substrate whereof the color or properties are likely to change due to heat, and this can be achieved at relatively low cost. The antimicrobial raw material is a laminated structure which comprises a substrate layer and a copper-tin alloy layer disposed on the substrate layer, and which has a thickness ranging from 5 nm to 200 nm. The substrate layer is made of resin, natural fiber, or paper, the resin having the deflection temperature under load being 115&#xb0; C. or lower when measured in accordance with ASTM-D648-56 under a load of 1820 kPa. The copper-tin alloy layer contains over 60 at % but no more than 90 at % of copper and 10 at % or more but less than 40 at % of tin.

Antimicrobial raw material and method for manufacturing the same, and antimicrobial material

Provided an antimicrobial substance that includes a base material layer, and a copper-tin alloy layer 5-200 nm in thickness disposed on the base material layer, the copper-tin alloy layer containing copper in an amount of more than 60 atomic percent but not more than 90 atomic percent, and containing tin in an amount of not less than 10 atomic percent but less than 40 atomic percent. The copper-tin alloy layer includes a CuSncrystalline phase, and a CuSn crystalline phase. The Q value (&#x3a9;/(nm&#xb7;Cu atomic percent)), which is derived by dividing the sheet resistance (&#x3a9;) of the copper-tin alloy layer by the thickness of the copper-tin alloy layer and the copper content (Cu atomic percent), is 1.5&#xd7;10-6.0&#xd7;10.

Antimicrobial substance, method for producing same, and antimicrobial material

The present invention relates to a metal laminate which is broadly used for a flexible wiring board or the like and an etching method therefor. In particular, the present invention relates to a metal laminate which includes a layer obtained by laminating a metal layer and an insulating layer, where the insulating layer is subjected to an etching process, wherein, in a surface of the metal layer which is positioned so as to come in contact with the insulating layer, respective concentrations of main metal element and oxygen element constituting the metal layer are measured from the surface of the metal layer towards inside of the metal layer in a time-elapsing manner according to AES (Auger electron spectroscopy) and a value of the thickness of a metal oxide film of the surface of the metal layer measured at a time when atomic concentrations of the main metal element and the oxygen element constituting the metal layer become equal to each other is in a range of at least 0 &#x212b; to less than 50 &#x212b;. According to the present invention, an etching time of polyimide in the polyimide metal laminate can be calculated and a flexure used for a suspension for a hard disc drive having a high productivity can be provided.

Growing community of inventors

Miura-gun, Japan

Koji Hirota