Hitachi, Ltd.

Koichiro Tonehira

Satoshi Kaneko

Hiroshi Yamamoto

Kazuhiro Ito

Atsushi Takai

Kazuyuki Fukuda

Michihide Sasada

Makoto Shimaoka

Kenji Yoshimoto

Tetsuya Aoki

Atsushi Miura

Shigefumi Kito

Shinzo Nishiyama

To provide economical high-speed optical communications through an optical module a silicon substrate with a ball lens and semiconductor luminescence element mounted thereon, and a laser driver IC are provided. A silicon subassembly includes a silicon substrate with a pyramidal cavity etched into the substrate near its edge. A ball lens is precision-mounted in the pyramidal cavity by bonding it at multiple points. This provides a high-strength connection and a small, inexpensive silicon substrate. Also provided on the silicon substrate is a semiconductor luminescence element and a slit on the opposite side of the ball lens. The slit enables collimated light emitted from the ball lens to be optically coupled without being blocked or reflected by the substrate. The semiconductor luminescence element and its laser driver IC are placed in close proximity to each other, and ribbon wires are kept short (approximately 300 &mgr;m) to reduce signal line impedance mismatch for high-speed transmission.

Optical module and optical transceiver

An optical semiconductor array module comprising an optical semiconductor array device constituted by a plurality of semiconductor laser diode, light-emitting diode elements or a plurality of semiconductor photo diode elements, an electronic device for driving and controlling the optical semiconductor array device, a cube-shaped package case for housing the optical semiconductor array device and the electronic device therein, an optical fiber array optically coupled to the optical semiconductor array device, a supporting member for holding and fixing the optical fiber array to one surface of the cube-shaped package case, and a terminal portion having a plurality of pins for electrically connecting an external circuit board to the electronic device. The terminal portion is formed by extending the terminal portion from at least one of surfaces forming the package case, excluding a surface on which the optical semiconductor array device and the electronic device are mounted and a surface opposite to that surface, and the plurality of pins are mounted in a surface of the terminal portion which crosses at right angles with a surface from which the optical fiber array is taken out, whereby the electronic device is mounted on the external circuit board through the plurality of pins and is electrically connected to the external circuit board.

Optical semiconductor array module, method of fabricating the module,

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Yokohama, Japan

Koichiro Tonehira