Ushio Denki Kabushiki Kaisha

Mitsubishi Denki Kabushiki Kaisha

Koji Enomoto

Takumi Sato

Yoshihisa Yokokawa

Yoshihiro Kanahashi

Yoshio Okazaki

Seiji Sato

Tomoko Sendai

Osamu Yasuda

Yasuhiro Kawai

Norihiro Sengoku

Disclosed are a light irradiation apparatus that prevents or suppresses projection of light on adjoining other portions and can be miniaturized overall, and a photocurable material treatment apparatus that includes this light irradiation apparatus. The light irradiation apparatus includes: a light source having a plurality of light emitting elements arranged in the x direction; and an elongated cylindrical lens extending in the x direction along the light source unit. A light source reference plane that includes a center of a light emission surface of each light emitting element is located on a plane separated in the y direction from a lens reference plane that includes a center axis of the cylindrical lens. A direction of the light from the cylindrical lens is tilted in a direction away from the light source reference plane with respect to the lens reference plane

Light irradiation apparatus including a light shield

A light emitting module includes: a substrate; at least one light emitting element line including a plurality of light emitting elements that are arrayed on the substrate in a first direction; and at least one sealing lens sealing the at least one light emitting element line, and including a plurality of lens sections. The lens sections each include a spherical light emission surface having a convex shape, and are provided corresponding to the respective light emitting elements and continuous in the first direction. The lens sections each satisfy predetermined expressions (1) and (2).

Light emitting module and light irradiating apparatus

A wire-electrical discharge machine infuses a processing liquid in a gap between a wire and a workpiece and processes the workpiece using predetermined processing parameters. The machine includes a processing parameter memory that stores processing parameters, a second memory that stores a relationship between nozzle height and processing energy, a processing energy determining unit that determines the processing energy, for example, during rough processing, based on the relationship, and a processing parameter changing unit that changes the processing parameters based on the processing energy. The workpiece is processed using the changed processing parameters. According to this construction, wire breakage can be prevented and the accuracy of the processed surface can be improved.

Electric discharge machine with changing processing parameters

Growing community of inventors

Tokyo, Japan

Koji Enomoto