Screen Holdings Co., Ltd.

Rohm Co., Ltd.

Dainippon Screen Mfg. Co., Ltd.

Koji Hashimoto

Akito Hatano

Toyohide Hayashi

Masahiro Miyagi

Mitsukazu Takahashi

Toru Endo

Naoyuki Osada

Kazuhiro Honsho

Masahiro Yamamoto

Hiroaki Onishi

Ryo Muramoto

Noriyuki Kikumoto

Sei Negoro

Shinji Shimizu

Yasuhiko Nagai

Hiroshi Horiguchi

Mikio Ichiura

Masami Ohtani

Tsuyoshi Mitsuhashi

Takahiro Yamaguchi

Hiroaki Takahashi

Joichi Nishimura

Kazuki Nakamura

Kenji Hashinoki

Takuya Wada

Noritake Sumi

Eiji Fukatsu

Yuichi Takayama

Masafumi Inoue

Hiroyuki Kawahara

Masayoshi Shiga

Yuji Matsumoto

Hiroyuki Fujiki

Keiichi Tsuchiya

It is an object of the present invention to reduce the amount of data used in an apparatus, a system, and a method for performing a substrate processing. In order to achieve this object, a substrate processing apparatus includes one or more processing units each for performing a processing on a substrate and one or more arithmetic processing parts. One or more arithmetic processing parts generate a flow recipe defining a flow of a series of processings for a substrate by combining two or more processing recipes among a plurality of processing recipes each defining a processing condition relating to a processing to be performed on a substrate in the one or more processing units. The plurality of processing recipes include a plurality of liquid processing recipes each defining a condition of a processing to be performed on a substrate by using a processing liquid.

Substrate processing apparatus, substrate processing system, and substrate processing method

In a chamber, first processing is performed as preliminary processing. After the first processing has been finished, the temperature in a predetermined target region in the chamber is measured with a thermographic camera. Then, whether or not to start second processing on a substrate is determined in accordance with the acquired measured temperature information. If it is determined as a result that the second processing can be started, the second processing is performed. In this case, the second processing on the substrate can be started, with the temperature of the target region in the chamber having reached its stability. Accordingly, the second processing can be performed uniformly on a plurality of substrates. That is, it is possible to reduce variations in processing caused by temperature environments in the chamber.

Substrate processing apparatus and substrate processing method

A low surface tension liquid supply unit supplies a low surface tension liquid onto the upper surface of a substrate to form a liquid film of the low surface tension liquid on the substrate. An opening is formed in a central region of the liquid film of an organic solvent. The liquid film is removed from the upper surface of the substrate by expanding the opening. While a low surface tension liquid is supplied from the low surface tension liquid supply unit, to the liquid film, toward a liquid landing point set outside the opening, the liquid landing point is moved so as to follow the expansion of the opening. While an facing surface of a drying head faces a dry region set inside the opening to form a low-humidity space between the facing surface and the dry region, with the low-humidity space having a humidity lower than that outside the space, the dry region and the facing surface are moved so as to follow the expansion of the opening.

Substrate processing method and substrate processing device

A substrate processing apparatus includes a base portionthat is disposed in a manner of being adjacent to a chamber; a handthat holds a substrate S; an armthat is attached to the base portion, supports the hand, and moves the hand forward and rearward by horizontally moving the hand with respect to the base portion; and a cover portionthat accommodates the hand in an internal space. The cover portion has a cover main bodyforming the internal space and an extending memberhaving a hollow structure which penetrates the cover portion in a horizontal direction and of which one end serves as an openingand being engaged with the cover main body in a state of being movable in the horizontal direction while the opening communicates with the internal space.

Substrate processing apparatus

A first processing module includes a first specified processing unit and a first delivery part. A substrate supply part is on a first direction side of the first processing module. A transfer module is on a second direction side on the opposite of the first processing module from the first direction. The transfer module includes a frame, a first floor, a second floor, and a gateway. The frame defines a placement space in which a first transfer apparatus of the transfer module is placed. A first transfer apparatus is installed on the first floor. The second floor is on a third direction side, which is a horizontal direction orthogonal to the first direction, with respect to the first floor inside the placement space. The gateway is provided on the third direction side with respect to the second floor and communicates the placement space to the outside of the frame.

Substrate processing apparatus, transfer module, and coupling module

A substrate container including a casing, a rack, a casing holder, a casing lifting mechanism, a lid, and a lid holder. When holding of substrates with the rack shifts to holding of the substrates with the casing holder and the lid holder, the casing lifting mechanism moves the casing holder upward, whereby the casing holder moves the substrates upward. When the holding of the substrates with the casing holder and the lid holder shifts to the holding of the substrates with the rack, the casing lifting mechanism moves the casing holder downward, whereby the casing holder moves the substrates downward.

Substrate container, load port apparatus, and substrate treating apparatus

A discharge portis arranged inside a chamber. A circulation flow passagecirculates a processing liquid, while maintaining the processing liquid at a predetermined temperature. A discharge flow passageis branched from a circulation flow passageto guide the processing liquid to the discharge port. A return flow passageis connected to the discharge flow passageinside the chamberand allows the processing liquid running through the discharge flowpassageto flow back to the circulation flow passage

A substrate processing apparatus includes a chamber, a substrate holding unit, an elevated/lowered member, and an elevation/lowering driving unit. The chamber includes a base plate having an upper surface that defines a housing space. The substrate holding unit is housed in the housing space, is placed on the upper surface of the base plate, and holds a substrate. The elevated/lowered member is elevated and lowered inside the housing space. The elevation/lowering driving unit drives the elevation and lowering of the elevated/lowered member. The elevation/lowering driving unit includes a driving source, disposed higher than a lower surface of the base plate, and an elevating/lowering head, which is connected to a guard and is moved vertically by the driving source within a movable range in which an entirety of the head is positioned higher than the lower surface of the base plate.

A substrate processing apparatus includes a processing liquid distributing member that partitions, by an inner wall surface, at least part of a processing liquid distribution passage communicating with a discharge port, a processing liquid supplying unit that supplies the high-temperature processing liquid having a higher temperature than a room temperature to the processing liquid distribution passage, a temperature changing unit arranged to heat or cool an outer wall surface of the processing liquid distributing member from the outside to change a temperature of the processing liquid distributing member, and a controller that executes an equilibrium temperature maintaining step of maintaining the inner wall surface of the processing liquid distributing member at a thermal equilibrium temperature by controlling the temperature changing unit in a state where no processing liquid is supplied from the processing liquid supplying unit to the processing liquid distribution passage.

A substrate container includes a casing, a rack, a lid, a lid holder, and a substrate separating mechanism. The casing has on its front face an opening. The substrate separating mechanism has a contact part that directly contacts substrates. The contact part is movable relative to the lid holder. The lid moves forward to the opening, and the contact part moves backward relative to the lid holder, whereby the lid holder holds ends of the substrates. The lid moves backward from the opening, and the contact part moves forward to the lid holder, whereby the substrate separating mechanism separates the substrates from the lid holder.

A substrate treating apparatus including an unloading order changing unit. The unloading order changing unit reverses an order, in regard to unloading of substrates in a carrier from the top, between a poor inclined substrate and a substrate at least immediately above the poor inclined substrate when the poor inclined substrate is present whose inclination is determined larger than a pre-set threshold by a poor inclination determining unit. That is, the order is reversed such that the poor inclined substrate whose surface may be possibly be scratched with a hand is unloaded prior to the substrate immediately above the poor inclined substrate. Accordingly, this inhibits damages on the substrate caused by scratching a substrate surface with the hand of a substrate transport mechanism.

Substrate treating apparatus and substrate treating method

A substrate treatment apparatus is used for treating a major surface of a substrate with a chemical liquid. The substrate treatment apparatus includes: a substrate holding unit which holds the substrate; a chemical liquid supplying unit having a chemical liquid nozzle which supplies the chemical liquid onto the major surface of the substrate held by the substrate holding unit; a heater having an infrared lamp to be located in opposed relation to the major surface of the substrate held by the substrate holding unit to heat the chemical liquid supplied onto the major surface of the substrate by irradiation with infrared radiation emitted from the infrared lamp, the heater having a smaller diameter than the substrate; and a heater moving unit which moves the heater along the major surface of the substrate held by the substrate holding unit.

Substrate treatment apparatus

In a state of mapping sensors having been advanced into a carrier by a sensor advance/withdraw mover, a sensor lifting and lowering device moves the mapping sensors up and down. With this movement, the mapping sensors detect presence or absence of substrates in a horizontal direction crossing a fore-and-aft direction in which the substrates are moved into and out of the carrier, and a height sensor detects heights of the mapping sensors. Consequently, substrate heights are detected in two different locations in the fore-and-aft direction. Based on the substrate heights, a substrate condition acquiring unit acquires a tilt of each substrate relative to the horizontal in the fore-and-aft direction. The tilt of each substrate inside the carrier is acquired in advance, thereby to be able to prevent substrate damage due to contact between a hand of a substrate transport mechanism and the substrates.

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Kyoto, Japan

Koji Hashimoto