Asahi Kasei Chemicals Corporation

Kyoraku Co., Ltd.

Hitachi Transport System, Ltd.

Asahi Kasei Kabushiki Kaisha

Koichiro Yoshida

Hiroshi Kobayashi

Takeshi Matsue

Takaaki Miyoshi

Shunichiro I

Nobuyuki Kashima

Hiroyuki Hashimoto

The present invention provides a module used for stacking thin panels that allows for stacking of a plurality of thin panels in the vertical direction efficiently and stably. The module includes a sandwiching support portion, a load transmitting portion, and a positioning portion. The sandwiching support portion sandwiches and supports the thin panel. The load transmitting portion is coupled with the sandwiching support portion, and transmits the weight of the thin panel in the vertical direction. The positioning portion relatively positions thin panels, which are stacked in the vertical direction, in the horizontal direction. The sandwiching support portion includes a lower plate-shaped body and a vertical wall. The lower plate-shaped body is disposed on a lower portion of the module. The vertical wall extends upward from an outer edge of the lower plate-shaped body to form an approximately C-shaped cross-sectional surface in conjunction with the lower plate-shaped body. The load transmitting portion includes a load transmitting surface, which is formed outward from an outer surface of the vertical wall. The positioning portion includes an inner lock portion on an inner edge of the lower plate-shaped body and an outer lock portion on the outer edge of the lower plate-shaped body. The inner lock portion is contactable with an inner edge of an upper portion of the module. The outer lock portion is contactable with an outer edge of the upper portion of the module.

Module used for stacking thin plate panels

A resin composition having a high thermal aging property and molding stability in mass production of molded articles while keeping molding fluidity and thermal creep resistance is provided. A resin composition, containing 100 parts by mass in total of a polypropylene resin (a) and a polyphenylene ether resin (b), and 1 to 20 parts by mass of a compatibilizer (c), wherein in the component (a), the proportion of the component having a molecular weight of 30,000 or less is from 3.0 to 5.1% of the entire component (a), and the proportion of the component having a molecular weight of 10,000,000 or more is from 1.0 to 1.6% of the entire component (a).

Resin composition and method of producing the same

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Tokyo, Japan

Koichiro Yoshida