Honda Motor Co., Ltd.

Koichiro Sato

Hodaka Tsuge

Tadaaki Yamada

Satoshi Hasegawa

Takashi Kato

Hiroyuki Yamagishi

Hitoshi Saito

Shigeto Akahori

Shinyu Hirayama

Toshihide Tanaka

Shinichi Yataka

Kenji Kitamura

Yoko Yamaji

Takao Endo

Machie Saitou

Yuujiro Tominaga

A method of activating a fuel cell includes an energizing step. In the energizing step, a hydrogen gas as an anode gas is supplied to an anode, and an inert gas as a cathode gas is supplied to a cathode to produce a potential difference between the anode and the cathode. In this state, current is applied between the anode and the cathode.

Method of and apparatus for activating fuel cell

In an electric potential difference forming step of a method of inspecting output of a fuel cell, a hydrogen gas as an anode gas is supplied to an anode, and an inert gas as a cathode gas is supplied to the cathode to generate an electric potential difference between the anode and the cathode. In a maintaining step, measurement current which is smaller than rated current of the fuel cell is applied to the anode and the cathode, and the voltage between the anode and the cathode is maintained at less than the reduction potential of the electrode catalyst. In a measurement step, in the state where the measurement current is applied to the anode and the cathode, and voltage between the anode and the cathode is maintained, the cathode gas is changed to a mixed gas, and then, output of the fuel cell is measured.

Method of inspecting output of fuel cell

Provided are a current application device capable of improving the electrical contact between projections of a contact section and a surface electrode when applying a test current to a semiconductor element, and a method of manufacturing a semiconductor element properly tested by using the current application device. The current application device includes a contact section that has a plurality of projections, which are brought into contact with a surface electrode of a semiconductor element to apply a test current, and a pressing section that presses the contact section against the semiconductor element such that the projections penetrate a film to come in contact with the surface electrode. The contact section has a plurality of the projections on a plane that has been formed in a curved shape, and the curved-shaped plane is deformed into a planar shape by being pressed by the pressing section.

Current application device and manufacturing method of semiconductor element

A semiconductor module includes: a semiconductor element () having a working unit () and a guard ring unit (); and heat radiation members () arranged on an upper surface and a lower surface of the semiconductor element for cooling the semiconductor element. A passivation film () covers the guard ring but does not cover the working unit. The upper heat radiation member () is made of a flat metal plate connected to the working unit without contact with the passivation film. The upper heat radiation member is connected to the lower heat radiation member () in the thermo-conducting way.

Semiconductor device module structure

Growing community of inventors

Tochigi-ken, Japan

Koichiro Sato