Murata Manufacturing Co., Ltd.

Koji Furutani

Norio Nakajima

Koji Tanaka

Ken Tonegawa

Takanori Uejima

Mitsuhide Kato

Hideki Muto

Takahiro Watanabe

Teruhisa Tsuru

Tetsuro Harada

Tatsuya Ueda

Yoshiki Takada

Shinya Watanabe

Yuji Takematsu

Akihiro Ochii

Harufumi Mandai

Takako Sato

Hisao Hayafuji

Daisuke Yoshida

Yasuhiro Takahashi

Hidefumi Suzaki

Yoshiyuki Ishiyama

Mitsuhide Katou

A radio-frequency module includes a multilayer substrate, a first semiconductor device, a second semiconductor device, and a metal layer. The multilayer substrate includes a plurality of stacked layers, and has a first major face and a second major face. The first major face includes a first recess. The first semiconductor device is mounted over a bottom face of the first recess. The second semiconductor device is mounted over the first major face so as to overlie the first recess. The first semiconductor device is connected with a metallic via that extends through a portion of the multilayer substrate from the bottom face of the first recess to the second major face. The metal layer is disposed between the first semiconductor device and the second semiconductor device so as to overlie the first recess.

Radio-frequency module and communication apparatus

A directional coupler includes a main line, sub lines, and a multilayer substrate. The multilayer substrate includes dielectric layers. The multilayer substrate has a first and a second principal surface. The main line, the first, second, and third sub lines are each formed in a looped shape in plan view from a thickness direction of the multilayer substrate, and are provided to different dielectric layers among the dielectric layers. The first, second, and third sub lines have first distances different from each other. Among the first, second sub line, and third sub lines, the longest sub line having the longest first distance and the shortest sub line having the shortest first distance are disposed on the first principal surface of the main line, and the intermediate sub line having the intermediate first distance is disposed on the second principal surface of the main line.

Directional coupler, high-frequency module, and communication device

A radio-frequency module includes a multilayer substrate, a first semiconductor device, a second semiconductor device, a first mold layer, and a second mold layer. The multilayer substrate includes a plurality of stacked layers, and has a first major face and a second major face. The first mold layer seals the first semiconductor device. The second mold layer seals the second semiconductor device. The first major face includes a first recess. The first semiconductor device is mounted over a bottom face of the first recess. The second semiconductor device is mounted over the first major face so as to overlie the first recess. The first semiconductor device is connected with a metallic via that extends through a portion of the multilayer substrate from the bottom face of the first recess to the second major face. The first mold layer and the second mold layer are made of different materials.

A directional coupler includes a main line, a first sub-line, a second sub-line, a termination circuit, a selector switch, and a short-circuiting switch. The termination circuit terminates at least one of the first sub-line and the second sub-line. The selector switch connects the first sub-line and the termination circuit in a first mode and connects the second sub-line and the termination circuit in a second mode. The short-circuiting switch short-circuits both ends (a first end and a second end) of the second sub-line in the first mode.

Directional coupler, high-frequency module, and communication apparatus

A directional coupler includes a substrate, a main line, a first sub-line, and a ground conductor. The main line includes a first conductor line and a second conductor line electrically connected to each other. The first sub-line includes a third conductor line. The first conductor line and the second conductor line are able to be electromagnetically coupled to the third conductor line. The first conductor line has a first edge and a second edge. The second conductor line has a third edge and a fourth edge. The third conductor line has a fifth edge and a sixth edge. The first conductor line, the second conductor line, and the third conductor line are arranged in such a manner that the first edge, the fifth edge, the third edge, the second edge, the sixth edge, and the fourth edge are arranged in this order when the substrate is viewed in plan.

Directional coupler

A radio-frequency module includes a multilayer substrate, a first semiconductor device, a second semiconductor device, a mold layer, and a shield layer. The multilayer substrate includes a plurality of stacked layers, and has a first major face and a second major face. The mold layer seals at least the second semiconductor device. The shield layercovers the mold layer. The first major face includes a first recess. The first semiconductor device is mounted over a bottom face of the first recess. The second semiconductor device is mounted over the first major face so as to overlie the first recess. The first semiconductor device is connected with a metallic via that extends through a portion of the multilayer substrate from the bottom face of the first recess to the second major face. The mold layer does not cover a top face of the second semiconductor device.

A radio-frequency module includes a multilayer substrate, a first semiconductor device, and a second semiconductor device. The multilayer substrate includes a plurality of stacked layers, and has a first major face and a second major face. The first semiconductor device includes a first power amplifier circuit. The second semiconductor device includes at least one of a low-noise amplifier circuit, a switching circuit, or a control circuit. The first major face includes a first recess. The first semiconductor device is mounted over a bottom face of the first recess. The second semiconductor device is mounted over the first major face so as to overlie the first recess. The first semiconductor device is connected with a metallic via that extends through a portion of the multilayer substrate from the bottom face of the first recess to the second major face.

A module includes a substrate, which has a polygonal shape in a plan view, an electronic component and an electronic component, which are mounted on a main surface of the substrate, and side electrodes, which are provided on at least two side surfaces of a plurality of side surfaces that form the polygonal shape of the substrate. A conductor film coupled to the electronic component and a conductor film coupled to the electronic component are provided on the substrate. The conductor film extends to reach a side surface of the at least two side surfaces to be coupled to a side electrode provided on the side surface. The conductor film extends to reach a side surface of the at least two side surfaces, which is different from the side surface, to be coupled to a side electrode provided on the side surface.

Module

A high frequency front end module includes a variable circulator, a transmission side filter, and a reception side filter. Capacitors that are to be selectively connected by a switch are provided between an antenna side port and a transmission side port of a circulator of the variable circulator. Capacitors that are to be selectively connected by a switch are provided between the antenna side port and a reception side port of the circulator. Capacitors that are to be selectively connected by a switch are provided between the transmission side port and the reception side port of the circulator. By selecting the capacitors, phase characteristics between the ports are adjusted to the characteristics in accordance with a transmission signal and a reception signal to be transmitted.

High frequency front end module

In an electronic component device, an ESD protection element including a cavity portion and a pair of opposed discharge electrodes is disposed inside a package substrate. A composite portion made of a composite material including a metal material and an insulating material is disposed on a bottom of the cavity portion. The package substrate including the ESD protection element disposed therein reduces the size of the electronic component device and reliably prevents damage to and malfunctioning of the electronic component device.

Electronic component device and package substrate

In a circuit module in which a plurality of non-reciprocal circuit elements, each of which does not have a yoke, are mounted, the occurrence of magnetic coupling between the non-reciprocal circuit elements is significantly reduced and prevented. Core isolators are not arranged such that, in a state in which the direction of magnetic flux and the direction of magnetic flux are the same, the core isolators are aligned in the direction of the magnetic flux. Specifically, the core isolators generate the magnetic flux from left to right. The core isolators are aligned so as to be inclined relative to the magnetic flux. Thus, extension of the magnetic flux through the core isolator in a state of being directed in the same direction as that of the magnetic flux is significantly reduced and prevented.

Circuit module

A circuit module having reduced magnetic coupling between core isolators. A substrate body includes principal surfaces. A core isolator includes a ferrite, a permanent magnet that applies a DC magnetic field to the ferrite, a first center electrode provided for the ferrite and including one end connected to an input port and another end connected to an output port, and a second center electrode provided for the ferrite so as to intersect the first center electrode insulated from the second center electrode and that includes one end connected to the output port and another end connected to a ground port. The core isolator also includes no yokes preventing leakage of the DC magnetic field to the outside. The core isolators are mounted on the respective principal surfaces such that directions of the DC magnetic fields are parallel or substantially parallel to the principal surface.

A duplexer module prevents a transmission signal and a reception signal in the same band from interfering with each other. The duplexer module includes a transmission line, a reception line, and an antenna common line. In addition, the duplexer module includes a plurality of mounting electrodes arranged along the four sides of an outer edge of a mounting surface of a multilayer substrate. The fourth mounting electrode defining a monitoring port is disposed on a side different from a side on which each of the first mounting electrode defining a transmission port, the second mounting electrode defining a reception port, and the third mounting electrode defining an antenna port is disposed. The fourth mounting electrode defining the monitoring port is a mounting electrode used to output a signal of the monitoring line through which a portion of electrical power is transmitted from the transmission line.

Duplexer module

In an antenna combining module, coupling of an inductor and individual signal lines provided in a matching circuit is prevented and minimized and isolation of lines from one another and communication performance are improved. The antenna combining module includes a duplexer DUP and a multilayer substrate. The multilayer substrate includes a reception signal line, a transmission signal line, an antenna common line, a matching line and a ground line. A wiring electrode for an inductor is inserted into the matching line from the mounting electrode for grounding up to the position where it combines with the antenna common line. The wiring electrode for the inductor wraps around the outside of a via hole filled with a conductive material of the antenna common line. The ground line is arranged between the wiring electrode for the inductor and the reception signal line, and the transmission signal line.

Antenna combining module

A duplexer module that prevents degradation of isolation between signal lines includes transmission filters, reception filters, phase adjusting circuits, and a multilayer substrate. The transmission filters and the reception filters are constituted as separate discrete components. The multilayer substrate includes filter mount terminals to which the transmission filters are mounted, and filter mount terminals to which the reception filters are mounted. The filter mount terminals are arranged along an upper side of the multilayer substrate, and the filter mount terminals are arranged along a lower side of the multilayer substrate.

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Moriyama, Japan

Koji Furutani