Sony Group Corporation

Asahi Kasei E-materials Corporation

Koichiro Shimoda

Masaki Yamamoto

Masaaki Nagata

Michael Siegfried Spranger

Ryota Ando

Nobuo Sato

Yasuhito Iizuka

Katsuyoshi Kanemoto

Akihito Kumakura

Jin Nakayama

Kojiro Kashiwa

Hiroaki Adachi

Shuji Kashiwagi

Ippei Murofushi

Yoro Sasaki

Yoshinori Akisawa

Provided are an information processing apparatus and an information processing method capable of supporting work of giving a classification to a group of sentences. The information processing apparatus includes a presentation unit that presents a sentence included in a cluster of interest among clusters generated by clustering a sentence set in a sentence selection region, and a reception unit that receives selection of the sentence constituting a group of sentences from the sentences presented in the sentence selection region.

Classification of sentences from clusters of interest

A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate in 3 mass % aqueous sodium hydroxide at 45&#xb0; C. is 0.95 or more after a heat history of 90&#xb0; C. for 10 minutes with the solution rate before the heat history assumed to be 1, (b) the solution rate in 3 mass % aqueous sodium hydroxide at 45&#xb0; C. ranges from 0.001 &#x3bc;m/sec to 0.02 &#x3bc;m/sec after the heat history of 180&#xb0; C. for 60 minutes, (c) a bleed-out amount is 50 mg/mor less in storing at 40&#xb0; C. for 2 weeks after the heat history of 180&#xb0; C. for 60 minutes, and (d) a thermogravimetric decrease at 260&#xb0; C. is 2.0% or less in measuring on a temperature rising condition of 10&#xb0; C./min from 40&#xb0; C. by thermogravimetric analysis (TG). When a multilayer flexible wiring board is manufactured using the resin composition, it is possible to obtain the resin layer excellent in alkali processability, embeddability in press, heat resistance, bendability, insulation reliability, and adhesion to the conductive layer.

Resin composition, layered product, multilayer printed wiring board, multilayer flexible wiring board and manufacturing method of the same

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Tokyo, Japan

Koichiro Shimoda