Asahi Denka Kogyo K.k.

Asahi Denka Kogyo Kabushiki Kaisha

Synaptics Japan Gk

Koji Akimoto

Hidehiko Kojo

Kazuhiro Urihara

Makoto Kokura

Ryo Ogawa

Hisao Nakamura

Naohiro Fujita

Naoaki Hata

Kiyoshi Masamune

Tsutomu Fukaya

A semiconductor chip tray is provided that includes a support plate, a first protruding portion, a second protruding portion and a recess. The first protruding portion forms a housing space for a semiconductor chip by being provided on a top surface of the support plate. The second protruding portion is provided on a bottom surface of the support plate, and is fitted to an outer periphery of the first protruding portion of another semiconductor chip tray when the tray is stacked so as to overlap the other tray. The recess is provided on the bottom surface of the support plate. The recess faces a part of the first protruding portion of another chip tray when the tray is stacked so as to overlap the other tray. The recess is formed extending up to an outside of the first protruding portion from the housing space formed by the first protruding portion.

Semiconductor chip tray

Aqueous resin composition

There is provided an urethane modified epoxy resin either obtained by reaction of 100 weight portions of a preliminary condensate �A! produced by reaction of an epoxy resin and an acid of a phosphorus compound or its salt or ester and 5 to 60 weight portions of an isocyanate group-terminated urethane prepolymer �B! produced by reaction of a hydroxy compound and an organic polyisocyanate compound, or obtained by preparing an urethane modified epoxy resin �D! from 100 weight portions of an epoxy resin and 5 to 60 weight portions of the same isocyanate group-terminated urethane prepolymer �B! as the above and causing the resin �D! to react with an acid of the same phosphorus compound as the above or its salt or ester. Such an urethane modified epoxy resin can advantageously be used with an active organic hardening agent to produce an adhesive resin composition, which is highly effective for bonding iron and non-ferrous metals particularly in terms of shearing strength and peeling strength.

Urethane modified epoxy resin

Urethane modified epoxy resin from epoxy phosphate and isocyanate

A coating composition comprising the reaction product obtained by reacting an epoxy resin with a polynuclear polyhydroxy phenol having adjacent hydroxy groups, polyol esters of polyhydroxy phenolic carboxylic acids having adjacent hydroxy groups or a phosphorus compound. W

Coating composition

Anticorrosive coating composition containing polyol resin, isocyanate

Coating composition of polyol resin, isocyanate hardener and diluent

A coating composition comprising the reaction product obtained by reacting an epoxy resin with a polynuclear polyhydroxy phenol having adjacent hydroxy groups, polyol esters of polyhydroxy phenolic carboxylic acids having adjacent hydroxy groups or a phosphorus compound.

Anticorrosive coating composition

A coating composition containing as essential components

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Tokyo, Japan

Koji Akimoto