Showa Denko K.k.

Koichiro Take

Yuichi Furukawa

Shigeharu Ichiyanagi

Etsuo Shinmura

A refrigeration system including a two-stage type compressor having independent low-pressure and high-pressure compressing portions, a heat-releasing device having independent primary and secondary heat-releasing paths, an expansion valve and a cooler. The refrigerant primarily compressed by the low-pressure compressing portion is primarily released in heat by the primary heat-releasing path. The primarily heat-released refrigerant is secondarily compressed by the high-pressure compressing portion. The secondarily compressed refrigerant is secondarily released in heat by the secondary heat-releasing path to thereby obtain a low-temperature and high-pressure refrigerant. The low-temperature and high-pressure refrigerant is decompressed and expanded by an expansion valve and passes through the cooler to absorb the heat in a room air, and then returns to the low-pressure compressing portion of the compressor. In this system, the refrigerant temperature during the heat-releasing procedure can be kept low.

Refrigeration system, compressing and heat-releasing apparatus and heat-releasing device

In an electrolytic capacitorin which a capacitor elementis enclosed in an external casing, a heat conductive materialhaving heat conductivity of 1 W/m&#xb7;K or more is disposed between the external casingand the capacitor elementso as to be in contact with them. Alternatively, in an electrolytic capacitorin which a capacitor elementis enclosed in an external casingmade of aluminum, an external peripheral surface of the external casingis covered with an insulation film

Electrolytic capacitor

An upper header tank of an evaporator is formed by three plates. The outside plate has an inflow-side refrigerant-passage outwardly bulging portion whose one end portion communicates with a refrigerant inlet. The inside plate has tube insertion holes. The intermediate plate has communication holes for establishing communication between the tube insertion holes of the inside plate and the outwardly bulging portion of the outside plate. The communication holes of the intermediate plate are connected by communication portions so as to form a resin passage communicating with the outwardly bulging portion. Of all the communication portions of the refrigerant passage, a plurality of upstream communication portions are smaller in width than the remaining communication portions. The relation 0.25&#x2266;A/B&#x2266;0.35 is satisfied, where A represents the number of the narrow communication portions, and B represents the total number of the communication holes which form the refrigerant passage.

Heat exchanger

A heat exchanging tube is provided with a flat tube main body having a predetermined length and a plurality of refrigerant passages extending in a tube longitudinal direction and arranged in a tube widthwise direction. The following relational equations (a) to (c) are satisfied: W=6 to 18 mm . . . (a); Ac/At&#xd7;100=50 to 70% . . . (b) and P/L&#xd7;100=350 to 450% . . . (c), where 'W' is a width of the tube main body, 'Ac' is a total cross-sectional area of the refrigerant passages, &#x201c;At&#x201d; is a total cross-sectional area of the tube main body ( including the refrigerant passages), &#x201c;L&#x201d; is an external perimeter of the tube main body and &#x201c;P&#x201d; is a total inner perimeter of the refrigerant passages. With this tube, enough pressure strength can be obtained and the passage resistance can be decreased while keeping the light weight, and further the heat exchanging performance can be improved.

Heat exchanging tube and heat exchanger

The invention provides an ebullition cooling devicefor a heat generating component B which device comprises a boiling unitfor boiling a refrigerant A contained therein with the heat generated by the heat generating component B as attached to an outer surface of the unit, a condensing unitdisposed above the boiling unitfor condensing a refrigerant vapor Aflowing thereinto from the boiling unitby heat exchange with an external fluid C, and a communication pipeinterconnecting the unitsand having a refrigerant vapor channeland a refrigerant condensate channeltherein. The cooling devicecan be designed with greater freedom, and is therefore fully useful for electronic devices which are compacted or higher in complexity, smaller in the amount of refrigerant to be enclosed therein and outstanding in heat dissipating performance.

Growing community of inventors

Oyama, Japan

Koichiro Take