Jx Nippon Mining & Metals Corporation

Jx Advanced Metals Corporation

Koichiro Tanaka

Kazuki Kammuri

Kenji Sato

Misato Chuganji

Provided is an electromagnetic wave shielding material that can exhibit improved electromagnetic wave shielding property, light-weight property and formability. The present invention relates to an electromagnetic wave shielding material comprising a laminate in which N number of metal foils each having a thickness of 5 to 100 &#x3bc;m and N+1 number of resin layers each having a thickness of 5 &#x3bc;m or more are alternately laminated or a laminate in which N+1 number of metal foils each having a thickness of 5 to 100 &#x3bc;m and N number of resin layers each having a thickness of 5 &#x3bc;m or more are alternately laminated, N being an integer of 2 or more, wherein thickness of the laminate is from 100 to 500 &#x3bc;m, and wherein, when a thickness center of the laminate is used as a reference, for all pairs of interfaces at which sequences of the resin layers and the metal foils on both upper and lower sides of the reference correspond to each other, distances from the reference to the interfaces have an error of within &#xb1;10%.

Electromagnetic wave shielding material

Provided is a laminated body of at least one metal foil and resin layers, which is suitable for drawing. The laminated body includes at least one metal foil and at least two resin layers. The laminated body has a thickness of 25 to 500 &#x3bc;m. In the laminated body, both surfaces of each metal foil are closely laminated to the resin layers, and the relationships: 60&#x2264;&#x3c3;Y&#x2264;150, and 1.4&#x2264;&#x3c3;b/&#x3c3;Y are satisfied, in which &#x3c3;Y represents a nominal stress (MPa) at a nominal strain of 5% when a tensile test according to JIS K 7127: 1999 is performed on the laminated body, and &#x3c3;b represents a nominal stress (MPa) at a nominal strain at which the metal foil in the laminated body is broken when a tensile test according to JIS K 7127: 1999 is performed on the laminated body.

Laminated body and method of producing shaped article

Provided is an electromagnetic shielding material that has good magnetic field shielding properties against a low-frequency electromagnetic field of 1 MHz or less, lightweight and also excellent formability. The electromagnetic shielding material has a structure in which at least two metal foils are closely laminated via at least one resin layer, wherein at least one resin forming the at least one resin layer has no yield point at 150&#xb0; C.; wherein all of combinations of the at least two metal foils and the at least one resin layer forming the electromagnetic shielding material satisfy the following equation (A):&#x3c3;&#x2265;3&#xd7;10,&#x2003;&#x2003;Equation (A): 

A metal foil for electromagnetic shielding, comprising: a metal foil base having a thickness of exceeding 4 &#x3bc;m, an alloy layer having an A element configured of Sn or In and a B element group selected from the group consisting of one or more of Ag, Ni, Fe and Co formed on one or both surfaces of the base, and an underlayer having the B element group formed between the alloy layer and the base, wherein an adhesion amount of the A element is 10 to 300 &#x3bc;mol/dm, and a total adhesion amount of the B element group is 40 to 900 &#x3bc;mol/dm.

Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable

Provided is an electromagnetic wave shielding material including a multilayer structure in which at least one metal foil and at least two resin layers are closely laminated, wherein both surfaces of each metal foil are closely laminated to the resin layers; wherein each metal foil satisfies the following relationship with each of the two resin layers adjacent to the metal foil: 0.02&#x2264;V/V&#x2264;1.2, in which: Vis a volume fraction of the metal foil relative to a total volume of the metal foil and the resin layer; Vis (&#x3c3;&#x2212;&#x3c3;)/(&#x3c3;+&#x3c3;&#x2212;&#x3c3;); &#x3c3;is a true stress (MPa) of the metal foil at breakage when a tensile stress is applied to the metal foil; &#x3c3;is a true stress (MPa) of the resin layer at breakage when a tensile stress is applied to the resin layer; and &#x3c3;is a true stress (MPa) of the resin layer when a logarithmic strain same as a logarithmic strain at breakage of the metal foil is applied to the resin layer.

Electromagnetic shielding material

Provided is an electromagnetic shielding material having improved electromagnetic shielding properties, light weight properties and formability. The present invention relates to an electromagnetic shielding material having a structure in which at least three metal foils are laminated via insulating layers, wherein all of combinations of the metal foils and the insulating layers making up the electromagnetic shielding material satisfy the equation: &#x3c3;&#xd7;d&#xd7;d&#x2265;3&#xd7;10,

Provided is an electromagnetic shielding material having improved electromagnetic shielding properties. The present invention relates to an electromagnetic shielding material having a structure in which at least two metal foils are laminated via at least one insulating layer, the electromagnetic shielding material comprising at least one metal oxide layer on at least one boundary surface over which each metal foil is in contact with the insulating layer, the metal oxide layer having a thickness of from 1 to 30 nm.

A metal foil for electromagnetic shielding, comprising a baseconsisting of a metal foil, an underlayerincluding Ni formed on one or both surfaces of the base, and a Sn&#x2014;Ni alloy layerformed on a surface of the underlayer, wherein the Sn&#x2014;Ni alloy layer includes 20 to 80 weight % of Sn, and when a total deposition amount of Sn is represented by T[&#x3bc;g/dm], a percentage of Sn in the Sn&#x2014;Ni alloy is represented by A[weight %], a total deposition amount of Ni is represented by T[&#x3bc;g/dm], and a percentage of Ni in the Sn&#x2014;Ni alloy is represented by A[weight %], T: 500 to 91000 &#x3bc;g/dm, T: 2200 to 236000 &#x3bc;g/dm, 170000=&#x3e;{T&#x2212;T&#xd7;(A/A)}=&#x3e;1700.

Metal foil for electromagnetic shielding, electromagnetic shielding material and shielded cable

A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f&#xd7;t)/(f&#xd7;t)=&#x3e;1 wherein t(mm) is a thickness of the copper foil, f(MPa) is a stress of the copper foil under tensile strain of 4%, t(mm) is a thickness of the resin layer, f(MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1&#x3c;=33f/(F&#xd7;T) wherein f(N/mm) is 180&#xb0; peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Sn layer having a thickness of 0.2 to 3.0 &#x3bc;m is formed on a surface of the copper foil on which the resin layer is not laminated.

Copper foil composite, formed product and method of producing the same

A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f&#xd7;t)/(f&#xd7;t)=&#x3e;1 wherein t(mm) is a thickness of the copper foil, f(MPa) is a stress of the copper foil under tensile strain of 4%, t(mm) is a thickness of the resin layer, f(MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1&#x3c;=33f/(F&#xd7;T) wherein f(N/mm) is 180&#xb0; peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Cr oxide layer is formed at an coating amount of 5 to 100 &#x3bc;g/dm. is formed on a surface of the copper foil on which the resin layer is not laminated.

A metal foil for electromagnetic shielding, comprising: a metal foil base, an Sn&#x2014;Ni alloy layer formed on one or both surfaces of the base, and an oxide layer formed on a surface of the Sn&#x2014;Ni alloy layer, wherein the Sn&#x2014;Ni alloy layer includes 20 to 80% by mass of Sn and has a thickness of 30 to 500 nm, and wherein when an analysis in a depth direction is carried out by an XPS being the depth from an outermost surface as X nm, and an atomic percentage (%) of Sn is represented by A(X), an atomic percentage (%) of Ni is represented by A(X), an atomic percentage (%) of oxygen is represented by A(X), and X is defined to be Xwhen A(X)=0, 30 nm=&#x3e;X=&#x3e;0.5 nm, and 0.4=&#x3e;&#x222b;A(X)dx/&#x222b;A(X)dx=&#x3e;0.05 in a section [0, X] is satisfied.

Provided is a copper foil for a printed wiring board, the copper foil being suitable for achieving finer pitch, favorable in terms of manufacturing cost, and excellent both in etching ability and adhesion to an insulating substrate. The copper foil for a printed wiring board comprises a copper foil base material and a covering layer for covering at least a portion of a surface of the copper foil base material, wherein the covering layer is formed by an nickel-vanadium alloy layer containing nickel and vanadium, and a chromium layer, laminated in this order from the surface of the copper foil base material; the chromium layer contains chromium in an amount of 15-210 &#x3bc;g/dm; the nickel-vanadium alloy layer contains nickel and vanadium in a combined covering amount of 20-600 &#x3bc;g/dm; and the nickel-vanadium alloy layer contains vanadium in an amount of 3-70 wt %.

Growing community of inventors

Ibaraki, Japan

Koichiro Tanaka