Hitachi, Ltd.

Hitachi Vlsi Engineering Corp.

Koichiro Sekiguchi

Takashi Nakao

Kanji Otsuka

Ikuo Yoshida

Akiomi Kohno

Masaya Horino

Hideaki Kamohara

Hiroshi Akasaki

Kunizo Sahara

Yoshiaki Emoto

Masayuki Iketani

Shouichi Irie

A technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, more particularly pertains to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam, and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.

Method of bonding metals, and method and apparatus for producing

An invention relating to a technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, and more particularly pertaining to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.

Growing community of inventors

Tokyo, Japan

Koichiro Sekiguchi