Nichia Corporation

Koji Abe

Yuki Shiota

Yasushi Okamoto

Masaki Hayashi

Tomohisa Kishimoto

Tadaaki Ikeda

Kimihiro Miyamoto

Masafumi Kuramoto

Kazusa Nishiuchi

A package for mounting a light emitting element includes: a first lead electrode defining a portion of a bottom of a recess and comprising a base member and a plating disposed on the base member, and wherein the first lead electrode comprises, in a plan view: a first region, a second region surrounding a periphery of the first region, wherein, in a height direction, an upper surface of the base member in an entirety of the second region is higher than an upper surface of the base member in the first region, and a third region surrounding at least a portion of a periphery of the second region, wherein, in the height direction, an upper surface of the base member in the third region is lower than the upper surface of the base member in the entirety of the second region; a second lead electrode; and a resin molded body.

Light emitting device package having lead electrode with varying height

A method of manufacturing a light emitting module includes: providing a wiring board having an upper face on which a plurality of light emitting elements are mounted; disposing a first resin in an area of the upper face of the wiring board that is outward of a region in which the light emitting elements are mounted, wherein the first resin contains a light reflecting substance; and covering lateral faces of the light emitting elements with the first resin by spreading the first resin over the region in which the light emitting elements are mounted.

Light emitting module manufacturing method including covering lateral faces of light emitting elements with resin

Alight emitting device includes: a light emitting element; a first substrate having an upper surface comprising an element placement region on which the light emitting element is disposed; a light-transmissive member with a sheet-like shape that covers the light emitting element, wherein an outer edge of a lower surface of the light-transmissive member contacts an outer side of the upper surface of the element placement region of the first substrate; and a first protrusion portion disposed along an outer edge of an upper surface of the light-transmissive member and extending across an upper surface of the first substrate and the upper surface of the light-transmissive member, wherein the first protrusion portion comprises a top portion located higher than an upper surface of the light emitting element.

Light emitting device

A light-emitting device includes a package, a light-emitting element disposed on the package, and a light-transmissive member over the light-emitting element. An upper surface of the light-transmissive member and an upper surface of the package each have a plurality of projections. The light-transmissive member contains particles of light-transmissive first fillers having refractive indices smaller than the refractive index of a matrix of the light-transmissive member. Part of the particles of the first fillers is exposed to the air from the matrix of the light-transmissive member on the upper surface of the light-transmissive member.

Light-emitting device with exposed filter particles

A package for mounting a light emitting element includes: a first lead electrode having, in a plan view, a first region, a second region surrounding a periphery of the first region having a width of 110 &#x3bc;m or more and a thickness greater than that of the first region, and a third region partially surrounding a periphery of the second region and having a thickness smaller than that of the second region; a second lead electrode spaced apart from the first lead electrode; and a resin molded body fixing a portion of each of the first and second lead electrodes. A portion of each of the first and second lead electrodes and a portion of the resin molded body exposed therebetween form a bottom surface of a recess.

Light emitting device package having lead electrode with varying thickness

A light emitting device includes a light emitting element, a light-transmissive member covering the light emitting element, a fluorescent material contained in the light-transmissive member, and a multilayer film disposed on the light-transmissive member and including alternatively layered two types of films of different refractive indices, in which the two types of films are aggregated nano-particles of TiOand aggregated nano-particles of SiO.

Light emitting device and method of manufacturing the same, and display device

A method for manufacturing a package includes molding a precursor of a package including a cup-shaped resin component having a bottom surface and side walls, an opening opened at an upper part of the side walls, and a pair of leads exposed on the bottom surface. The side walls include a side wall that extends along the Y axis and the X axis and that has a first outer surface, and a side wall that extends along the Y axis and the Z axis. A thickness of the side wall extending along Y axis and the X axis is less than a thickness of the side wall extending along axis and the Z axis. The first outer surface has a recess which is recessed in the Z axis direction and arranged in a position corresponding to the opening. The method further includes forming a reflective film in the recess.

Method for manufacturing package, and method for manufacturing light emitting device

A light emitting device includes a package having a recess, a light emitting element disposed in the recess, a translucent sealing material provided in the recess to encapsulate the light emitting element, and a film provided on the translucent sealing material. The film has a contact surface to contact the translucent sealing material and an outer surface opposite to the contact surface. The film includes a translucent base material and two or more layers of particles stacked in the translucent base material between the contact surface and the outer surface. At least one of the particles is exposed in a vicinity of the outer surface of the film.

Light-emitting device having a light-transmissive member including particles of at least one first filler and method for manufacturing the same

A method of manufacturing a package, the method comprising the steps of: preparing a resin compact having a recess, and including a pair of leads arranged at a bottom surface of the recess, a first resin body forming a lateral wall of the recess, and a second resin body arranged between the pair of leads; forming a reflective film entirely on at least the bottom surface of the recess and an inner surface of the lateral wall of the recess; and removing the reflective film formed on the pair of leads in the recess in the resin compact on which the reflective film has been formed.

Package and light-emitting device

A method for manufacturing a light emitting device includes providing a package having a recess in which a light emitting element is disposed. A translucent sealing material is provided in the recess to encapsulate the light emitting element. A film is provided on the translucent sealing material. The film includes a translucent base material and particles disposed in the translucent base material. The film has a contact surface to contact the translucent sealing material and an outer surface opposite to the contact surface. Abrasive is blasted onto the outer surface of the film to roughen the outer surface so as to expose at least one of the particles.

Light emitting device and method for manufacturing the same

A package, includes a cup-shaped resin component having a bottom surface and side walls that surround the bottom surface, an opening which is opened at an upper part of the side walls, a pair of leads exposed on part of the bottom surface, and a reflective film, the resin component having a 3-D shape defined by an X axis, a Y axis and a Z axis, the outer surface of the side walls that has a recess which is recessed in the Z axis direction and arranged in a position corresponding to the opening, and the reflective film being disposed in the recess.

Light emitting device, package, and method for manufacturing these

A package for mounting a light emitting element includes a pair of lead electrodes and a resin molded body. The pair of lead electrodes are made of metal plates. The package has a recess portion in which a light emitting element is mounted. The recess portion is formed of the pair of lead electrodes and the resin molded body. The pair of lead electrodes are exposed on a bottom surface of the recess portion. At least one of the pair of lead electrodes has a groove portion that is formed along a periphery of the metal plate exposed on the bottom surface of the recess portion. The periphery of the at least one of the pair of lead electrodes on the bottom surface of the recess portion constitutes a boundary between the bottom surface of the recess portion and a side surface portion of the recess portion.

Growing community of inventors

Tokushima, Japan

Koji Abe